Low temperature metal-organic chemical vapor deposition of tungsten nitride as diffusion barrier for copper metallization
1999 ◽
Vol 17
(3)
◽
pp. 1101
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1998 ◽
Vol 37
(Part 2, No. 4A)
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pp. L406-L408
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1996 ◽
Vol 288
(1-2)
◽
pp. 116-119
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1987 ◽
Vol 134
(12)
◽
pp. 3170-3175
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