TaC
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Thin Films Prepared by Atomic Layer Deposition as Diffusion Barriers for Cu Metallization
2013 ◽
Vol 97
(1)
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pp. 127-134
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2010 ◽
Vol 87
(3)
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pp. 373-378
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2015 ◽
Vol 119
(3)
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pp. 1548-1556
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Keyword(s):
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2015 ◽
Vol 764-765
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pp. 138-142
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