Excimer laser applications in angioplasty, urology, and dentistry

1990 ◽  
Author(s):  
Roberto Pini ◽  
Renzo Salimbeni ◽  
Matteo Vannini ◽  
A. Guasti ◽  
Riccardo Viligiardi ◽  
...  
Keyword(s):  
Excimer Laser ◽  
Laser Applications

Long-time radiation-resistant optical coatings for UV excimer laser applications

2001 ◽  
Author(s):  
Sven Laux ◽  
Helmut Bernitzki ◽  
Michael Klaus ◽  
Hans Lauth ◽  
Norbert Kaiser
Keyword(s):  
Excimer Laser ◽  
Optical Coatings ◽  
Laser Applications ◽  
Long Time ◽  
Radiation Resistant

Pulse stretcher with variable pulse length for excimer laser applications

2010 ◽  
Vol 81 (3) ◽  
pp. 033104 ◽  
Author(s):  
A. Burkert ◽  
J. Bergmann ◽  
W. Triebel ◽  
U. Natura
Keyword(s):  
Excimer Laser ◽  
Pulse Length ◽  
Laser Applications

Improved UV-fiber for 193-nm excimer laser applications

1996 ◽  
Author(s):  
Peter Karlitzschek ◽  
Karl-Friedrich Klein ◽  
Georg Hillrichs ◽  
Ulrich Grzesik
Keyword(s):  
Excimer Laser ◽  
Laser Applications ◽  
193 Nm

Excimer Laser Applications in Integrated Circuit Packaging

1995 ◽  
Vol 397 ◽  
Author(s):  
Y. F. Lu ◽  
M. H. Hong ◽  
D. S. H. Chan ◽  
T. S. Low
Keyword(s):  
Excimer Laser ◽  
Integrated Circuit ◽  
Laser Processing ◽  
High Efficiency ◽  
Laser Applications ◽  
Excimer Laser Ablation ◽  
Short Period ◽  
Hydrogen Flame ◽  
Short Time ◽  
Selection Of

ABSTRACTExcimer laser ablation is applied in the deflashing and demarking of IC packages. It is found that mold flash filled in the interface holes of IC leadframe can be removed completely by the laser deflashing in a short period of time. With appropriate selection of laser parameters, deflashing quality and efficiency can be greatly improved. The laser deflashing is more efficient for higher pin count packages. It is a superior alternative in future applications. In laser demarking, ink marks on package surfaces can also be removed completely in a short time. The surface after the processing has good conditions for remarking. The package remarking shows good permanency. The lifetime for good marking is much longer for IC packages after the laser demarking than those after hydrogen flame-off. Laser processing can be used to replace hydrogen flame-off in the ink printing of IC packages for high efficiency and safety.

Improvement of the ultraviolet-proof property of silica glass fibers for ArF excimer-laser applications

1999 ◽  
Vol 24 (23) ◽  
pp. 1678 ◽  
Author(s):  
K. Saito ◽  
A. J. Ikushima ◽  
T. Kotani ◽  
T. Miura
Keyword(s):  
Excimer Laser ◽  
Silica Glass ◽  
Glass Fibers ◽  
Laser Applications ◽  
Arf Excimer Laser

Reduction of photodegradation in optical fibers for excimer laser applications

1992 ◽  
Author(s):  
Ulrich Grzesik ◽  
Heinz Fabian ◽  
Walter Neu ◽  
Georg Hillrichs
Keyword(s):  
Excimer Laser ◽  
Optical Fibers ◽  
Laser Applications

Excimer Laser Applications: Polymer Etching and Metal Deposition

1986 ◽  
Vol 75 ◽  
Author(s):  
Michael Ritz ◽  
V. Srinivasan ◽  
S. V. Babu ◽  
Ramesh C. Patel
Keyword(s):  
Thin Films ◽  
Laser Radiation ◽  
Excimer Laser ◽  
Laser Pulses ◽  
Metal Deposition ◽  
Laser Applications ◽  
Preliminary Results ◽  
Copper Particles ◽  
Copper Formate ◽  
High Fluences

AbstractExcimer laser induced ablative decomposition of polyimide and poly(methylmethacrylate) at high fluences (> 1 J/cm2) is discussed. It is shown that 0.4 μm sized features can be imaged in polyimide using ArF laser pulses. Preliminary results from experiments in which copper particles (<1 μm in size) have been deposited by exposing thin films of a copper formate and glycerol paste to KrF laser radiation are presented.

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