PZT stack etch for MEMS devices in a capacitively coupled high-density plasma reactor

2001 ◽  
Author(s):  
Paul F. Werbaneth ◽  
John Almerico ◽  
Leslie G. Jerde ◽  
Steve Marks
Keyword(s):  
Plasma Reactor ◽  
High Density ◽  
Mems Devices ◽  
Capacitively Coupled ◽  
Density Plasma

Influences of oxide material on high density plasma production using capacitively coupled discharge

2006 ◽  
Vol 506-507 ◽  
pp. 545-549 ◽  
Author(s):  
Y. Ohtsu ◽  
T. Shimazoe ◽  
T. Misawa ◽  
H. Fujita
Keyword(s):  
High Density ◽  
Oxide Material ◽  
Plasma Production ◽  
Capacitively Coupled ◽  
Density Plasma

Development of a tubular high-density plasma reactor for water treatment

2006 ◽  
Vol 40 (2) ◽  
pp. 311-322 ◽  
Author(s):  
Derek C. Johnson ◽  
David S. Dandy ◽  
Vasgen A. Shamamian
Keyword(s):  
Water Treatment ◽  
Plasma Reactor ◽  
High Density ◽  
Density Plasma

Etching characterization of shaped hole high density plasma for using MEMS devices

2005 ◽  
Vol 193 (1-3) ◽  
pp. 314-318 ◽  
Author(s):  
W.J. Park ◽  
Y.T. Kim ◽  
J.H. Kim ◽  
S.J. Suh ◽  
D.H. Yoon
Keyword(s):  
High Density ◽  
Mems Devices ◽  
Shaped Hole ◽  
Density Plasma

scholarly journals Transport of argon ions in an inductively coupled high-density plasma reactor

1997 ◽  
Vol 70 (7) ◽  
pp. 835-837 ◽  
Author(s):  
N. Sadeghi ◽  
M. van de Grift ◽  
D. Vender ◽  
G. M. W. Kroesen ◽  
F. J. de Hoog
Keyword(s):  
Plasma Reactor ◽  
High Density ◽  
Inductively Coupled ◽  
Argon Ions ◽  
Density Plasma

Introduction of a new high-density plasma reactor concept for high-aspect-ratio oxide etching

1993 ◽  
Author(s):  
Jeffrey Marks ◽  
K. Collins ◽  
C. L. Yang ◽  
David Groechel ◽  
Peter R. Keswick ◽  
...  
Keyword(s):  
Aspect Ratio ◽  
High Aspect Ratio ◽  
Plasma Reactor ◽  
High Density ◽  
Oxide Etching ◽  
Density Plasma
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