High volume manufacturing of optical MEMS devices using biomass nano-patterning materials and ecofriendly developable lithography processes

2018 ◽  
Author(s):  
Satoshi Takei
Keyword(s):  
High Volume ◽  
Mems Devices ◽  
Optical Mems ◽  
Nano Patterning

Magneto-Thermo-Fluidic (MTF) MEMS by Direct-Write (DW) Laser Micro-Fabrication (LμF)

2000 ◽  
Author(s):  
George P. Vakanas ◽  
Ampere A. Tseng ◽  
Paul Winer
Keyword(s):  
High Volume ◽  
Magnetic Films ◽  
Direct Write ◽  
State University ◽  
Mems Devices ◽  
Arizona State University ◽  
Research Activity ◽  
Micro Fabrication ◽  
Laser Fabrication ◽  
Processing Techniques

Abstract Keeping up with the highlight topic of this year’s ASME MEMS Symposium 2000 “Beyond Traditional Barriers”, this paper reports on operational principles, scaling, modeling and fabrication issues for magneto-fluidic MEMS. The research is an integral part of the on-going Laser Fabrication Program at Arizona State University. It is the premise of this paper that novel MEMS devices and applications can evolve by integrating materials with unique properties in new micro device designs (Grimes, 1997). Laser processing techniques, for 5μ-thick magnetic films on silicon, have already been reported elsewhere by the same authors (Vakanas et al, 2000). The focus of the current work is on expanding the applications envelop of laser-fabricated microstructures on magnetic thick films to enable new high-volume semiconductor and MEMS devices. Research results are presented in the form of preliminary laser-based rapid prototyping and fabrication (RP&F) as well as comparative taxonomies of operational principles and applications in microfluidics and micromagnetics, leading to the conceptual design of micro and meso -scale MHD and MTF devices. The paper concludes with the on-going research activity and remaining challenges.

Laser-Induced Damage of Polycrystalline Silicon Optically Powered MEMS Actuators

2005 ◽  
Author(s):  
Justin R. Serrano ◽  
Leslie M. Phinney ◽  
Carlton F. Brooks
Keyword(s):  
Polycrystalline Silicon ◽  
Continuous Wave ◽  
Continuous Wave Laser ◽  
Mems Devices ◽  
Optical Mems ◽  
Thermal Actuators ◽  
Incident Laser Power ◽  
Mems Actuators ◽  
Laser Induced Damage ◽  
Time Required

Optical MEMS devices are commonly interfaced with lasers for communication, switching, or imaging applications. Dissipation of the absorbed energy in such devices is often limited by dimensional constraints which may lead to overheating and damage of the component. Surface micromachined, optically powered thermal actuators fabricated from two 2.25 μm thick polycrystalline silicon layers were irradiated with 808 nm continuous wave laser light with a 100 μm diameter spot under increasing power levels to assess their resistance to laser-induced damage. Damage occurred immediately after laser irradiation at laser powers above 275 mW and 295 mW for 150 μm diameter circular and 194 μm by 150 μm oval targets, respectively. At laser powers below these thresholds, the exposure time required to damage the actuators increased linearly and steeply as the incident laser power decreased. Increasing the area of the connections between the two polycrystalline silicon layers of the actuator target decreases the extent of the laser damage. Additionally, an optical thermal actuator target with 15 μm × 15 μm posts withstood 326 mW for over 16 minutes without exhibiting damage to the surface.

Fabrication Processes for Packaged Optical MEMS Devices

2006 ◽  
Author(s):  
S. Samson ◽  
R. Agarwal ◽  
S. Kedia ◽  
Weidong Wang ◽  
S. Onishi ◽  
...  
Keyword(s):  
Mems Devices ◽  
Optical Mems

Hybrid bulk micro-machining process suitable for roughness reduction in optical MEMS devices

2006 ◽  
Vol 9 (1/2) ◽  
pp. 144 ◽  
Author(s):  
Arvind Chandrasekaran ◽  
Muthukumaran Packirisamy ◽  
Ion Stiharu ◽  
Andre Delage
Keyword(s):  
Machining Process ◽  
Micro Machining ◽  
Mems Devices ◽  
Optical Mems

Sealing dispensing requirements to meet MEMS packaging and throughput impact

2013 ◽  
Vol 2013 (DPC) ◽  
pp. 000535-000570
Author(s):  
Heakyoung Park
Keyword(s):  
High Reliability ◽  
High Volume ◽  
Organic Substrate ◽  
Manufacturing Cost ◽  
Production Volume ◽  
Mems Devices ◽  
Consumer Market ◽  
Technical Requirements ◽  
Mems Microphones ◽  
The Impact

The MEMS industry has gained big momentum recently with significant unit growth, especially in the consumer market. While traditional MEMS devices like automotive accelerators have established high-volume manufacturing processes and packages with high reliability, most MEMS devices have been fragmented in packaging because of their unique requirements and small volumes, resulting in high packaging costs. In the cost-sensitive consumer market, devices such as MEMS microphones, accelerometers, and gyroscopes in mobile devices have rapidly increased their production volume and chased lower packaging cost while accepting relatively less reliability than traditional devices. Sealing dispensing can be applied to device or cap wafer for wafer capping process. Wafer capping protects active MEMS from dicing process after release because the additional cavity wafer with sealing covers the MEMS structure. There are manufacturing challenges because wafer capping requires precise alignment and a variety of bonding methods have technical drawbacks. Printing is one way to deposit sealing lines to cap wafers, but consumes a relatively wide area and may not work if the sealing line must go onto the MEMS die wafer. Sealing line can also be applied to organic substrate that contains MEMS device and ASIC and then lid is attached for bonding in cavity packages. Previous paper covered technical requirements for dispensing sealant, volumetric accuracy, and motion systems to meet packaging trends and addressed manufacturing cost reductions. This paper will include investigating the impact on the throughput model due to size reduction efforts in packaging. More dies can be produced per given wafer size, which means there is more dispensing area per wafer. In addition, sealing line requirements will be more challenging, and so this paper will address these demands.

Metal-based Optical MEMS Scanning Devices Using Lead-Free Piezoelectric Sheets Prepared by Aerosol Deposition

2012 ◽  
Vol 2012 (CICMT) ◽  
pp. 000246-000250
Author(s):  
Jae-Hyuk Park ◽  
Jun Akedo
Keyword(s):  
Resonant Frequency ◽  
Thick Film ◽  
Bulk Material ◽  
Ambient Air ◽  
Aerosol Deposition ◽  
Lead Free ◽  
Mems Devices ◽  
Optical Mems ◽  
Scanning Angle ◽  
Optical Scanning

We demonstrate metal-based lamb-wave resonant optical MEMS scanning devices actuated by aerosol deposition (AD) piezoelectric film and report their temperature properties and durability. Metal-based structure was introduced to reduce the production cost and to improve the optical scanning performance, simultaneously. The optical scanning devices with large mirror size as well as high scanning angle were fabricated. A high optical scanning angle (more than 60 °) and a high resonant frequency (more than 25 kHz) were achieved in ambient air without vacuum packaging. The resonant frequency and the scanning angle do not have any changes during life test of approximately 50,000 hours. In this report, BaTiO3 (BTO) thick film as a lead free piezoelectric material was prepared by AD process for a piezoelectric exaltation source of scanning devices. Piezoelectric d31 of BTO-AD film was approximately −138 pm/V. The performance of optical scanner driven by AD-BTO thick film was comparable with that of BTO bulk material and AD-PZT thick film. From these results, AD-BTO film might be used to practical applications on the MEMS devices.

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