Exploring the limitations of x-ray reflectivity as a critical dimension pattern shape metrology

2008 ◽  
Author(s):  
Hae-Jeong Lee ◽  
Sangcheol Kim ◽  
Christopher L. Soles ◽  
Eric K. Lin ◽  
Wen-Li Wu
Keyword(s):  
Critical Dimension ◽  
X Ray ◽  
Pattern Shape

scholarly journals X-ray Metrology for the SemiconductorIndustry Tutorial

2019 ◽  
Vol 124 ◽  
Author(s):  
Daniel F. Sunday ◽  
Wen-li Wu ◽  
Scott Barton ◽  
R. Joseph Kline
Keyword(s):  
Data Processing ◽  
Small Angle ◽  
Semiconductor Industry ◽  
Critical Dimension ◽  
Next Generation ◽  
Dimensional Metrology ◽  
X Ray ◽  
X Ray Scattering ◽  
Short Course ◽  
Ray Scattering

The semiconductor industry is in need of new, in-line dimensional metrology methods with higherspatial resolution for characterizing their next generation nanodevices. The purpose of this short course is to train the semiconductor industry on the NIST-developed critical dimension small angle X-ray scattering (CDSAXS) method. The topics will include both data processing and instrumentation. The short course will also provide an opportunity for discussion of the requirements for CDSAXS and the necessary improvements in X-ray source technology. Expected audience include semiconductor manufacturers, equipment manufacturers, and component manufacturers. The presentations were made at “X-ray Metrology for the Semiconductor Industry” short course at the National Institute of Standards and Technology on Aug. 25, 2016.

Critical-dimension control for 100 nm patterns in x-ray lithography

1999 ◽  
Vol 17 (6) ◽  
pp. 3415 ◽  
Author(s):  
Y. Tanaka ◽  
T. Iwamoto ◽  
K. Fujii ◽  
Y. Kikuchi ◽  
Y. Matsui ◽  
...  
Keyword(s):  
Critical Dimension ◽  
X Ray ◽  
Dimension Control

Critical-dimension grazing incidence small angle x-ray scattering

2018 ◽  
Author(s):  
Guillaume Freychet ◽  
Patrick Naulleau ◽  
Ronald Pandolfi ◽  
Dinesh Kumar ◽  
Joe Strzalka ◽  
...  
Keyword(s):  
Small Angle ◽  
Grazing Incidence ◽  
Critical Dimension ◽  
X Ray ◽  
X Ray Scattering ◽  
Ray Scattering

scholarly journals Estimation of Line Cross Sections Using Critical-Dimension Grazing-Incidence Small-Angle X-Ray Scattering

2019 ◽  
Vol 12 (4) ◽  
Author(s):  
Guillaume Freychet ◽  
Dinesh Kumar ◽  
Ron J. Pandolfi ◽  
Patrick Naulleau ◽  
Isvar Cordova ◽  
...  
Keyword(s):  
Cross Sections ◽  
Small Angle ◽  
Grazing Incidence ◽  
Critical Dimension ◽  
X Ray ◽  
X Ray Scattering ◽  
Line Cross ◽  
Ray Scattering

scholarly journals Patterning Luminescent Nanocrystalline  : Eu and  : Tb Particles Embedded in Hybrid Organosilica with Soft-Lithographic Techniques

2012 ◽  
Vol 2012 ◽  
pp. 1-11 ◽  
Author(s):  
Sajid U. Khan ◽  
Johan E. ten Elshof
Keyword(s):  
Photoelectron Spectroscopy ◽  
Substrate Surface ◽  
Solution Chemistry ◽  
Ion Scattering ◽  
X Ray Diffraction ◽  
X Ray ◽  
Low Energy Ion Scattering ◽  
Pattern Shape ◽  
Secondary Ion

Eu3+-doped LaPO4and Tb3+-doped CePO4luminescent nanoparticles embedded in hybrid organosilica were patterned by two soft lithographic techniques. The role of various parameters such as solution chemistry, thermal protocols, and modification of the mold-substrate surface energies related to pattern shape formation and adhesion to the substrates have been studied. The shrinkage of the oxide patterns and shape evolution during the process was also examined. The patterns were characterized with optical and photoluminescence (PL) microscopy, X-ray diffraction (XRD), and scanning electron microscopy (SEM). Compositional analyses were carried out with X-ray photoelectron spectroscopy (XPS), low-energy ion scattering (LEIS), and secondary ion mass spectroscopy (SIMS). The results indicated that the final patterns obtained with these two techniques for the same material have different shapes and adherence to the substrates.

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