Selective Electroless Metal Deposition for Via Hole Filling in VLSI Multilevel Interconnection Structures

1989 ◽  
Vol 136 (2) ◽  
pp. 462-466 ◽  
Author(s):  
C. H. Ting ◽  
M. Paunovic ◽  
P. L. Pai ◽  
G. Chiu
Keyword(s):  
Metal Deposition ◽  
Hole Filling ◽  
Via Hole

Selective Ge CVD as a Via Hole Filling Method and Self-Aligned Impurity Diffusion Microsource in Si Processing

1989 ◽  
Vol 28 (Part 2, No. 11) ◽  
pp. 2054-2056 ◽  
Author(s):  
Min-Lin Cheng ◽  
Armin Kohlhase ◽  
Taketoshi Sato ◽  
Shin-ichi Kobayashi ◽  
Junichi Murota ◽  
...  
Keyword(s):  
Impurity Diffusion ◽  
Hole Filling ◽  
Filling Method ◽  
Via Hole

scholarly journals Cu Through-Via Formation using Open Via-hole Filling with Electrodeposition

2014 ◽  
Vol 21 (4) ◽  
pp. 117-123
Author(s):  
Jae-Hwan Kim ◽  
Dae-Woong Park ◽  
Min-Young Kim ◽  
Tae Sung Oh
Keyword(s):  
Hole Filling ◽  
Via Hole

Selective Ge CVD as a Via Hole Filling Method and Self-Aligned Impurity Diffusion Microsource in Si Processing

1989 ◽  
Author(s):  
Min-Lin CHENG ◽  
Armin KOHLHASE ◽  
Taketoshi SATO ◽  
Shin-ichi KOBAYASHI ◽  
Junichi MUROTA ◽  
...  
Keyword(s):  
Impurity Diffusion ◽  
Hole Filling ◽  
Filling Method ◽  
Via Hole

High-speed via hole filling using electrophoresis of Ag nanoparticles

2015 ◽  
Author(s):  
Ryo Takigawa ◽  
Kohei Nitta ◽  
Akihiro Ikeda ◽  
Mitsuaki Kumazawa ◽  
Toshiharu Hirai ◽  
...  
Keyword(s):  
Ag Nanoparticles ◽  
High Speed ◽  
Hole Filling ◽  
Via Hole
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