Texture and Microstructure Effects on Electromigration Behavior of Aluminum Metallization
Keyword(s):
ABSTRACTPure aluminum films are deposited under a variety of conditions to vary the crystallographic texture. After patterning and annealing at 400°C for 1 hour, electromigration tests are performed at several temperatures. Failure data are compared on the basis of t50 and standard deviation. Microstructure is quantified by transmission electron microscopy for grain size and grain size distribution and by X-ray diffraction for texture. A strong (111) texture significantly improves the electromigration lifetime and decreases the standard deviation in time to failure. This improvement correlates with both the fraction and sharpness of the (111) texture component.
2010 ◽
Vol 654-656
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pp. 1106-1109
2011 ◽
Vol 194-196
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pp. 665-668
Keyword(s):
2013 ◽
Vol 275-277
◽
pp. 1952-1955
CONTROLLED SYNTHESIS OF THE ZnWO4 NANOSTRUCTURE AND STUDY OF THEIR STRUCTURAL AND OPTICAL PROPERTIES
2012 ◽
Vol 21
(01)
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pp. 1250002
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1995 ◽
Vol 53
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pp. 436-437