Electrochemical Dissolution of Ta and TaN Diffusion Barrier Materials

2005 ◽  
Vol 8 (10) ◽  
pp. G283 ◽  
Author(s):  
Bing Du ◽  
Ian Ivar Suni
Keyword(s):  
Diffusion Barrier ◽  
Electrochemical Dissolution ◽  
Barrier Materials

Effect of tungsten incorporation in cobalt tungsten alloys as seedless diffusion barrier materials

2017 ◽  
Vol 171 ◽  
pp. 25-30 ◽  
Author(s):  
Yin-Hsien Su ◽  
Tai-Chen Kuo ◽  
Wen-Hsi Lee ◽  
Yu-Sheng Wang ◽  
Chi-Cheng Hung ◽  
...  
Keyword(s):  
Diffusion Barrier ◽  
Tungsten Alloys ◽  
Barrier Materials

Evaluation of Sputtered Tungsten as Diffusion Barrier Materials for Copper

1997 ◽  
Vol 143-147 ◽  
pp. 1285-1290 ◽  
Author(s):  
M. Mercier ◽  
S. Weber ◽  
Alain Jacques ◽  
H. Hirabayashi ◽  
H. Ohkawa ◽  
...  
Keyword(s):  
Diffusion Barrier ◽  
Barrier Materials

CHEMISTRY IN MOLECULAR APPROACHES TO MICROELECTRONIC DIFFUSION BARRIER MATERIALS

2002 ◽  
Author(s):  
XIAOZHAN LIU ◽  
HU CAI ◽  
ZHONGZHI WU ◽  
YIHUI YANG ◽  
TIANNIU CHEN ◽  
...  
Keyword(s):  
Diffusion Barrier ◽  
Barrier Materials ◽  
Molecular Approaches

A high-throughput strategy to screen interfacial diffusion barrier materials for thermoelectric modules

2019 ◽  
Vol 34 (07) ◽  
pp. 1179-1187 ◽  
Author(s):  
Ming Gu ◽  
Shengqiang Bai ◽  
Jiehua Wu ◽  
Jincheng Liao ◽  
Xugui Xia ◽  
...  
Keyword(s):  
High Throughput ◽  
Diffusion Barrier ◽  
Interfacial Diffusion ◽  
Thermoelectric Modules ◽  
Barrier Materials ◽  
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Abstract

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