Surface roughness and subsurface damage characterization of fused silica substrates

1999 ◽  
Author(s):  
Andreas Wuttig ◽  
Joerg Steinert ◽  
Angela Duparre ◽  
Horst Truckenbrodt
Keyword(s):  
Surface Roughness ◽  
Fused Silica ◽  
Subsurface Damage ◽  
Damage Characterization ◽  
Silica Substrates

Subsurface Damage Characterization of Ground Fused Silica by HF Etching Combined with Polishing Layer by Layer

2012 ◽  
Vol 39 (3) ◽  
pp. 0303007
Author(s):  
杨明红 Yang Minghong ◽  
赵元安 Zhao Yuan′an ◽  
易葵 Yi Kui ◽  
邵建达 Shao Jianda
Keyword(s):  
Fused Silica ◽  
Subsurface Damage ◽  
Layer By Layer ◽  
Damage Characterization

scholarly journals Effect of grinding parameters on surface roughness and subsurface damage and their evaluation in fused silica

2018 ◽  
Vol 26 (4) ◽  
pp. 4638 ◽  
Author(s):  
Huapan Xiao ◽  
Zhi Chen ◽  
Hairong Wang ◽  
Jiuhong Wang ◽  
Nan Zhu
Keyword(s):  
Surface Roughness ◽  
Fused Silica ◽  
Subsurface Damage ◽  
Grinding Parameters

scholarly journals Relations between subsurface damage depth and surface roughness of grinded fused silica

2013 ◽  
Vol 21 (25) ◽  
pp. 30433 ◽  
Author(s):  
P. Blaineau ◽  
R. Laheurte ◽  
P. Darnis ◽  
N. Darbois ◽  
O. Cahuc ◽  
...  
Keyword(s):  
Surface Roughness ◽  
Fused Silica ◽  
Subsurface Damage ◽  
Damage Depth

Diagnostics tools for subsurface damage characterization of ground silica parts

2009 ◽  
Author(s):  
P. Cormont ◽  
J. Neauport ◽  
N. Darbois ◽  
J. Destribats ◽  
C. Ambard ◽  
...  
Keyword(s):  
Subsurface Damage ◽  
Damage Characterization

Subsurface Damage Characterization of Hydrogen Ion Implanted Silicon Wafer with Uv/Millimeter-Wave Technique

2000 ◽  
Vol 631 ◽  
Author(s):  
Yoh-Ichiro Ogita ◽  
Ken-Ichi Kobayashi ◽  
Masaki Kurokawa ◽  
Hideyuki Kondo ◽  
Takeo Katoh
Keyword(s):  
Silicon Wafer ◽  
Millimeter Wave ◽  
Subsurface Damage ◽  
Blue Laser ◽  
Hydrogen Ion ◽  
Implantation Energy ◽  
Damage Characterization ◽  
Wave Technique ◽  
Microwave Probe

ABSTRACTThe UV/mm-wave technique composed of ultraviolet photoexcitation and millimeter wave probe was examined with photoconductivity amplitude (PCA) to characterize the slight subsurface damage induced by implanting H2+ ion into the subsurface at sub micron depth of Si wafers. The identical samples were also characterized using pulse photoconductivity amplitude (PPCA) obtained by another technique which is specified by blue laser photoexcitation and microwave probe. PCA decreased with increase of ion dose, which coincided well with the result in PPCA. PPCA decreased with increase of implantation energy as 90 to 120 keV, but PCA increased at 120keV. Both PCA and PPCA well reflected the damage at sub micron depth. PCA reflected damage in shallower depth compared to PPCA.

scholarly journals Experimental Study on Surface Integrity and Subsurface Damage of Fused Silica in Ultra-Precision Grinding

2021 ◽  
Author(s):  
Yaoyu Zhong ◽  
Yifan Dai ◽  
Hang Xiao ◽  
Feng Shi
Keyword(s):  
Surface Roughness ◽  
Plastic Flow ◽  
Material Removal ◽  
Cutting Speed ◽  
Fused Silica ◽  
Subsurface Damage ◽  
Depth Of Cut ◽  
Grinding Wheel ◽  
Precision Grinding ◽  
Ultra Precision

Abstract To realize low-damage ultra-precision grinding on fused silica, the surface quality and subsurface damage (SSD) distribution with fine-grained grinding wheel under different depth-of-cut and cutting speed are experimentally studied. The material removal mechanism under different grinding parameters is revealed by calculating undeformed chip thickness and observed with the help of transmission electron microscopy. The results show that brittle-ductile surfaces and ductile-like surfaces are generated during grinding. With the decrease of depth-of-cut and the increase of wheel cutting speed, the ultra-precision grinding changes to ductile-regime grinding with plastic flow removal. Besides, the surface roughness (SR) and SSD depth are reduced. The fracture defects such as fractured pits and grinding streaks on brittle-ductile surface gradually decrease. Instead, a ductile-like surface covered with grinding streaks is found. On brittle-ductile surfaces, the nonlinear relationship SSD∝SR4/3 is no longer proper under the influence of plastic flow. Using surface roughness Ra to predict SSD depth is more accurate. When depth-of-cut is 1 µm, cutting speed is 23.4 m/s and the material removal mode is dominated by plastic flow removal, the surface Ra is improved to 2.0 nm and there is no crack but only a 3.4 nm deep plastic flow layer in subsurface after grinding.

Investigation of subsurface damage impact on resistance of laser radiation of fused silica substrates

2013 ◽  
Author(s):  
K. Juškevičius ◽  
R. Buzelis ◽  
S. Kičas ◽  
T. Tolenis ◽  
R. Drazdys ◽  
...  
Keyword(s):  
Laser Radiation ◽  
Fused Silica ◽  
Subsurface Damage ◽  
Damage Impact ◽  
Silica Substrates
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