Silicon flip-chip imaging with a resolution of 325-nm using solid-immersion lenses and the two-photon optical-beam induced current method

2006 ◽  
Author(s):  
Euan Ramsay ◽  
Nicholas Pleynet ◽  
Dong Xiao ◽  
Richard J. Warburton ◽  
Derryck T. Reid
Author(s):  
E. Ramsay ◽  
K. A. Serrels ◽  
M. J. Thomson ◽  
A. J. Waddie ◽  
R. J. Warburton ◽  
...  

Abstract By implementing two-photon optical-beam-induced current microscopy using a solid-immersion lens, imaging inside a silicon flip chip is reported with 166nm lateral resolution and an axial resolution capable of resolving features only 100nm in height.


2007 ◽  
Vol 47 (9-11) ◽  
pp. 1534-1538 ◽  
Author(s):  
E. Ramsay ◽  
K.A. Serrels ◽  
M.J. Thomson ◽  
A.J. Waddie ◽  
R.J. Warburton ◽  
...  

2005 ◽  
Vol 30 (1) ◽  
pp. 26 ◽  
Author(s):  
E. Ramsay ◽  
N. Pleynet ◽  
D. Xiao ◽  
R. J. Warburton ◽  
D. T. Reid

1998 ◽  
Vol 507 ◽  
Author(s):  
Masatoshi Wakagi ◽  
Tatsuya Ookubo ◽  
Masahiko Ando ◽  
Genshiro Kawachi ◽  
Akio Mimura ◽  
...  

ABSTRACTPhoto-leakage-current of poly-Si (polycrystalline Si) TFFs has been investigated by using the rear irradiation OBIC (Optical Beam Induced Current) method. In the case of the offset gate TFIs, it was found that the photo-leakage-current was generated in the offset region of the drain electrode side. In order to reduce the photo-leakage-current, low concentration phosphor (P) was doped in the offset region, which corresponds to LDD (Lightly Doped Drain) structure. In the LDD TFT, the photo leakage current at the offset region decreased remarkably, because of the reduction of hole transportation in this region.


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