Surface micromachining of uncooled infrared imaging array using anisotropic conductive film

2001 ◽  
Author(s):  
Weiguo Liu ◽  
Lingling Sun ◽  
Weiguang Zhu ◽  
Ooi K. Tan
Keyword(s):  
Infrared Imaging ◽  
Surface Micromachining ◽  
Anisotropic Conductive Film ◽  
Imaging Array ◽  
Conductive Film ◽  
Uncooled Infrared Imaging

Electron beam curing of acrylated epoxy resins for anisotropic conductive film application

2013 ◽  
Vol 547 ◽  
pp. 246-249 ◽  
Author(s):  
Tae gyu Shin ◽  
Inhyuk Lee ◽  
Jungmin Lee ◽  
Jinyoung Hwang ◽  
Hoeil Chung ◽  
...  
Keyword(s):  
Electron Beam ◽  
Epoxy Resins ◽  
Anisotropic Conductive Film ◽  
Conductive Film ◽  
Electron Beam Curing

Microwave model of anisotropic conductive film flip-chip interconnections for high frequency applications

1999 ◽  
Vol 22 (4) ◽  
pp. 575-581 ◽  
Author(s):  
Myung-Jin Yim ◽  
Woonghwan Ryu ◽  
Young-Doo Jeon ◽  
Junho Lee ◽  
Seungyoung Ahn ◽  
...  
Keyword(s):  
High Frequency ◽  
Flip Chip ◽  
Anisotropic Conductive Film ◽  
Conductive Film

Transient Thermal Analysis of an Anisotropic Conductive Film Package Assembly Process

2000 ◽  
Author(s):  
Victor Adrian Chiriac ◽  
Tien-Yu Tom Lee
Keyword(s):  
Temperature Drop ◽  
Thermal Response ◽  
Heating Process ◽  
Assembly Process ◽  
Anisotropic Conductive Film ◽  
Conductive Film ◽  
Different Temperatures ◽  
Computational Fluid Dynamics Cfd ◽  
Nozzle Head ◽  
Transient Thermal

Abstract Transient thermal simulation was performed to analyze thermal response of the assembly process for a package using Anisotropic Conductive Film (ACF). Two assembly processes were modeled: a simplified process where the package was fixed at two different temperatures during assembly, and a detailed process where the package experienced a ramping heating process, followed by a constant temperature curing process. A 3D conjugate Computational Fluid Dynamics (CFD) study was first conducted, followed by a 3D conduction-only analysis due to the minimal effect of convection and radiation. Results from the detailed process modeling indicated that during the initial ramping, within 0.02 second, the die and nozzle head experienced a small temperature drop due to the cooling effect of the ACF material and substrate. The ACF material also displayed a steep increase in temperature after contacting the die, followed by a short decay, then ramped up again. At the end of the 10-second ramping process, the ACF reached a temperature of almost 203°C, while the die was at 206°C. During the 5 seconds of curing, all parts reached steady state in less than 2 seconds.

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