Properties and Reliability Test of Anisotropic Conductive Film in Chip on Glass Package

2006 ◽  
Author(s):  
Kai-chi Chen ◽  
Hsun-tien Li ◽  
Chia-wen Hsu ◽  
Ching-ping Yang
Keyword(s):  
Reliability Test ◽  
Anisotropic Conductive Film ◽  
Conductive Film

Electron beam curing of acrylated epoxy resins for anisotropic conductive film application

2013 ◽  
Vol 547 ◽  
pp. 246-249 ◽  
Author(s):  
Tae gyu Shin ◽  
Inhyuk Lee ◽  
Jungmin Lee ◽  
Jinyoung Hwang ◽  
Hoeil Chung ◽  
...  
Keyword(s):  
Electron Beam ◽  
Epoxy Resins ◽  
Anisotropic Conductive Film ◽  
Conductive Film ◽  
Electron Beam Curing

Microwave model of anisotropic conductive film flip-chip interconnections for high frequency applications

1999 ◽  
Vol 22 (4) ◽  
pp. 575-581 ◽  
Author(s):  
Myung-Jin Yim ◽  
Woonghwan Ryu ◽  
Young-Doo Jeon ◽  
Junho Lee ◽  
Seungyoung Ahn ◽  
...  
Keyword(s):  
High Frequency ◽  
Flip Chip ◽  
Anisotropic Conductive Film ◽  
Conductive Film

Transient Thermal Analysis of an Anisotropic Conductive Film Package Assembly Process

2000 ◽  
Author(s):  
Victor Adrian Chiriac ◽  
Tien-Yu Tom Lee
Keyword(s):  
Temperature Drop ◽  
Thermal Response ◽  
Heating Process ◽  
Assembly Process ◽  
Anisotropic Conductive Film ◽  
Conductive Film ◽  
Different Temperatures ◽  
Computational Fluid Dynamics Cfd ◽  
Nozzle Head ◽  
Transient Thermal

Abstract Transient thermal simulation was performed to analyze thermal response of the assembly process for a package using Anisotropic Conductive Film (ACF). Two assembly processes were modeled: a simplified process where the package was fixed at two different temperatures during assembly, and a detailed process where the package experienced a ramping heating process, followed by a constant temperature curing process. A 3D conjugate Computational Fluid Dynamics (CFD) study was first conducted, followed by a 3D conduction-only analysis due to the minimal effect of convection and radiation. Results from the detailed process modeling indicated that during the initial ramping, within 0.02 second, the die and nozzle head experienced a small temperature drop due to the cooling effect of the ACF material and substrate. The ACF material also displayed a steep increase in temperature after contacting the die, followed by a short decay, then ramped up again. At the end of the 10-second ramping process, the ACF reached a temperature of almost 203°C, while the die was at 206°C. During the 5 seconds of curing, all parts reached steady state in less than 2 seconds.

Optimization of Heating Temperature History for Anisotropic Conductive Film Interconnection

2012 ◽  
Vol 134 (1) ◽  
Author(s):  
Yasutada Nakagawa ◽  
Ryohei Yokoyama
Keyword(s):  
Global Optimization ◽  
Heating Temperature ◽  
Optimization Method ◽  
Temperature History ◽  
Optimization Approach ◽  
Anisotropic Conductive Film ◽  
Conductive Film ◽  
Optimization Parameters ◽  
Connection Length ◽  
Conductive Particles

Anisotropic conductive film (ACF) interconnection is used for mounting electronic components, because this method can decrease the mounting area and electric connection length, as well as the thermal stress in the connecting area. An ACF comprises thermosetting resin and conductive particles. The resin is heated and its curing rate and viscosity changes complexly with the heating temperature during the process. There are several requirements for the heating temperature history from the industrial viewpoint such as the reliability of adhesion and energy efficiency. These requirements are related to the curing rate and the viscosity of the resin. A global optimization method proposed for nonlinear programming problems is adopted to optimize the values of the curing reaction parameters and the temperature history. First, the values of parameters in the functions determining the curing rate and viscosity are identified, and the curing rate and viscosity calculated using the values of the parameters agree well with the experimental data. Then, several optimization examples clarify features of the optimum heating temperature history. It is possible to increase the final curing rate to ensure adhesion and to control the viscosity in the bubble-removing process. The period in which bubbles are removed can be changed by the setting of the optimization parameters. It is also possible to minimize the heat input and ensure the required final curing rate. These results clarify that the temperature history for ACF interconnection can be determined accurately by the presented global optimization approach.

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