Development of high-speed 3D inspection system for solder bumps

1998 ◽  
Author(s):  
Youji Nishiyama ◽  
Hiroyuki Tsukahara ◽  
Yoshitaka Oshima ◽  
Fumiyuki Takahashi ◽  
Takashi Fuse ◽  
...  
Keyword(s):  
High Speed ◽  
Inspection System ◽  
Solder Bumps

High-speed 3D inspection system for solder bumps

1995 ◽  
Author(s):  
Hiroyuki Tsukahara ◽  
Youji Nishiyama ◽  
Fumiyuki Takahashi ◽  
Takashi Fuse ◽  
Moritoshi Ando ◽  
...  
Keyword(s):  
High Speed ◽  
Inspection System ◽  
Solder Bumps

scholarly journals Photometric stereo-based high-speed inline battery electrode inspection

2021 ◽  
Vol 0 (0) ◽  
Author(s):  
Christian Kapeller ◽  
Ernst Bodenstorfer
Keyword(s):  
Quality Control ◽  
System Architecture ◽  
High Speed ◽  
Shape From Shading ◽  
Production Quality ◽  
Photometric Stereo ◽  
Inspection System ◽  
Coating Materials ◽  
Production Quality Control ◽  
Reconstruction Performance

Abstract Battery technology is a key component in current electric vehicle applications and an important building block for upcoming smart grid technologies. The performance of batteries depends largely on quality control during their production process. Defects introduced in the production of electrodes can lead to degraded performance and, more importantly, to short circuits in final cells, which is highly safety-critical. In this paper, we propose an inspection system architecture that can detect defects, such as missing coating, agglomerates, and pinholes on coated electrodes. Our system is able to acquire valuable production quality control metrics, like surface roughness. By employing photometric stereo techniques, a shape from shading algorithm, our system surmounts difficulties that arise while optically inspecting the black to dark gray battery coating materials. We present in detail the acquisition concept of the proposed system architecture, and analyze its acquisition-, as well as, its surface reconstruction performance in experiments. We carry these out utilizing two different implementations that can operate at a production speed of up to 2000 mm/s at a resolution of 50 µm per pixel. In this work we aim to provide a system architecture that can provide a reliable contribution to ensuring optimal performance of produced battery cells.

Solder Bumps Inspection UsingPrincipal Component Analysis in Active Thermography

2014 ◽  
Vol 912-914 ◽  
pp. 1529-1533
Author(s):  
Xiang Ning Lu ◽  
Ji Guang Han ◽  
Su Hua Han ◽  
Su Ya Wang ◽  
Ming Hui Shao
Keyword(s):  
Principal Component Analysis ◽  
Principal Component ◽  
Component Analysis ◽  
Source Distribution ◽  
Inspection System ◽  
Thermal Contrast ◽  
Ir Camera ◽  
Active Thermography ◽  
Solder Bumps ◽  
Pixel Value

A nondestructive inspection system has been developed using the active thermography technology. However the solder defects can not be distinguished directly from the thermal images captured by IR camera because of the heating non-uniformities. The principal component analysis is explored to identify the defects of the solder bumps accurately and effectively. Thermal contrast image is obtained by subtracting source distribution map from the original thermal image. The hot spots corresponding to 16 solder bumps are segmented. The pixels with the thermal contrast values ranging from 0.18°C to 0.20°C are counted, and the maximum and the minimum of the pixel value are found out respectively, which are used in the principal component analysis. The missing bump is identified by the first principal component score. The results show that it is effective using the principal component analysis in active thermography for defects inspection of solder bumps in microelectronic packaging.

A new packaging technology using micro-solder bumps for high-speed photoreceivers

1992 ◽  
Vol 15 (4) ◽  
pp. 578-582 ◽  
Author(s):  
H. Tsunetsugu ◽  
K. Katsura ◽  
T. Hayashi ◽  
F. Ishitsuka ◽  
S. Hata
Keyword(s):  
High Speed ◽  
Packaging Technology ◽  
Solder Bumps

Modeling of Characteristics of Magneto-Optical Sensor Using FEM and Dipole Model for Nondestructive Evaluation

2005 ◽  
Vol 297-300 ◽  
pp. 2022-2027 ◽  
Author(s):  
Jin Yi Lee ◽  
Ji Seoung Hwang ◽  
Tetsuo Shoji ◽  
Jae Kyoo Lim
Keyword(s):  
Optical Sensor ◽  
High Speed ◽  
Crack Depth ◽  
Image Data ◽  
Nondestructive Inspection ◽  
Dipole Model ◽  
Inspection System ◽  
Optical Intensity ◽  
The Finite Element Method ◽  
Reflected Light

The magneto-optical nondestructive inspection system (hereafter refer to as RMO system) using magneto-optical sensor (hereafter refer to as MO sensor) offers the benefits of providing image data and LMF information at the same time. Therefore this system makes it possible to carry out remote and high speed inspection of cracks from the intensity of the reflected light and to estimate the shape of a crack more effectively than by already existing methods. In other words, the shape of crack could be evaluated using image data, and crack depth can be determined by calculating the intensity of reflected light. The purposes of this study were to confirm the vertical components of leakage magnetic flux from a crack using RMO system and to verify the effects of MO sensor using the finite element method and dipole model calculation. The effectiveness of these analysis methods was compared with experiments using a RMO system and several types and sizes of the crack on plate specimens. The volume of a crack could be estimated using the optical intensity regardless of the shape of cracks.

Automatic Ultrasonic Inspection Method of Railway Axle and its Remaining Life Prediction

2011 ◽  
Vol 213 ◽  
pp. 291-296 ◽  
Author(s):  
Hong Wei Hu ◽  
Xiong Bing Li ◽  
Xiang Hong Wang ◽  
Yi Min Shao
Keyword(s):  
High Speed ◽  
Fatigue Cracks ◽  
Ultrasonic Inspection ◽  
Inspection System ◽  
Remaining Life ◽  
High Speed Railway ◽  
Inspection Method ◽  
Spiral Trajectory ◽  
Image Element ◽  
The Matrix

With the high speed railway utilization, the probability of defects or fatigue cracks in railway axles is increased. An automatic ultrasonic inspection system for railway axles is presented. This system uses combined probes and inspects the defects with spiral trajectory along the axis of the axle. Through the matrix representation of C-scan image element, a defect edge extraction method is adopted, with which the defect parameters of crack are obtained automatically. Based on these defect parameters, the stress intensity factor is assessed by svm regression and the method to predict remaining life is proposed.

Detection of Solder Bump Defects in Electronic Packages Using Local Temporal Coherence Analysis of Laser Ultrasonic Signals

2009 ◽  
Vol 131 (1) ◽  
Author(s):  
Jin Yang ◽  
I. Charles Ume
Keyword(s):  
Solder Bump ◽  
Temporal Coherence ◽  
Acoustic Microscopy ◽  
Inspection System ◽  
Laser Ultrasound ◽  
Electronic Packages ◽  
Surface Mount ◽  
Flip Chips ◽  
Solder Bumps ◽  
Ultrasound Inspection

Microelectronics packaging technology has evolved from through-hole and bulk configurations to surface-mount and small-profile configurations. Surface mount devices, such as flip chip packages, chip scale packages, and ball grid arrays, use solder bump interconnections between them and substrates/printed wiring boards. Solder bumps, which are hidden between the device and the substrate/board, are difficult to inspect. A solder bump inspection system was developed using laser ultrasound and interferometric techniques. This system has been successfully applied to detect solder joint/bump defects, including missing, misaligned, open, and cracked solder joints/bumps in flip chips, chip scale packages, and multilayer ceramic capacitors. This system uses a pulsed Nd:YAG laser to induce ultrasound in the electronic packages in the thermoelastic regime; it then measures the transient out-of-plane displacement response on the package surface using the interferometric technique. This paper presents a local temporal coherence (LTC) analysis of laser ultrasound signals and compares it to previous signal-processing methods, including error ratio and correlation coefficient methods. The results showed that LTC analysis increased measurement accuracy and sensitivity for inspecting solder bump defects in electronic packages. Laser ultrasound inspection results are also compared with X-ray and C-mode scanning acoustic microscopy results. In particular, this paper discusses defect detection for 6.35×6.35×0.6 mm3 flip chips and flip chips (“SiMAF;” Siemens AG) with lead-free solder bumps.

scholarly journals Computer vision–based automatic rod-insulator defect detection in high-speed railway catenary system

2018 ◽  
Vol 15 (3) ◽  
pp. 172988141877394 ◽  
Author(s):  
Ye Han ◽  
Zhigang Liu ◽  
DJ Lee ◽  
Wenqiang Liu ◽  
Junwen Chen ◽  
...  
Keyword(s):  
Computer Vision ◽  
Defect Detection ◽  
High Speed ◽  
Power Transmission ◽  
Estimation Algorithm ◽  
Inspection System ◽  
High Speed Railway ◽  
Inspection Method ◽  
Railway Systems ◽  
Catenary System

Maintenance of catenary system is a crucial task for the safe operation of high-speed railway systems. Catenary system malfunction could interrupt railway service and threaten public safety. This article presents a computer vision algorithm that is developed to automatically detect the defective rod-insulators in a catenary system to ensure reliable power transmission. Two key challenges in building such a robust inspection system are addressed in this work, the detection of the insulators in the catenary image and the detection of possible defects. A two-step insulator detection method is implemented to detect insulators with different inclination angles in the image. The sub-images containing cantilevers and rods are first extracted from the catenary image. Then, the insulators are detected in the sub-image using deformable part models. A local intensity period estimation algorithm is designed specifically for insulator defect detection. Experimental results show that the proposed method is able to automatically and reliably detect insulator defects including the breakage of the ceramic discs and the foreign objects clamped between two ceramic discs. The performance of this visual inspection method meets the strict requirements for catenary system maintenance.

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