Recent advances in laser spallation technique for measurement of interfacial strength in thin films and multilayers (Abstract Only)

Author(s):  
Vijay Gupta
Materials ◽  
2004 ◽  
Author(s):  
Lili Hu ◽  
Junlan Wang ◽  
Zijian Li ◽  
Shuang Li ◽  
Yushan Yan

Nanoporous zeolite thin films are promising candidates as future low-k materials. During the integration with other semiconducting materials, the high stresses resulted from the synthesis process can cause the film to fracture or delaminate from the substrates. Evaluating the interfacial adhesion of zeolite thin films is very important in achieving high performance low-k materials. In this work, laser spallation technique is utilized to investigate the interfacial strength of zeolite thin films from three different synthesis processes. The preliminary results show that the fully crystalline zeolite thin films from hydro-thermal in-situ and seeded growth methods have a stronger interface than that from the spin-on process. Effort is also being made to compare the interfacial strength of the zeolite films between the two hydro-thermal methods. This is the first time that the interfacial strength of zeolite thin films is quantitatively evaluated. The results have great significance in the future applications of low-k zeolite thin films.


2005 ◽  
Vol 875 ◽  
Author(s):  
Lili Hu ◽  
Junlan Wang ◽  
Zijian Li ◽  
Shuang Li ◽  
Yushan Yan

AbstractNanoporous zeolite thin films are promising candidates as future low dielectric constant (low-k) materials. During the integration process with other semiconductor materials, the residual stresses resulting from the synthesis processes may cause fracture or delamination of the thin films. In order to achieve high quality low-k zeolite thin films, the evaluation of the adhesion performance is important. In this paper, laser spallation technique is utilized to investigate the interfacial adhesion of zeolite thin film-Si substrate interfaces prepared using three different processes. The experimental results demonstrate that the nature of the deposition method has a great effect on the resulted interfacial adhesion of the film-substrate interfaces. This is the first time that the interfacial strength of zeolite thin films-Si substrates is quantitatively evaluated. The results have great significance in the future applications of low-k zeolite thin film materials.


2006 ◽  
Vol 21 (2) ◽  
pp. 505-511 ◽  
Author(s):  
Lili Hu ◽  
Junlan Wang ◽  
Zijian Li ◽  
Shuang Li ◽  
Yushan Yan

Nanoporous silica zeolite thin films are promising candidates for future generation low-dielectric constant (low-k) materials. During the integration with metal interconnects, residual stresses resulting from the packaging processes may cause the low-k thin films to fracture or delaminate from the substrates. To achieve high-quality low-k zeolite thin films, it is important to carefully evaluate their adhesion performance. In this paper, a previously reported laser spallation technique is modified to investigate the interfacial adhesion of zeolite thin film-Si substrate interfaces fabricated using three different methods: spin-on, seeded growth, and in situ growth. The experimental results reported here show that seeded growth generates films with the highest measured adhesion strength (801 ± 68 MPa), followed by the in situ growth (324 ± 17 MPa), then by the spin-on (111 ± 29 MPa). The influence of the deposition method on film–substrate adhesion is discussed. This is the first time that the interfacial strength of zeolite thin films-Si substrates has been quantitatively evaluated. This paper is of great significance for the future applications of low-k zeolite thin film materials.


2009 ◽  
Vol 1239 ◽  
Author(s):  
Yong Sun ◽  
Zaiwang Huang ◽  
Xiaodong Li

AbstractA facile electrophoretic deposition method was successfully applied to achieve novel nanoclay-reinforced polyacrylamide nanocomposite thin films. A special curled architecture of the re-aggregated nanoclay-platelets was identified, providing a possible source for realizing the interlocking mechanism in the nanocomposites. The curled architecture could be the result from strain releasing when the thin films were peeled off from the substrates. Through micro-/nano-indentation and in situ observation of the deformation during tensile test with an atomic force microscope (AFM), the localized deformation mechanism of the synthesized materials was investigated in further details. The results implied that a localized crack diversion mechanism worked in the synthesized nanocomposite thin films, which resembled its nature counterpart-nacre. The deformation behavior and fracture mechanism were discussed with reference to lamellar structure, interfacial strength between the nanoclays and the polyacrylamide matrix, and nanoclay agglomeration.


2004 ◽  
Vol 450 (1) ◽  
pp. 23-28 ◽  
Author(s):  
S. Banerjee ◽  
S. Ferrari ◽  
D. Chateigner ◽  
A. Gibaud
Keyword(s):  
X Ray ◽  

2012 ◽  
Vol 737 ◽  
pp. 1-21 ◽  
Author(s):  
Sunil K. Arya ◽  
Shibu Saha ◽  
Jaime E. Ramirez-Vick ◽  
Vinay Gupta ◽  
Shekhar Bhansali ◽  
...  

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