Next-generation wearable electronics

2014 ◽  
Vol 32 (7) ◽  
pp. 642-643 ◽  
Author(s):  
Michael J Cima
2020 ◽  
Vol 3 (12) ◽  
pp. 1261-1261
Author(s):  
Xiayue Fan ◽  
Bin Liu ◽  
Jia Ding ◽  
Yida Deng ◽  
Xiaopeng Han ◽  
...  

2019 ◽  
Vol 32 (15) ◽  
pp. 1902045 ◽  
Author(s):  
Philip C. Y. Chow ◽  
Takao Someya

Micromachines ◽  
2021 ◽  
Vol 12 (8) ◽  
pp. 946
Author(s):  
Zhihao Ren ◽  
Jikai Xu ◽  
Xianhao Le ◽  
Chengkuo Lee

Wafer bonding technology is one of the most effective methods for high-quality thin-film transfer onto different substrates combined with ion implantation processes, laser irradiation, and the removal of the sacrificial layers. In this review, we systematically summarize and introduce applications of the thin films obtained by wafer bonding technology in the fields of electronics, optical devices, on-chip integrated mid-infrared sensors, and wearable sensors. The fabrication of silicon-on-insulator (SOI) wafers based on the Smart CutTM process, heterogeneous integrations of wide-bandgap semiconductors, infrared materials, and electro-optical crystals via wafer bonding technology for thin-film transfer are orderly presented. Furthermore, device design and fabrication progress based on the platforms mentioned above is highlighted in this work. They demonstrate that the transferred films can satisfy high-performance power electronics, molecular sensors, and high-speed modulators for the next generation applications beyond 5G. Moreover, flexible composite structures prepared by the wafer bonding and de-bonding methods towards wearable electronics are reported. Finally, the outlooks and conclusions about the further development of heterogeneous structures that need to be achieved by the wafer bonding technology are discussed.


2020 ◽  
Vol 3 (12) ◽  
pp. 1262-1274
Author(s):  
Xiayue Fan ◽  
Bin Liu ◽  
Jia Ding ◽  
Yida Deng ◽  
Xiaopeng Han ◽  
...  

2020 ◽  
Vol 8 (25) ◽  
pp. 8362-8367
Author(s):  
Chunxia Gao ◽  
Sisi He ◽  
Longbin Qiu ◽  
Mingxu Wang ◽  
Jiefeng Gao ◽  
...  

Stretchable electronic textiles are urgently called for due to the emergence of next generation wearable electronics that can undergo various mechanical deformations that exist almost everywhere in our daily lives.


2016 ◽  
Vol 8 (38) ◽  
pp. 25428-25437 ◽  
Author(s):  
Hadis Zarrin ◽  
Serubbabel Sy ◽  
Jing Fu ◽  
Gaopeng Jiang ◽  
Keunwoo Kang ◽  
...  

Author(s):  
Jianren Huang ◽  
Jianfeng Gu ◽  
Jiaontao Liu ◽  
Jinquan Guo ◽  
Huiyong Liu ◽  
...  

Intelligent flexible sensors with comfort and self-powered properties are primary in next-generation wearable electronics. Nevertheless, most of the current flexible sensors can’t work independently, but have to rely on external...


2020 ◽  
Vol 13 (7) ◽  
pp. 1933-1970 ◽  
Author(s):  
Jingwen Zhou ◽  
Jianli Cheng ◽  
Bin Wang ◽  
Huisheng Peng ◽  
Jun Lu

An overview of the recent technical advances and major dilemmas facing currently available flexible metal–gas batteries for use in wearable electronics is presented.


Author(s):  
Jiangqi Zhao ◽  
Jiajia Zha ◽  
Zhiyuan Zeng ◽  
Chaoliang Tan

Wearable electronics are considered to be an important technology in the next-generation smart electronics. Meanwhile, the ever-increasing energy consumption and the growing environmental awareness have highlighted the requirements of green...


Sign in / Sign up

Export Citation Format

Share Document