Tantalum Nitride Films Grown by Inorganic Low Temperature Thermal Chemical Vapor Deposition Diffusion Barrier Properties in Copper Metallization
1999 ◽
Vol 146
(1)
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pp. 170-176
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1999 ◽
Vol 17
(3)
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pp. 1101
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1999 ◽
Vol 14
(5)
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pp. 2043-2052
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1999 ◽
Vol 17
(1)
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pp. 182
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1999 ◽
Vol 17
(5)
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pp. 2193
2002 ◽
Vol 361
(3-4)
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pp. 189-195
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2006 ◽
Vol 45
(6A)
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pp. 5329-5331
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2011 ◽
Vol 65
(7)
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pp. 1127-1130
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2006 ◽
Vol 15
(9)
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pp. 1261-1265
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2000 ◽
Vol 147
(12)
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pp. 4652
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2000 ◽
Vol 327
(5-6)
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pp. 277-283
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