Mask cleaning process evaluation and modeling

2010 ◽  
Author(s):  
Pavel Nesladek ◽  
Steve Osborne
2020 ◽  
Vol 183 ◽  
pp. 116006 ◽  
Author(s):  
Boda Li ◽  
Xu He ◽  
Panpan Wang ◽  
Qingliang Liu ◽  
Wei Qiu ◽  
...  

Author(s):  
Wei-Tsu Tseng ◽  
D. Canaperi ◽  
A. Ticknor ◽  
V. Devarapalli ◽  
L. Tai ◽  
...  

2012 ◽  
Author(s):  
Pavel Nesladek ◽  
Stefan Rümmelin ◽  
Uzodinma Okoroanyanwu

2012 ◽  
Vol 187 ◽  
pp. 211-214
Author(s):  
Lucile Broussous ◽  
Kristell Courouble ◽  
Emmanuel Richard ◽  
Carole Pernel ◽  
Virginie Loup ◽  
...  

For the 32nm logic technology and beyond, more stringent specifications in terms of dimensions and materials integrity continue to drive the cleaning process improvements. In this paper, post-etch wet cleaning was optimized in order to address CD loss issues and metal hard mask cleaning improvement in a Trench First Hard Mask (TFHM) backend architecture. Based on materials compatibility tests and electrical results, this wet clean process should also be fully compatible with a Via First Trench Last (VFTL) architecture.


Author(s):  
Simon Thomas

Trends in the technology development of very large scale integrated circuits (VLSI) have been in the direction of higher density of components with smaller dimensions. The scaling down of device dimensions has been not only laterally but also in depth. Such efforts in miniaturization bring with them new developments in materials and processing. Successful implementation of these efforts is, to a large extent, dependent on the proper understanding of the material properties, process technologies and reliability issues, through adequate analytical studies. The analytical instrumentation technology has, fortunately, kept pace with the basic requirements of devices with lateral dimensions in the micron/ submicron range and depths of the order of nonometers. Often, newer analytical techniques have emerged or the more conventional techniques have been adapted to meet the more stringent requirements. As such, a variety of analytical techniques are available today to aid an analyst in the efforts of VLSI process evaluation. Generally such analytical efforts are divided into the characterization of materials, evaluation of processing steps and the analysis of failures.


2009 ◽  
Vol 19 (2) ◽  
pp. 72-78
Author(s):  
Rebecca L. Nelson Crowell ◽  
Julie Hanenburg ◽  
Amy Gilbertson

Abstract Audiologists have a responsibility to counsel patients with auditory concerns on methods to manage the inherent challenges associated with hearing loss at every point in the process: evaluation, hearing aid fitting, and follow-up visits. Adolescents with hearing loss struggle with the typical developmental challenges along with communicative challenges that can erode one's self-esteem and self-worth. The feeling of “not being connected” to peers can result in feelings of isolation and depression. This article advocates the use of a Narrative Therapy approach to counseling adolescents with hearing loss. Adolescents with hearing loss often have problem-saturated narratives regarding various components of their daily life, friendships, amplification, academics, etc. Audiologists can work with adolescents with hearing loss to deconstruct the problem-saturated narratives and rebuild the narratives into a more empowering message. As the adolescent retells their positive narrative, they are likely to experience increased self-esteem and self-worth.


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