An Analytical Model for Step Height Reduction in CMP with Different Pattern Densities

2007 ◽  
Vol 154 (7) ◽  
pp. H596 ◽  
Author(s):  
Lixiao Wu ◽  
Changfeng Yan
Keyword(s):  
Analytical Model ◽  
Step Height ◽  
Height Reduction

Effect of TT-LYK as the Inhibitor on Step Height Reduction for Copper CMP

2019 ◽  
Author(s):  
Jiakai Zhou ◽  
Xinhuan Niu ◽  
Jianchao Wang ◽  
Kai Zhang ◽  
Yaqi Cui ◽  
...  
Keyword(s):  
Step Height ◽  
Height Reduction ◽  
Copper Cmp

An Analytical Dishing and Step Height Reduction Model for Chemical Mechanical Planarization (CMP)

2002 ◽  
Author(s):  
Guanghui Fu ◽  
Abhijit Chandra
Keyword(s):  
Chemical Mechanical Planarization ◽  
Design Tool ◽  
Step Height ◽  
Wafer Surface ◽  
Surface Geometry ◽  
Height Reduction ◽  
Proposed Model ◽  
Model Predictions ◽  
Feature Scale ◽  
Good Agreement

An analytical model for dishing and step height reduction in chemical mechanical planarization (CMP) of copper is presented. The model is based on the assumption that at the feature scale, high areas on the wafer experience higher pressure than low areas. The slurry is assumed to be Prestonian. The model delineates how dishing and step height reduction depend on slurry properties (selectivity and Preston’s constants), pad characteristics (stiffness and bending ability), polishing conditions (pressure, relative velocity and overpolishing) and wafer surface geometry (linewidth, pitch and pattern density). Model predictions are in good agreement with existing experimental observations. The present model facilitates understanding of the CMP process at the feature scale. Based on the proposed model, design avenues for decreasing dishing and increasing the speed of step height reduction may be explored through modification of appropriate parameters for slurry, pad and polishing conditions. The proposed model may also be used as a design tool for pattern layout to optimize the performance of the CMP process.

On the Pattern Dependency and Substrate Effects During Chemical-Mechanical Planarization for Ulsi Manufacturing

1999 ◽  
Vol 566 ◽  
Author(s):  
Wei-Tsu Tseng ◽  
James Jong-Lin Niu ◽  
Chi-Fa Lin
Keyword(s):  
Chemical Mechanical Planarization ◽  
Reduction Rate ◽  
Surface Profile ◽  
Step Height ◽  
Substrate Effects ◽  
Height Reduction ◽  
Pattern Density

The change of surface profile during chemical-mechanical planarization (CMP) is monitored continuously in this study. The influences from pattemn dependency and substrate effects are discussed. Step height reduction rate is a function of pattern density and down force. The rate decreases with time until planarization is achieved. As the polish approaches the patterns underneath, the interaction between substrate effects and pattern dependency results in the resurgence of step height. The implication of this newly found phenomenon is discussed.

Determination of the Planarization Distance for Copper CMP Process

1999 ◽  
Vol 566 ◽  
Author(s):  
S Hymes ◽  
K. Smekalin ◽  
T. Brown ◽  
H. Yeung ◽  
M. Joffe ◽  
...  
Keyword(s):  
Reduction Ratio ◽  
Step Height ◽  
Measurement Tool ◽  
Process Conditions ◽  
Height Reduction ◽  
Pattern Dependencies ◽  
Copper Cmp

A planarization monitor has been applied to the copper system to investigate pattern dependencies during copper overburden planarization. Conventional profilometry and a noncontact, acousto-optic measurement tool, the Insite 300, are utilized to quantify the planarization performance in terms of the defined step-height-reduction-ratio (SHRR). Illustrative results as a function of slurry, pad type and process conditions are presented. For a typical stiff-pad copper CMP process, we determined the planarization distance to be approximately 2mm.

Synergistic Effect of Glycine and BTA on Step Height Reduction Efficiency after Copper CMP in Weakly Alkaline Slurry

2016 ◽  
Vol 6 (1) ◽  
pp. P1-P6 ◽  
Author(s):  
Chenqi Yan ◽  
Yuling Liu ◽  
Jin Zhang ◽  
Chenwei Wang ◽  
Wenxia Zhang ◽  
...  
Keyword(s):  
Synergistic Effect ◽  
Step Height ◽  
Weakly Alkaline ◽  
Height Reduction ◽  
Reduction Efficiency ◽  
Copper Cmp
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