Chemical Vapor Deposition of Epitaxial Silicon from Silane at Low Temperatures: I . Very Low Pressure Deposition

1989 ◽  
Vol 136 (8) ◽  
pp. 2386-2398 ◽  
Author(s):  
James H. Comfort ◽  
Rafael Reif
Keyword(s):  
Chemical Vapor Deposition ◽  
Vapor Deposition ◽  
Low Temperatures ◽  
Chemical Vapor ◽  
Low Pressure ◽  
Epitaxial Silicon

Rapid Thermal Low Pressure Metalorganic Chemical Vapor Deposition of InP and Related Materials

1993 ◽  
Vol 300 ◽  
Author(s):  
A. Katz ◽  
A. Feingold
Keyword(s):  
Chemical Vapor Deposition ◽  
Vapor Deposition ◽  
Low Temperatures ◽  
Metalorganic Chemical Vapor Deposition ◽  
Film Growth ◽  
Chemical Vapor ◽  
Hole Mobility ◽  
Low Pressure ◽  
Growth Conditions ◽  
Metalorganic Chemical

ABSTRACTHigh quality InP and In0.53Ga0.67As undoped and Zn-doped layers were grown by means of rapid thermal low pressure metalorganic chemical vapor deposition (RTLPMOCVD) technique, using tertiarybutylphosphine (TBP) and tertiarybutylarsine (TBA), as the phosphorus and arsenic sources. The InP films were grown at a P:In ratios of about 75 and the InGaAs films were grown at a As:In ration of about 2, low temperatures at the range of 450-550°C, pressures it the range of 1-4 tons, and growth rates of 2-3 nm/sec. All the film growth conditions were optimized to yield defect-free layers with featureless morphology, which reflected at a minimum backscattering yield (Xmin) as low as 3.1% for the InP and 3.6% for the InGaAs. These films presented a good electrical properties, as well, with hole mobility of 4200 cm2/Vs for the undoped-InP layers and 75 cm2/Vs for the undoped-InGaAs layers.

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