Contact Process Optimization for 40nm CMOS Yield Improvement

2013 ◽  
Vol 52 (1) ◽  
pp. 619-623
Author(s):  
Y. Lin ◽  
X.-P. Wang ◽  
L. Chen ◽  
C. J. Yang
Keyword(s):  
Process Optimization ◽  
Contact Process ◽  
Yield Improvement

Wafer Edge Yield Improvement by PMD CMP Process Optimization

2014 ◽  
Vol 60 (1) ◽  
pp. 669-672
Author(s):  
Y. Xu ◽  
H. X. Zhang ◽  
R. T. Zhao
Keyword(s):  
Process Optimization ◽  
Yield Improvement ◽  
Wafer Edge

scholarly journals A Potential Practical Process for Remdesivir

2021 ◽  
Author(s):  
Chen Liujuan ◽  
Guowei Zhang ◽  
Jinguang Liu ◽  
Jianye Jiao ◽  
Han Lin ◽  
...  
Keyword(s):  
Process Optimization ◽  
Lewis Acid ◽  
Column Chromatography ◽  
Primary Alcohol ◽  
Flow Chemistry ◽  
Acid Catalysts ◽  
Lewis Acid Catalysts ◽  
Yield Improvement ◽  
Process Robustness ◽  
Chemistry Development

A four-step synthesis of Remdesivir (1) is presented. This work focuses on the yield improvement of step 1, flow chemistry development of step 2 and 3, process optimization of step 4. The literatures reported (https://dx.doi.org/10.1021/acs.oprd.0c00310 and https://dx.doi.org/10.1021/acs.oprd.0c00172: SI part) step 1 was repeated, but failed in the crystallization, eventually step 1 product was obtained by column chromatography with >98% HPLC purity and 40% IY. The flow chemistry development of step 2(IY: 84%) and 3 (IY: 63%) was achieved and the release of toxic HCN was avoided, the process robustness was improved by flow chemistry. Step 4 was simplified to apply primary alcohol 6 directly (without protection) to react with chiral SM 8. Lewis acid catalysts were screened by HTS and MgI2 gave 50% AY. Cheap and commercially available MgCl2 and NaI were used to replace MgI2, finally Remdesivir (1) was obtained in >99% purity with 40.3% IY.

Contact etch process optimization for RF process wafer edge yield improvement

2019 ◽  
Vol 40 (12) ◽  
pp. 122402
Author(s):  
Zhangli Liu ◽  
Bingkui He ◽  
Fei Meng ◽  
Qiang Bao ◽  
Yuhong Sun ◽  
...  
Keyword(s):  
Process Optimization ◽  
Yield Improvement ◽  
Wafer Edge

scholarly journals A Potential Practical Process for Remdesivir

2021 ◽  
Author(s):  
Chen Liujuan ◽  
Guowei Zhang ◽  
Jinguang Liu ◽  
Jianye Jiao ◽  
Han Lin ◽  
...  
Keyword(s):  
Process Optimization ◽  
Lewis Acid ◽  
Column Chromatography ◽  
Primary Alcohol ◽  
Flow Chemistry ◽  
Acid Catalysts ◽  
Lewis Acid Catalysts ◽  
Yield Improvement ◽  
Process Robustness ◽  
Chemistry Development

A four-step synthesis of Remdesivir (1) is presented. This work focuses on the yield improvement of step 1, flow chemistry development of step 2 and 3, process optimization of step 4. The literatures reported (https://dx.doi.org/10.1021/acs.oprd.0c00310 and https://dx.doi.org/10.1021/acs.oprd.0c00172: SI part) step 1 was repeated, but failed in the crystallization, eventually step 1 product was obtained by column chromatography with >98% HPLC purity and 40% IY. The flow chemistry development of step 2(IY: 84%) and 3 (IY: 63%) was achieved and the release of toxic HCN was avoided, the process robustness was improved by flow chemistry. Step 4 was simplified to apply primary alcohol 6 directly (without protection) to react with chiral SM 8. Lewis acid catalysts were screened by HTS and MgI2 gave 50% AY. Cheap and commercially available MgCl2 and NaI were used to replace MgI2, finally Remdesivir (1) was obtained in >99% purity with 40.3% IY.

Yield improvement and queue time relaxation at contact process

2016 ◽  
Author(s):  
Niti Garg ◽  
Philippe Helal ◽  
Pranesh Muralidhar ◽  
Stephen Crown ◽  
Vincent Sih ◽  
...  
Keyword(s):  
Contact Process ◽  
Yield Improvement ◽  
Time Relaxation

Contact Failure Due to Particulate Defect in a 0.13 µm CMOS Process

2003 ◽  
Author(s):  
Sandeep Bagchi ◽  
Valli Arunachalam ◽  
Javier Saenz ◽  
James Beck ◽  
Lupe Duncan ◽  
...  
Keyword(s):  
Failure Analysis ◽  
Process Optimization ◽  
Cmos Process ◽  
Yield Improvement ◽  
Contact Failure

Abstract Random single bit failures were encountered in cache areas of Motorola’s 0.13 µm CMOS products under development. Extensive in-line probe data and end-of-line probe data in conjunction with failure analysis indicated the presence of particles at the upper surface of tungsten contacts. This paper describes how TEM based techniques were used to analyze the origin of the defect which in turn enabled process optimization and yield improvement.

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