Molecular Functionalization of Graphene Oxide for Next-Generation Wearable Electronics

2016 ◽  
Vol 8 (38) ◽  
pp. 25428-25437 ◽  
Author(s):  
Hadis Zarrin ◽  
Serubbabel Sy ◽  
Jing Fu ◽  
Gaopeng Jiang ◽  
Keunwoo Kang ◽  
...  
Keyword(s):  
Graphene Oxide ◽  
Wearable Electronics ◽  
Next Generation

Flexible and Wearable Power Sources for Next‐Generation Wearable Electronics

2020 ◽  
Vol 3 (12) ◽  
pp. 1261-1261
Author(s):  
Xiayue Fan ◽  
Bin Liu ◽  
Jia Ding ◽  
Yida Deng ◽  
Xiaopeng Han ◽  
...  
Keyword(s):  
Wearable Electronics ◽  
Next Generation ◽  
Power Sources

Organic Photodetectors for Next‐Generation Wearable Electronics

2019 ◽  
Vol 32 (15) ◽  
pp. 1902045 ◽  
Author(s):  
Philip C. Y. Chow ◽  
Takao Someya
Keyword(s):  
Wearable Electronics ◽  
Next Generation ◽  
Organic Photodetectors

Next-generation wearable electronics

2014 ◽  
Vol 32 (7) ◽  
pp. 642-643 ◽  
Author(s):  
Michael J Cima
Keyword(s):  
Wearable Electronics ◽  
Next Generation

scholarly journals Heterogeneous Wafer Bonding Technology and Thin-Film Transfer Technology-Enabling Platform for the Next Generation Applications beyond 5G

Micromachines ◽  
2021 ◽  
Vol 12 (8) ◽  
pp. 946
Author(s):  
Zhihao Ren ◽  
Jikai Xu ◽  
Xianhao Le ◽  
Chengkuo Lee
Keyword(s):  
Thin Film ◽  
Wafer Bonding ◽  
Composite Structures ◽  
High Speed ◽  
Silicon On Insulator ◽  
Wearable Electronics ◽  
Next Generation ◽  
Bonding Technology ◽  
Film Transfer ◽  
Bandgap Semiconductors

Wafer bonding technology is one of the most effective methods for high-quality thin-film transfer onto different substrates combined with ion implantation processes, laser irradiation, and the removal of the sacrificial layers. In this review, we systematically summarize and introduce applications of the thin films obtained by wafer bonding technology in the fields of electronics, optical devices, on-chip integrated mid-infrared sensors, and wearable sensors. The fabrication of silicon-on-insulator (SOI) wafers based on the Smart CutTM process, heterogeneous integrations of wide-bandgap semiconductors, infrared materials, and electro-optical crystals via wafer bonding technology for thin-film transfer are orderly presented. Furthermore, device design and fabrication progress based on the platforms mentioned above is highlighted in this work. They demonstrate that the transferred films can satisfy high-performance power electronics, molecular sensors, and high-speed modulators for the next generation applications beyond 5G. Moreover, flexible composite structures prepared by the wafer bonding and de-bonding methods towards wearable electronics are reported. Finally, the outlooks and conclusions about the further development of heterogeneous structures that need to be achieved by the wafer bonding technology are discussed.

Flexible and Wearable Power Sources for Next‐Generation Wearable Electronics

2020 ◽  
Vol 3 (12) ◽  
pp. 1262-1274
Author(s):  
Xiayue Fan ◽  
Bin Liu ◽  
Jia Ding ◽  
Yida Deng ◽  
Xiaopeng Han ◽  
...  
Keyword(s):  
Wearable Electronics ◽  
Next Generation ◽  
Power Sources

scholarly journals Next‐Generation Sequencing Reveals Differential Responses to Acute versus Long‐Term Exposures to Graphene Oxide in Human Lung Cells

Small ◽  
2020 ◽  
Vol 16 (21) ◽  
pp. 1907686 ◽  
Author(s):  
Sourav P. Mukherjee ◽  
Govind Gupta ◽  
Katharina Klöditz ◽  
Jun Wang ◽  
Artur Filipe Rodrigues ◽  
...  
Keyword(s):  
Graphene Oxide ◽  
Next Generation Sequencing ◽  
Human Lung ◽  
Lung Cells ◽  
Next Generation ◽  
Human Lung Cells ◽  
Differential Responses ◽  
Generation Sequencing

Continuous dry–wet spinning of white, stretchable, and conductive fibers of poly(3-hydroxybutyrate-co-4-hydroxybutyrate) and ATO@TiO2 nanoparticles for wearable e-textiles

2020 ◽  
Vol 8 (25) ◽  
pp. 8362-8367
Author(s):  
Chunxia Gao ◽  
Sisi He ◽  
Longbin Qiu ◽  
Mingxu Wang ◽  
Jiefeng Gao ◽  
...  
Keyword(s):  
Tio2 Nanoparticles ◽  
Wet Spinning ◽  
Wearable Electronics ◽  
Next Generation ◽  
Electronic Textiles ◽  
Daily Lives ◽  
Almost Everywhere ◽  
Mechanical Deformations ◽  
Conductive Fibers

Stretchable electronic textiles are urgently called for due to the emergence of next generation wearable electronics that can undergo various mechanical deformations that exist almost everywhere in our daily lives.

scholarly journals Graphene Nanomaterials-Based Radio-Frequency/Microwave Biosensors for Biomaterials Detection

Materials ◽  
2019 ◽  
Vol 12 (6) ◽  
pp. 952 ◽  
Author(s):  
Hee-Jo Lee ◽  
Jong-Gwan Yook
Keyword(s):  
Graphene Oxide ◽  
Radio Frequency ◽  
Reduced Graphene Oxide ◽  
Biomedical Applications ◽  
Next Generation ◽  
Reduced Graphene ◽  
Frontier Studies ◽  
Rf Microwave

In this paper, the advances in radio-frequency (RF)/microwave biosensors based on graphene nanomaterials including graphene, graphene oxide (GO), and reduced graphene oxide (rGO) are reviewed. From a few frontier studies, recently developed graphene nanomaterials-based RF/microwave biosensors are examined in-depth and discussed. Finally, the prospects and challenges of the next-generation RF/microwave biosensors for wireless biomedical applications are proposed.

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