Application of thermal wave technology to thickness and grain size monitoring of aluminum films

1991 ◽  
Author(s):  
Jon L. Opsal
Keyword(s):  
Grain Size ◽  
Thermal Wave ◽  
Aluminum Films ◽  
Wave Technology ◽  
Size Monitoring

Texture and Microstructure Effects on Electromigration Behavior of Aluminum Metallization

1991 ◽  
Vol 225 ◽  
Author(s):  
D. B. Knorr ◽  
K. P. Rodbell ◽  
D. P. Tracy
Keyword(s):  
Grain Size ◽  
Standard Deviation ◽  
Pure Aluminum ◽  
Time To Failure ◽  
X Ray Diffraction ◽  
Aluminum Films ◽  
Failure Data ◽  
Transmission Electron ◽  
Aluminum Metallization ◽  
Microstructure Effects

ABSTRACTPure aluminum films are deposited under a variety of conditions to vary the crystallographic texture. After patterning and annealing at 400°C for 1 hour, electromigration tests are performed at several temperatures. Failure data are compared on the basis of t50 and standard deviation. Microstructure is quantified by transmission electron microscopy for grain size and grain size distribution and by X-ray diffraction for texture. A strong (111) texture significantly improves the electromigration lifetime and decreases the standard deviation in time to failure. This improvement correlates with both the fraction and sharpness of the (111) texture component.

Mechanical spectroscopy of nanocrystalline aluminum films: effects of frequency and grain size on internal friction

2012 ◽  
Vol 23 (15) ◽  
pp. 155701 ◽  
Author(s):  
Guruprasad Sosale ◽  
Dorothée Almecija ◽  
Kaushik Das ◽  
Srikar Vengallatore
Keyword(s):  
Grain Size ◽  
Internal Friction ◽  
Mechanical Spectroscopy ◽  
Aluminum Films ◽  
Nanocrystalline Aluminum

Film Thickness Effect on Tensile Properties and Microstructures of Submicron Aluminum Thin Films on Polyimide

1996 ◽  
Vol 436 ◽  
Author(s):  
Y. S. Kang ◽  
P. S. Ho ◽  
R. Knipe ◽  
J. Tregilgas
Keyword(s):  
Thin Films ◽  
Grain Size ◽  
Film Thickness ◽  
Metal Film ◽  
Tensile Force ◽  
Thickness Effect ◽  
Published Data ◽  
Free Standing ◽  
Aluminum Films ◽  
Flexible Polymer

AbstractThe mechanical behavior of the metal film on a polymer substrate becomes an important issue in microelectronics metallization. The metal/polymer structure is also useful to investigate the deformation behavior of very thin free-standing metal film since the flexible polymer serves as a deformable substrate. The tensile force-elongation curves have been measured using a microtensile tester for aluminum thin films, deposited on a PMDA-ODA polyimide film, in the thickness range from 60 rum to 480 nm. The stress-strain curves for aluminum films were constructed by subtracting these curves with polyimide curves measured separately. Tensile strength increases linearly with decreasing film thickness from 196 MPa to 408 MPa within the film thickness range studied. This is in good agreement with the published data for free-standing aluminum films in the same thickness range. The measured Young's modulus is lower than the bulk modulus and exhibits no systematic dependence on the film thickness. The microstructures of aluminum films have been examined using a transmission electron microscope (TEM). These films posses the (111)-textured columnar grain structures. Grain sizes exhibit log-normal distributions and the mean grain size increases monotonically with the film thickness. An attempt is made to evaluate the effect of film thickness and grain size on the strength of aluminum thin film and the result is discussed.

Detection and Evaluation of Corrosion Damage under Coating by Infrared Thermal Wave Technology

2012 ◽  
Vol 190-191 ◽  
pp. 447-451
Author(s):  
Guo Feng Jin ◽  
Zhi Yong Huang ◽  
Wei Zhang ◽  
Zheng Wei Yang ◽  
Lu Zhu
Keyword(s):  
Surface Temperature ◽  
Thermal Wave ◽  
Damage Identification ◽  
Corrosion Damage ◽  
Temperature History ◽  
Test Results ◽  
Wave Technology ◽  
History Of ◽  
Infrared Thermal Images ◽  
Images Processing

Aims at the safety problems caused by corrosion under coating for it can not easily be observed, specimen of corrosion damage under coating was made for the research of detection by applying infrared thermal wave technology. The surface temperature distribution infrared thermal images were captured, also the surface temperature history of corrosion area, non-corrosion area and their difference. Analysis of test results show that the infrared thermal wave technology is an effective tool in detecting corrosion damage under coating, there has a fine detection time used to estimate the coating thickness, and the position and sizes of defects can be found out directly by the hot spots in the infrared images. The damages can be quantitatively recognized by images processing, but surface uniformity of the specimen has great impact on the damage identification.

Ion implant monitoring with thermal wave technology

1985 ◽  
Vol 47 (6) ◽  
pp. 584-586 ◽  
Author(s):  
W. Lee Smith ◽  
Allan Rosencwaig ◽  
David L. Willenborg
Keyword(s):  
Thermal Wave ◽  
Wave Technology

An Anodic Process for the Determination of Grain Boundary and Film Thickness Strengthening Effects in Aluminum Films on Oxidized Silicon.

1991 ◽  
Vol 239 ◽  
Author(s):  
Ramnath Venkatraman ◽  
John C. Bravman
Keyword(s):  
Grain Size ◽  
Film Thickness ◽  
Anodic Oxide ◽  
Film Stress ◽  
Anodic Process ◽  
Aluminum Films ◽  
Cu Films ◽  
Si Substrates ◽  
Tension And Compression ◽  
Stress Variations

ABSTRACTWe have measured stress variations with temperature as a function of film thickness and a given grain size in pure Al and AI-0.5%Cu films on Si substrates. The variation in thickness for a given grain size is brought about by using the same film and the repeated controlled growth and dissolution of a barrier anodic oxide which can be grown uniformly on the film. Stress measurements were made as a function of temperature by measuring wafer curvature after successively removing each 0. Iμm of Al film. The components of strengthening due to the film thickness and the presence of grain boundaries were separated by assuming that the flow stress of the film is simply the sum of these two components. The observations are consistent with results obtained using lascr-rcflowed films in an earlier work. The variations of these two components with temperature, and under tension and compression is discussed.

scholarly journals Thickness and grain size monitoring in seamless tube-making process using laser ultrasonics

2006 ◽  
Vol 39 (8) ◽  
pp. 622-626 ◽  
Author(s):  
D. Lévesque ◽  
S.E. Kruger ◽  
G. Lamouche ◽  
R. Kolarik ◽  
G. Jeskey ◽  
...  
Keyword(s):  
Grain Size ◽  
Laser Ultrasonics ◽  
Seamless Tube ◽  
Size Monitoring

Ion implant monitoring with thermal wave technology

1987 ◽  
Vol 21 (1-4) ◽  
pp. 537-541 ◽  
Author(s):  
W.L. Smith ◽  
A. Rosencwaig ◽  
D.L. Willenborg ◽  
J. Opsal ◽  
M.W. Taylor
Keyword(s):  
Thermal Wave ◽  
Wave Technology
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