Flexible and Wearable Power Sources for Next‐Generation Wearable Electronics

2020 ◽  
Vol 3 (12) ◽  
pp. 1261-1261
Author(s):  
Xiayue Fan ◽  
Bin Liu ◽  
Jia Ding ◽  
Yida Deng ◽  
Xiaopeng Han ◽  
...  
Keyword(s):  
Wearable Electronics ◽  
Next Generation ◽  
Power Sources

Flexible and Wearable Power Sources for Next‐Generation Wearable Electronics

2020 ◽  
Vol 3 (12) ◽  
pp. 1262-1274
Author(s):  
Xiayue Fan ◽  
Bin Liu ◽  
Jia Ding ◽  
Yida Deng ◽  
Xiaopeng Han ◽  
...  
Keyword(s):  
Wearable Electronics ◽  
Next Generation ◽  
Power Sources

scholarly journals Cover Picture: Flexible and Wearable Power Sources for Next‐Generation Wearable Electronics (Batteries & Supercaps 12/2020)

2020 ◽  
Vol 3 (12) ◽  
pp. 1257-1257
Author(s):  
Xiayue Fan ◽  
Bin Liu ◽  
Jia Ding ◽  
Yida Deng ◽  
Xiaopeng Han ◽  
...  
Keyword(s):  
Wearable Electronics ◽  
Next Generation ◽  
Power Sources

scholarly journals Soft Materials for Wearable/Flexible Electrochemical Energy Conversion, Storage, and Biosensor Devices

Materials ◽  
2020 ◽  
Vol 13 (12) ◽  
pp. 2733 ◽  
Author(s):  
Patrizia Bocchetta ◽  
Domenico Frattini ◽  
Srabanti Ghosh ◽  
Allibai Mohanan Vinu Mohan ◽  
Yogesh Kumar ◽  
...  
Keyword(s):  
Mechanical Properties ◽  
Energy Storage ◽  
Energy Conversion ◽  
Soft Materials ◽  
Wearable Technology ◽  
Curved Surfaces ◽  
Wearable Electronics ◽  
Next Generation ◽  
Power Sources ◽  
Flexible Materials

Next-generation wearable technology needs portable flexible energy storage, conversion, and biosensor devices that can be worn on soft and curved surfaces. The conformal integration of these devices requires the use of soft, flexible, light materials, and substrates with similar mechanical properties as well as high performances. In this review, we have collected and discussed the remarkable research contributions of recent years, focusing the attention on the development and arrangement of soft and flexible materials (electrodes, electrolytes, substrates) that allowed traditional power sources and sensors to become viable and compatible with wearable electronics, preserving or improving their conventional performances.

Organic Photodetectors for Next‐Generation Wearable Electronics

2019 ◽  
Vol 32 (15) ◽  
pp. 1902045 ◽  
Author(s):  
Philip C. Y. Chow ◽  
Takao Someya
Keyword(s):  
Wearable Electronics ◽  
Next Generation ◽  
Organic Photodetectors

Low-cost high-performance asymmetric supercapacitors based on Co2AlO4@MnO2 nanosheets and Fe3O4 nanoflakes

2016 ◽  
Vol 4 (6) ◽  
pp. 2096-2104 ◽  
Author(s):  
Fei Li ◽  
Hao Chen ◽  
Xiao Ying Liu ◽  
Shi Jin Zhu ◽  
Jia Qi Jia ◽  
...  
Keyword(s):  
Power Density ◽  
High Performance ◽  
Low Cost ◽  
High Energy ◽  
Wearable Electronics ◽  
Asymmetric Supercapacitors ◽  
Power Sources ◽  
Mno2 Nanosheets ◽  
Increasing Demand

The development of portable and wearable electronics has promoted the increasing demand for high-performance power sources with high energy/power density, low cost, lightweight, as well as ultrathin and flexible features.

Next-generation wearable electronics

2014 ◽  
Vol 32 (7) ◽  
pp. 642-643 ◽  
Author(s):  
Michael J Cima
Keyword(s):  
Wearable Electronics ◽  
Next Generation

scholarly journals Heterogeneous Wafer Bonding Technology and Thin-Film Transfer Technology-Enabling Platform for the Next Generation Applications beyond 5G

Micromachines ◽  
2021 ◽  
Vol 12 (8) ◽  
pp. 946
Author(s):  
Zhihao Ren ◽  
Jikai Xu ◽  
Xianhao Le ◽  
Chengkuo Lee
Keyword(s):  
Thin Film ◽  
Wafer Bonding ◽  
Composite Structures ◽  
High Speed ◽  
Silicon On Insulator ◽  
Wearable Electronics ◽  
Next Generation ◽  
Bonding Technology ◽  
Film Transfer ◽  
Bandgap Semiconductors

Wafer bonding technology is one of the most effective methods for high-quality thin-film transfer onto different substrates combined with ion implantation processes, laser irradiation, and the removal of the sacrificial layers. In this review, we systematically summarize and introduce applications of the thin films obtained by wafer bonding technology in the fields of electronics, optical devices, on-chip integrated mid-infrared sensors, and wearable sensors. The fabrication of silicon-on-insulator (SOI) wafers based on the Smart CutTM process, heterogeneous integrations of wide-bandgap semiconductors, infrared materials, and electro-optical crystals via wafer bonding technology for thin-film transfer are orderly presented. Furthermore, device design and fabrication progress based on the platforms mentioned above is highlighted in this work. They demonstrate that the transferred films can satisfy high-performance power electronics, molecular sensors, and high-speed modulators for the next generation applications beyond 5G. Moreover, flexible composite structures prepared by the wafer bonding and de-bonding methods towards wearable electronics are reported. Finally, the outlooks and conclusions about the further development of heterogeneous structures that need to be achieved by the wafer bonding technology are discussed.

Life-Assessment for Thin Flexible Batteries Under U-Flex-to-Install and Dynamic Folding

2021 ◽  
Author(s):  
Pradeep Lall ◽  
Ved Soni ◽  
Scott Miller
Keyword(s):  
Research And Development ◽  
Real Life ◽  
High Capacity ◽  
Rate Capability ◽  
Life Assessment ◽  
Wearable Electronics ◽  
Power Sources ◽  
Biomedical Equipment ◽  
Capacity Degradation ◽  
Dynamic Folding

Abstract The growing need for wearable devices, fitness accessories and biomedical equipment has led to the upsurge in research and development of thin flexible battery research and development. The current state of art wearable electronics products being developed in several fields require installation of power sources in different configurations and at times require the battery to undergo mechanical folding during product operation. This requires the product batteries to robustly withstand the imposed mechanical stresses during use along with the other desirable characteristics attributed to the power source such as high C-rate capability, high capacity and low capacity degradation rate. Works that explore the effects of static and dynamic folding on li-ion power sources is limited and oftentimes doesn’t adhere to definite test protocols resulting in non-standardized experimental data that can’t be applied to real-life product scenarios. Specifically, the effect of fold diameter on the battery state of health degradation when subjected to both static and dynamic folding is not yet completely explored. Present study aims to address this gap in the literature by investigating the effect of varying the fold diameter is both static (U-flex-to-install) and dynamic (dynamic U-fold) tests. Four different values of fold diameters have been chosen for experimentation and to study its effect during the aforementioned tests. Multiple samples have been tested for a given test condition so as to generate high fidelity data. Ultimately, a regression model developed previously has been augmented with the results generated in the current study.

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