Erratum: “Low temperature metalorganic chemical vapor deposition of tungsten nitride as diffusion barrier for copper metallization” [J. Vac. Sci. Technol. B 17, 1101 (1999)]

Author(s):  
Jean E. Kelsey ◽  
Cindy Goldberg ◽  
Guilleromo Nuesca ◽  
Gregory Peterson ◽  
Alain E. Kaloyeros ◽  
...  
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