Erratum: “Low temperature metalorganic chemical vapor deposition of tungsten nitride as diffusion barrier for copper metallization” [J. Vac. Sci. Technol. B 17, 1101 (1999)]
1999 ◽
Vol 17
(5)
◽
pp. 2193
1999 ◽
Vol 17
(3)
◽
pp. 1101
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1990 ◽
pp. 217-222
1989 ◽
Vol 24
(2)
◽
pp. 213-219
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1998 ◽
Vol 21
(1-4)
◽
pp. 355-366
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