Atomic Layer Deposition of W[sub 1.5]N Barrier Films for Cu Metallization

2005 ◽  
Vol 152 (7) ◽  
pp. G522 ◽  
Author(s):  
S. Bystrova ◽  
A. A. I. Aarnink ◽  
J. Holleman ◽  
R. A. M. Wolters
Keyword(s):  
Atomic Layer Deposition ◽  
Atomic Layer ◽  
Barrier Films ◽  
Cu Metallization ◽  
Layer Deposition

Bio-based multilayer barrier films by extrusion, dispersion coating and atomic layer deposition

2015 ◽  
Vol 133 (2) ◽  
pp. n/a-n/a ◽  
Author(s):  
Jari Vartiainen ◽  
Yingfeng Shen ◽  
Timo Kaljunen ◽  
Tero Malm ◽  
Mika Vähä-Nissi ◽  
...  
Keyword(s):  
Atomic Layer Deposition ◽  
Atomic Layer ◽  
Barrier Films ◽  
Layer Deposition ◽  
Multilayer Barrier

Highly-impermeable Al2O3/HfO2 moisture barrier films grown by low-temperature plasma-enhanced atomic layer deposition

2017 ◽  
Vol 50 ◽  
pp. 296-303 ◽  
Author(s):  
Lae Ho Kim ◽  
Jin Hyuk Jang ◽  
Yong Jin Jeong ◽  
Kyunghun Kim ◽  
Yonghwa Baek ◽  
...  
Keyword(s):  
Low Temperature ◽  
Atomic Layer Deposition ◽  
Atomic Layer ◽  
Low Temperature Plasma ◽  
Temperature Plasma ◽  
Moisture Barrier ◽  
Barrier Films ◽  
Layer Deposition

TaC x Thin Films Prepared by Atomic Layer Deposition as Diffusion Barriers for Cu Metallization

2013 ◽  
Vol 97 (1) ◽  
pp. 127-134 ◽  
Author(s):  
Tae Eun Hong ◽  
Tae-Ho Kim ◽  
Jae-Hun Jung ◽  
Soo-Hyun Kim ◽  
Hoon Kim
Keyword(s):  
Thin Films ◽  
Atomic Layer Deposition ◽  
Atomic Layer ◽  
Diffusion Barriers ◽  
Cu Metallization ◽  
Layer Deposition

Highly Conformal Amorphous W–Si–N Thin Films by Plasma-Enhanced Atomic Layer Deposition as a Diffusion Barrier for Cu Metallization

2015 ◽  
Vol 119 (3) ◽  
pp. 1548-1556 ◽  
Author(s):  
Tae Eun Hong ◽  
Jae-Hun Jung ◽  
Seungmin Yeo ◽  
Taehoon Cheon ◽  
So Ik Bae ◽  
...  
Keyword(s):  
Thin Films ◽  
Atomic Layer Deposition ◽  
Diffusion Barrier ◽  
Atomic Layer ◽  
Cu Metallization ◽  
Layer Deposition
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