A high-throughput strategy to screen interfacial diffusion barrier materials for thermoelectric modules

2019 ◽  
Vol 34 (07) ◽  
pp. 1179-1187 ◽  
Author(s):  
Ming Gu ◽  
Shengqiang Bai ◽  
Jiehua Wu ◽  
Jincheng Liao ◽  
Xugui Xia ◽  
...  
Keyword(s):  
High Throughput ◽  
Diffusion Barrier ◽  
Interfacial Diffusion ◽  
Thermoelectric Modules ◽  
Barrier Materials ◽  
Image Position

Abstract

Effect of tungsten incorporation in cobalt tungsten alloys as seedless diffusion barrier materials

2017 ◽  
Vol 171 ◽  
pp. 25-30 ◽  
Author(s):  
Yin-Hsien Su ◽  
Tai-Chen Kuo ◽  
Wen-Hsi Lee ◽  
Yu-Sheng Wang ◽  
Chi-Cheng Hung ◽  
...  
Keyword(s):  
Diffusion Barrier ◽  
Tungsten Alloys ◽  
Barrier Materials

Effect of the Electroless Nickel, Electroless Palladium, and Immersion Gold Multilayer as a Diffusion Barrier on the Bonding Strength of BiTe-Based Thermoelectric Modules

2021 ◽  
Vol 21 (8) ◽  
pp. 4498-4502
Author(s):  
Yen Ngoc Nguyen ◽  
Khanh Quoc Dang ◽  
Injoon Son
Keyword(s):  
Intermetallic Compounds ◽  
Electrochemical Deposition ◽  
Barrier Layer ◽  
Diffusion Barrier ◽  
Bonding Strength ◽  
Effective Diffusion ◽  
Electroless Nickel ◽  
Thermoelectric Modules ◽  
Diffusion Barrier Layer ◽  
Plating Layer

An effective diffusion barrier layer was coated onto the surface of BiTe-based materials to avoid the formation of brittle intermetallic compounds (IMCs) by the diffusion of the constituents of Sn-based solder alloys into the BiTe-based alloys. In this study, the electrochemical deposition of multi-layers, i.e., electroless nickel/electroless palladium/immersion gold (ENEPIG) was explored to enhance the bonding strength of BiTe materials with Cu electrodes. The thermoelectric modules with the ENEPIG plating layer exhibited high bonding strengths of 8.96 MPa and 7.28 MPa for the n- and p-type, respectively that increased slightly to 9.26 MPa and 7.76 MPa, respectively after the thermoelectric modules were heated at 200 °C for 200 h. These bonding strengths were significantly higher than that of the thermoelectric modules without a plating layer.

scholarly journals Titanium-based thin film metallic glass as diffusion barrier layer for PbTe-based thermoelectric modules

APL Materials ◽  
2019 ◽  
Vol 7 (1) ◽  
pp. 013001 ◽  
Author(s):  
Chia-Chi Yu ◽  
Hsin-jay Wu ◽  
Matthias T. Agne ◽  
Ian T. Witting ◽  
Ping-Yuan Deng ◽  
...  
Keyword(s):  
Thin Film ◽  
Metallic Glass ◽  
Barrier Layer ◽  
Diffusion Barrier ◽  
Thermoelectric Modules ◽  
Diffusion Barrier Layer

Evaluation of Sputtered Tungsten as Diffusion Barrier Materials for Copper

1997 ◽  
Vol 143-147 ◽  
pp. 1285-1290 ◽  
Author(s):  
M. Mercier ◽  
S. Weber ◽  
Alain Jacques ◽  
H. Hirabayashi ◽  
H. Ohkawa ◽  
...  
Keyword(s):  
Diffusion Barrier ◽  
Barrier Materials

Design of diffusion barrier and buffer layers for β-Zn4Sb3 mid-temperature thermoelectric modules

2018 ◽  
Vol 762 ◽  
pp. 631-636 ◽  
Author(s):  
Li-Wei Chen ◽  
Cheng Wang ◽  
Yi-Chia Liao ◽  
Chia-Lin Li ◽  
Tung-Han Chuang ◽  
...  
Keyword(s):  
Diffusion Barrier ◽  
Buffer Layers ◽  
Thermoelectric Modules

Low temperature thermal ALD of a SiNx interfacial diffusion barrier and interface passivation layer on SixGe1− x(001) and SixGe1− x(110)

2017 ◽  
Vol 146 (5) ◽  
pp. 052820 ◽  
Author(s):  
Mary Edmonds ◽  
Kasra Sardashti ◽  
Steven Wolf ◽  
Evgueni Chagarov ◽  
Max Clemons ◽  
...  
Keyword(s):  
Low Temperature ◽  
Diffusion Barrier ◽  
Passivation Layer ◽  
Interfacial Diffusion ◽  
Interface Passivation

High Throughput Determination of Creep Parameters Using Cantilever Bending: Part I - Steady-State

2020 ◽  
Vol 35 (4) ◽  
pp. 353-361 ◽  
Author(s):  
Syed Idrees Afzal Jalali ◽  
Praveen Kumar ◽  
Vikram Jayaram
Keyword(s):  
Steady State ◽  
High Throughput ◽  
Cantilever Bending ◽  
Image Position

Abstract

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