Optical probing of flip chip packaged microprocessors

1998 ◽  
Vol 16 (6) ◽  
pp. 3625 ◽  
Author(s):  
Mario Paniccia
Keyword(s):  
Flip Chip ◽  
Optical Probing

Laser Voltage Probe (LVP): A Novel Optical Probing Technology for Flip-Chip Packaged Microprocessors

2000 ◽  
Author(s):  
Wai Mun Yee ◽  
Mario Paniccia ◽  
Travis Eiles ◽  
Valluri Rao
Keyword(s):  
Integrated Circuits ◽  
High Frequency ◽  
Flip Chip ◽  
Complementary Metal Oxide Semiconductor ◽  
Oxide Semiconductor ◽  
Ir Laser ◽  
Timing Measurement ◽  
Optical Probing ◽  
Probe Hole ◽  
Silicon Debug

Abstract A novel optical probing technique to measure voltage waveforms from flip-chip packaged complementary metal-oxide-semiconductor (CMOS) integrated circuits (IC) is described. This infrared (IR) laser based technique allows signal waveform acquisition and high frequency timing measurement directly from active PN junctions through the silicon backside substrate on IC’s mounted in flip-chip, stand-alone, or multi-chip module packages as well as wire-bond packages on which the chip backside is accessible. The technique significantly improves silicon debug & failure analysis (FA) through-put time (TPT) as compared to backside electron-beam (E-beam) probing because of the elimination of backside trenching and probe hole generation operations.

Transparent Heat Spreader for Backside Optical Analysis of High Power GHz-Scale Microprocessors

2000 ◽  
Author(s):  
Travis M. Eiles ◽  
Dean Hunt ◽  
David Chi
Keyword(s):  
High Power ◽  
Integrated Circuit ◽  
Flip Chip ◽  
Cooling System ◽  
Heat Spreader ◽  
Standard Configuration ◽  
Degree Of Stability ◽  
Optical Probing ◽  
System Requirements ◽  
High Degree

Abstract Optical probing using the Schlumberger IDS-2000 and other infrared-based analysis techniques have proved to be critical in the debug and analysis of flip-chip-packaged microprocessors. During probing, processors are operating with test patterns that generate a large amount of power. This article demonstrates a method for dissipating the generated heat based on a diamond window-based transparent heat spreader. This method controls the microprocessor temperature to a high degree of stability, and reduces thermal gradients across the die. Waveform results are excellent, and the transparent heat spreader provides a path for optical probing to be applied to the entire range of integrated circuit applications. The discussion covers cooling system requirements, and standard configuration specifications, and shows how the transparent heat spreader technique is effective for probing high power microprocessors.

Novel optical probing and micromachining techniques for silicon debug of flip chip packaged microprocessors

1999 ◽  
Vol 46 (1-4) ◽  
pp. 27-34 ◽  
Author(s):  
Mario Paniccia ◽  
T. Eiles ◽  
R. Livengood ◽  
V.R.M. Rao ◽  
P. Winer ◽  
...  
Keyword(s):  
Flip Chip ◽  
Optical Probing ◽  
Silicon Debug

Analysis of Characteristics of Halogen and LED Automobile Lamps

2020 ◽  
pp. 57-62
Author(s):  
Olga Yu. Kovalenko ◽  
Yulia A. Zhuravlyova
Keyword(s):  
Power Consumption ◽  
Flip Chip ◽  
Weather Conditions ◽  
Luminous Flux ◽  
Luminous Efficacy ◽  
Colour Temperature ◽  
Study Results ◽  
Calculation Results ◽  
Mandatory Rules ◽  
Halogen Lamps

This work contains analysis of characteristics of automobile lamps by Philips, KOITO, ETI flip chip LEDs, Osram, General Electric (GE), Gtinthebox, OSLAMPledbulbs with H1, H4, H7, H11 caps: luminous flux, luminous efficacy, correlated colour temperature. Characteristics of the studied samples are analysed before the operation of the lamps. The analysis of the calculation results allows us to make a conclusion that the values of correlated colour temperature of halogen lamps are close to the parameters declared by manufacturers. The analysis of the study results has shown that, based on actual values of correlated colour temperature, it is not advisable to use LED lamps in unfavourable weather conditions (such as rain, fog, snow). The results of the study demonstrate that there is a slight dispersion of actual values of luminous flux of halogen lamps by different manufacturers. Maximum variation between values of luminous flux of different lamps does not exceed 14 %. The analysis of the measurement results has shown that actual values of luminous flux of all halogen lamps comply with the mandatory rules specified in the UN/ECE Regulation No. 37 and luminous flux of LED lamps exceeds maximum allowable value by more than 8 %. Luminous efficacy of LED lamps is higher than that of halogen lamps: more than 82 lm/W and lower power consumption. The results of the measurements have shown that power consumption of a LED automobile lamp is lower than that of similar halogen lamps by 3 times and their luminous efficacy is higher by 5 times.

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