Dissolution behavior of chemically amplified resist for advanced mask- and NIL mold-making as studied by dissolution rate monitor

2006 ◽  
Author(s):  
Kazumasa Takeshi ◽  
Kazuto Oono ◽  
Yoshiyuki Negishi ◽  
Daisuke Inokuchi ◽  
Keishi Tanaka ◽  
...  
Keyword(s):  
Dissolution Rate ◽  
Dissolution Behavior ◽  
Chemically Amplified ◽  
Chemically Amplified Resist ◽  
Mold Making

Chemically amplified resist technology for i-line applications

1998 ◽  
Author(s):  
Medhat A. Toukhy ◽  
Sanjay Malik ◽  
Andrew J. Blakeney ◽  
Karin R. Schlicht
Keyword(s):  
Chemically Amplified ◽  
Chemically Amplified Resist

Sub-150-nm electron-beam lithography using AZPN114 chemically amplified resist

1997 ◽  
Author(s):  
Zheng Cui ◽  
R. A. Moody ◽  
Ian M. Loader ◽  
John G. Watson ◽  
Philip D. Prewett
Keyword(s):  
Electron Beam ◽  
Electron Beam Lithography ◽  
Chemically Amplified ◽  
Chemically Amplified Resist

Postexposure Delay Effect on Linewidth Variation in Base Added Chemically Amplified Resist

2000 ◽  
Vol 147 (10) ◽  
pp. 3833 ◽  
Author(s):  
Chin-Yu Ku ◽  
Jia-Min Shieh ◽  
Tsann-Bim Chiou ◽  
Hwang-Kuen Lin ◽  
Tan Fu Lei
Keyword(s):  
Delay Effect ◽  
Chemically Amplified ◽  
Chemically Amplified Resist

Airborne Contamination of a Chemically Amplified Resist. 2. Effect of Polymer Film Properties on Contamination Rate

1994 ◽  
Vol 6 (4) ◽  
pp. 481-488 ◽  
Author(s):  
William D. Hinsberg ◽  
Scott A. MacDonald ◽  
Nicholas J. Clecak ◽  
Clinton D. Snyder
Keyword(s):  
Polymer Film ◽  
Contamination Rate ◽  
Film Properties ◽  
Chemically Amplified ◽  
Airborne Contamination ◽  
Chemically Amplified Resist

Track oriented chemically-amplified resist processes for quarter-micron lithography

1993 ◽  
Author(s):  
Michael T. Reilly ◽  
Azalia A. Krasnoperova ◽  
Quinn J. Leonard ◽  
James W. Taylor ◽  
Shaowie Pan
Keyword(s):  
Chemically Amplified ◽  
Chemically Amplified Resist

Development of the Synthetic Rock Technique for the Immobilization of Iodine: Kinetics of the Alumina Matrix Dissolution under High Alkaline Conditions

2012 ◽  
Vol 1518 ◽  
pp. 79-84 ◽  
Author(s):  
Hideaki Miyakawa ◽  
Tomofumi Sakuragi ◽  
Hitoshi Owada ◽  
Osamu Kato ◽  
Kaoru Masuda
Keyword(s):  
Dissolution Rate ◽  
Rate Constant ◽  
Base Material ◽  
Dissolution Behavior ◽  
Treatment Technique ◽  
Release Behavior ◽  
Alumina Matrix ◽  
Synthetic Rock ◽  
The Matrix ◽  
Iodine Release

ABSTRACTIodine filters expended after nuclear fuel reprocessing contain radioactive iodine (I-129), almost all of which exists as silver iodide (AgI). The synthetic rock technique is a solidification treatment technique using hot isostatic press (HIP), in which the alumina adsorbent base material is synthesized to form a dense solidified material (synthetic rock), and I-129 is physically confined in the form of AgI in the alumina matrix. Thus, it is necessary to understand the matrix dissolution behavior to evaluate the iodine release behavior.Experiments involving the dissolution of the matrix were carried out under various temperatures (35–70 °C) and pH values (10–12.5) that reflect the disposal conditions. The results of the experiments showed that the dissolution rate of Al visibly increases with temperature and pH. The dissolution rate constant was calculated from the initial data assuming the dissolution of the matrix as a primary reaction. The logarithmic rate constant showed a good linear correlation with the pH and the reciprocal of temperature. The 27Al-NMR analysis of the solutions of the dissolved matrix showed that the major chemical species present in the solutions was Al(OH)4-. This indicated that the dissolution of the matrix can be described by the following equation: Al2O3 + 2OH- + 3H2O → 2Al(OH)4-. Subsequently, the empirical equation of the rate of dissolution of the matrix as a function of the temperature and pH was derived. It will be used to evaluate the iodine release behavior from the synthetic rock.

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