Differential low-coherence interferometry for in situ diagnostics of transparent structures

2004 ◽  
Vol 30 (5) ◽  
pp. 389-391 ◽  
Author(s):  
V. V. Ivanov ◽  
V. A. Markelov ◽  
M. A. Novikov ◽  
S. S. Ustavshchikov
2020 ◽  
Vol 10 (23) ◽  
pp. 8590
Author(s):  
Tom Hovell ◽  
Jon Petzing ◽  
Laura Justham ◽  
Peter Kinnell

Growing requirements for in situ metrology during manufacturing have led to an increased interest in optical coherence tomography (OCT) configurations of low coherence interferometry (LCI) for industrial domains. This paper investigates the optimisation of spectral domain OCT hardware and signal processing for such implementations. A collation of the underlying theory of OCT configured LCI systems from disparate sources linking the journey of the light reflected from the object surface to the definition of the measurand is presented. This is portrayed in an applicable, comprehensible design framework through its application to profilometry measurements for optimising system performance.


2005 ◽  
Author(s):  
Wojciech J. Walecki ◽  
Alexander Pravdivtsev ◽  
Kevin Lai ◽  
Manuel SantosII ◽  
Ann Koo

2005 ◽  
Vol 875 ◽  
Author(s):  
Wojciech J. Walecki ◽  
Alexander Pravdivtsev ◽  
Kevin Lai ◽  
Manuel Santos ◽  
Georgy Mikhaylov ◽  
...  

Abstract. We propose novel stress metrology technique for measurement of local values stress tensor components in the coated wafers. New metrology is based on fiber-optic low coherence interferometry and can be applied to study stress not only in semicondiuctor wafers but in wide variety applications spanning from semiconductor to construction industry where measurements of plates covered by thin film encountered in flat panel displayes, solar cells, modern windows.


2017 ◽  
Vol 214 (11) ◽  
pp. 1700177 ◽  
Author(s):  
Vladimir Yurov ◽  
Egor Bushuev ◽  
Andrey Bolshakov ◽  
Evgeny Ashkinazi ◽  
Irina Antonova ◽  
...  

2012 ◽  
Vol 523-524 ◽  
pp. 871-876 ◽  
Author(s):  
Kenta Matsui ◽  
Hirokazu Matsumoto ◽  
Satoru Takahashi ◽  
Kiyoshi Takamasu

Recently, manufacturing techniques of small-scale products have been improved. As a result, precise measurement is required of small inside diameters, for example, of engine nozzles. However, an in situ measurement and measurement system for small-sized products has yet to be fully established. In this research, a contactless technique to measure small inside diameters is proposed. This new method uses tandem low-coherence interferometry and an optical fiber cut at an angle of 45°. This optical fiber is up to 30 μm in diameter and is used as a probe. Our objective is to measure holes as small as 50-μm inside diameter with an accuracy of 100 nm. In the present paper, we report on the measurement principle, calculate the measurement uncertainty and show that experimental measurements can be obtained of small-size holes up to 300-μm inside diameter with an accuracy of 100 nm.


2007 ◽  
Vol 65 (3) ◽  
pp. 487-491 ◽  
Author(s):  
John W. Pyhtila ◽  
Kevin J. Chalut ◽  
Jeffrey D. Boyer ◽  
Justin Keener ◽  
Thomas D'Amico ◽  
...  

Author(s):  
Ted Kolasa ◽  
Alfredo Mendoza

Abstract Comprehensive in situ (designed-in) diagnostic capabilities have been incorporated into digital microelectronic systems for years, yet similar capabilities are not commonly incorporated into the design of analog microelectronics. And as feature sizes shrink and back end interconnect metallization becomes more complex, the need for effective diagnostics for analog circuits becomes ever more critical. This paper presents concepts for incorporating in situ diagnostic capability into analog circuit designs. Aspects of analog diagnostic system architecture are discussed as well as nodal measurement scenarios for common signal types. As microelectronic feature sizes continue to shrink, diagnostic capabilities such as those presented here will become essential to the process of fault localization in analog circuits.


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