Flexible lithium-air batteries could power next-generation wearable electronics

Science ◽  
2016 ◽  
Author(s):  
Ella Xiong
2020 ◽  
Vol 3 (12) ◽  
pp. 1261-1261
Author(s):  
Xiayue Fan ◽  
Bin Liu ◽  
Jia Ding ◽  
Yida Deng ◽  
Xiaopeng Han ◽  
...  

2019 ◽  
Vol 32 (15) ◽  
pp. 1902045 ◽  
Author(s):  
Philip C. Y. Chow ◽  
Takao Someya

2016 ◽  
Vol 4 (35) ◽  
pp. 13419-13424 ◽  
Author(s):  
Lie Wang ◽  
Ye Zhang ◽  
Jian Pan ◽  
Huisheng Peng

A new family of flexible and stretchable lithium-air batteries has been developed with high electrochemical performances that are well maintained under various deformations such as bending, twisting and stretching. These lithium-air batteries have been demonstrated to be promising for a variety of fields, particularly, wearable electronics.


2014 ◽  
Vol 32 (7) ◽  
pp. 642-643 ◽  
Author(s):  
Michael J Cima

Micromachines ◽  
2021 ◽  
Vol 12 (8) ◽  
pp. 946
Author(s):  
Zhihao Ren ◽  
Jikai Xu ◽  
Xianhao Le ◽  
Chengkuo Lee

Wafer bonding technology is one of the most effective methods for high-quality thin-film transfer onto different substrates combined with ion implantation processes, laser irradiation, and the removal of the sacrificial layers. In this review, we systematically summarize and introduce applications of the thin films obtained by wafer bonding technology in the fields of electronics, optical devices, on-chip integrated mid-infrared sensors, and wearable sensors. The fabrication of silicon-on-insulator (SOI) wafers based on the Smart CutTM process, heterogeneous integrations of wide-bandgap semiconductors, infrared materials, and electro-optical crystals via wafer bonding technology for thin-film transfer are orderly presented. Furthermore, device design and fabrication progress based on the platforms mentioned above is highlighted in this work. They demonstrate that the transferred films can satisfy high-performance power electronics, molecular sensors, and high-speed modulators for the next generation applications beyond 5G. Moreover, flexible composite structures prepared by the wafer bonding and de-bonding methods towards wearable electronics are reported. Finally, the outlooks and conclusions about the further development of heterogeneous structures that need to be achieved by the wafer bonding technology are discussed.


2020 ◽  
Vol 3 (12) ◽  
pp. 1262-1274
Author(s):  
Xiayue Fan ◽  
Bin Liu ◽  
Jia Ding ◽  
Yida Deng ◽  
Xiaopeng Han ◽  
...  

2020 ◽  
Vol 8 (25) ◽  
pp. 8362-8367
Author(s):  
Chunxia Gao ◽  
Sisi He ◽  
Longbin Qiu ◽  
Mingxu Wang ◽  
Jiefeng Gao ◽  
...  

Stretchable electronic textiles are urgently called for due to the emergence of next generation wearable electronics that can undergo various mechanical deformations that exist almost everywhere in our daily lives.


2016 ◽  
Vol 8 (38) ◽  
pp. 25428-25437 ◽  
Author(s):  
Hadis Zarrin ◽  
Serubbabel Sy ◽  
Jing Fu ◽  
Gaopeng Jiang ◽  
Keunwoo Kang ◽  
...  

Author(s):  
Jianren Huang ◽  
Jianfeng Gu ◽  
Jiaontao Liu ◽  
Jinquan Guo ◽  
Huiyong Liu ◽  
...  

Intelligent flexible sensors with comfort and self-powered properties are primary in next-generation wearable electronics. Nevertheless, most of the current flexible sensors can’t work independently, but have to rely on external...


2020 ◽  
Vol 13 (7) ◽  
pp. 1933-1970 ◽  
Author(s):  
Jingwen Zhou ◽  
Jianli Cheng ◽  
Bin Wang ◽  
Huisheng Peng ◽  
Jun Lu

An overview of the recent technical advances and major dilemmas facing currently available flexible metal–gas batteries for use in wearable electronics is presented.


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