Flexible and Wearable Power Sources for Next‐Generation Wearable Electronics

2020 ◽  
Vol 3 (12) ◽  
pp. 1261-1261
Author(s):  
Xiayue Fan ◽  
Bin Liu ◽  
Jia Ding ◽  
Yida Deng ◽  
Xiaopeng Han ◽  
...  
2020 ◽  
Vol 3 (12) ◽  
pp. 1262-1274
Author(s):  
Xiayue Fan ◽  
Bin Liu ◽  
Jia Ding ◽  
Yida Deng ◽  
Xiaopeng Han ◽  
...  

2020 ◽  
Vol 3 (12) ◽  
pp. 1257-1257
Author(s):  
Xiayue Fan ◽  
Bin Liu ◽  
Jia Ding ◽  
Yida Deng ◽  
Xiaopeng Han ◽  
...  

Materials ◽  
2020 ◽  
Vol 13 (12) ◽  
pp. 2733 ◽  
Author(s):  
Patrizia Bocchetta ◽  
Domenico Frattini ◽  
Srabanti Ghosh ◽  
Allibai Mohanan Vinu Mohan ◽  
Yogesh Kumar ◽  
...  

Next-generation wearable technology needs portable flexible energy storage, conversion, and biosensor devices that can be worn on soft and curved surfaces. The conformal integration of these devices requires the use of soft, flexible, light materials, and substrates with similar mechanical properties as well as high performances. In this review, we have collected and discussed the remarkable research contributions of recent years, focusing the attention on the development and arrangement of soft and flexible materials (electrodes, electrolytes, substrates) that allowed traditional power sources and sensors to become viable and compatible with wearable electronics, preserving or improving their conventional performances.


2019 ◽  
Vol 32 (15) ◽  
pp. 1902045 ◽  
Author(s):  
Philip C. Y. Chow ◽  
Takao Someya

2016 ◽  
Vol 4 (6) ◽  
pp. 2096-2104 ◽  
Author(s):  
Fei Li ◽  
Hao Chen ◽  
Xiao Ying Liu ◽  
Shi Jin Zhu ◽  
Jia Qi Jia ◽  
...  

The development of portable and wearable electronics has promoted the increasing demand for high-performance power sources with high energy/power density, low cost, lightweight, as well as ultrathin and flexible features.


2014 ◽  
Vol 32 (7) ◽  
pp. 642-643 ◽  
Author(s):  
Michael J Cima

Micromachines ◽  
2021 ◽  
Vol 12 (8) ◽  
pp. 946
Author(s):  
Zhihao Ren ◽  
Jikai Xu ◽  
Xianhao Le ◽  
Chengkuo Lee

Wafer bonding technology is one of the most effective methods for high-quality thin-film transfer onto different substrates combined with ion implantation processes, laser irradiation, and the removal of the sacrificial layers. In this review, we systematically summarize and introduce applications of the thin films obtained by wafer bonding technology in the fields of electronics, optical devices, on-chip integrated mid-infrared sensors, and wearable sensors. The fabrication of silicon-on-insulator (SOI) wafers based on the Smart CutTM process, heterogeneous integrations of wide-bandgap semiconductors, infrared materials, and electro-optical crystals via wafer bonding technology for thin-film transfer are orderly presented. Furthermore, device design and fabrication progress based on the platforms mentioned above is highlighted in this work. They demonstrate that the transferred films can satisfy high-performance power electronics, molecular sensors, and high-speed modulators for the next generation applications beyond 5G. Moreover, flexible composite structures prepared by the wafer bonding and de-bonding methods towards wearable electronics are reported. Finally, the outlooks and conclusions about the further development of heterogeneous structures that need to be achieved by the wafer bonding technology are discussed.


2021 ◽  
Author(s):  
Pradeep Lall ◽  
Ved Soni ◽  
Scott Miller

Abstract The growing need for wearable devices, fitness accessories and biomedical equipment has led to the upsurge in research and development of thin flexible battery research and development. The current state of art wearable electronics products being developed in several fields require installation of power sources in different configurations and at times require the battery to undergo mechanical folding during product operation. This requires the product batteries to robustly withstand the imposed mechanical stresses during use along with the other desirable characteristics attributed to the power source such as high C-rate capability, high capacity and low capacity degradation rate. Works that explore the effects of static and dynamic folding on li-ion power sources is limited and oftentimes doesn’t adhere to definite test protocols resulting in non-standardized experimental data that can’t be applied to real-life product scenarios. Specifically, the effect of fold diameter on the battery state of health degradation when subjected to both static and dynamic folding is not yet completely explored. Present study aims to address this gap in the literature by investigating the effect of varying the fold diameter is both static (U-flex-to-install) and dynamic (dynamic U-fold) tests. Four different values of fold diameters have been chosen for experimentation and to study its effect during the aforementioned tests. Multiple samples have been tested for a given test condition so as to generate high fidelity data. Ultimately, a regression model developed previously has been augmented with the results generated in the current study.


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