Excimer Laser Applications in Integrated Circuit Packaging

1995 ◽  
Vol 397 ◽  
Author(s):  
Y. F. Lu ◽  
M. H. Hong ◽  
D. S. H. Chan ◽  
T. S. Low
Keyword(s):  
Excimer Laser ◽  
Integrated Circuit ◽  
Laser Processing ◽  
High Efficiency ◽  
Laser Applications ◽  
Excimer Laser Ablation ◽  
Short Period ◽  
Hydrogen Flame ◽  
Short Time ◽  
Selection Of

ABSTRACTExcimer laser ablation is applied in the deflashing and demarking of IC packages. It is found that mold flash filled in the interface holes of IC leadframe can be removed completely by the laser deflashing in a short period of time. With appropriate selection of laser parameters, deflashing quality and efficiency can be greatly improved. The laser deflashing is more efficient for higher pin count packages. It is a superior alternative in future applications. In laser demarking, ink marks on package surfaces can also be removed completely in a short time. The surface after the processing has good conditions for remarking. The package remarking shows good permanency. The lifetime for good marking is much longer for IC packages after the laser demarking than those after hydrogen flame-off. Laser processing can be used to replace hydrogen flame-off in the ink printing of IC packages for high efficiency and safety.

scholarly journals Optical System with High-Efficiency for Excimer Laser Ablation Apparatus.

1994 ◽  
Vol 22 (11) ◽  
pp. 943-951
Author(s):  
Nobuyuki ZUMOTO ◽  
Masao IZUMO ◽  
Toshinori YAGI ◽  
Masaaki TANAKA
Keyword(s):  
Laser Ablation ◽  
Excimer Laser ◽  
Optical System ◽  
High Efficiency ◽  
Excimer Laser Ablation

Synthesis of silicon-based polymerized films by excimer laser ablation deposition of hexaphenyldisilane

1999 ◽  
Vol 14 (1) ◽  
pp. 232-245 ◽  
Author(s):  
Xiaoyan Zeng ◽  
Fabrice Rossignol ◽  
Shigeru Konno ◽  
Hideaki Nagai ◽  
Yoshinori Nakata ◽  
...  
Keyword(s):  
Thermal Stability ◽  
Laser Ablation ◽  
Excimer Laser ◽  
Laser Processing ◽  
Vickers Microhardness ◽  
Processing Parameters ◽  
Good Thermal Stability ◽  
Excimer Laser Ablation ◽  
Silicon Based ◽  
Deposited Films

A new method of synthesizing silicon-based polymer films by excimer laser ablation of hexaphenyldisilane (HPDS) has been studied. The polymerized films were formed on a substrate by laser ablation deposition of HPDS at 248 nm. The structure of the polymerized films depended strongly on the laser fluence and repetition rates. The thermal stability and hardness of the deposited films were estimated by thermogravimetry and a Vickers microhardness meter. The films showed good thermal stability, depending on the laser processing parameters.

Coronary Intervention with the Excimer Laser: Review of the Technology and Outcome Data

2016 ◽  
Vol 11 (1) ◽  
pp. 27
Author(s):  
John Rawlins ◽  
◽  
◽  
◽  
◽  
...  
Keyword(s):  
Excimer Laser ◽  
Coronary Intervention ◽  
Outcome Data ◽  
Boston Scientific ◽  
Technical Aspects ◽  
Safety And Efficacy ◽  
Percutaneous Coronary ◽  
Short Period ◽  
Complex Lesions

Excimer laser coronary atherectomy (ELCA) is a long-established adjunctive therapy that can be applied during percutaneous coronary intervention (PCI). Technical aspects have evolved and there is an established safety and efficacy record across a number of clinical indications in contemporary interventional practice where complex lesions are routinely encountered. The role of ELCA during PCI for thrombus, non-crossable or non-expandable lesions, chronic occlusions and stent under-expansion are discussed in this review. The key advantage of ELCA over alternative atherectomy interventions is delivery on a standard 0.014-inch guidewire. Additionally, the technique can be mastered by any operator after a short period of training. The major limitation is presence of heavy calcification although when rotational atherectomy (RA) is required but cannot be applied due to inability to deliver the dedicated RotaWire™ (Boston Scientific), ELCA can create an upstream channel to permit RotaWire passage and complete the case with RA – the RASER technique.

Gallium Arsenide Photonic Integrated Circuit Platform for Tunable Laser Applications

2021 ◽  
pp. 1-1
Author(s):  
Paul Verrinder ◽  
Lei Wang ◽  
Joseph Fridlander ◽  
Fengqiao Sang ◽  
Victoria Rosborough ◽  
...  
Keyword(s):  
Gallium Arsenide ◽  
Integrated Circuit ◽  
Tunable Laser ◽  
Laser Applications ◽  
Photonic Integrated Circuit
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