scholarly journals Macroscopic and microscopic studies of electrical properties of very thin silicon dioxide subject to electrical stress

Author(s):  
E. S. Daniel
1999 ◽  
Vol 592 ◽  
Author(s):  
R. Rodríguez ◽  
M. Nafría ◽  
E. Miranda ◽  
J. Suñé ◽  
X. Aymerich

ABSTRACTThe degradation and breakdown of thin silicon dioxide films has been analysed using a two-step stress method. This procedure allows the evaluation of the degradation induced by the electrical stress without any assumption about the microscopic nature of the degradation process. The method has been used to analyse and compare the degradation dynamics when constant-voltage (CVS) and constant-current stresses (CCS) are applied to the oxide. Moreover, it is shown that in the case of CVS, the fitting of the I-t characteristics can provide quantitative information about the degradation (degradation rate) and breakdown (mean-time-to-breakdown), without taking into account any degradation model.


1996 ◽  
Vol 43 (12) ◽  
pp. 2215-2226 ◽  
Author(s):  
M. Nafria ◽  
J. Sune ◽  
D. Yelamos ◽  
X. Aymerich

1989 ◽  
Author(s):  
A. Kalnitsky ◽  
S. P. Tay ◽  
J. P. Ellul ◽  
J. W. Andrews ◽  
E. A. Irene ◽  
...  

2019 ◽  
Vol 963 ◽  
pp. 490-493
Author(s):  
Tomasz Sledziewski ◽  
Tobias Erlbacher ◽  
Anton Bauer ◽  
Lothar Frey ◽  
Xi Ming Chen ◽  
...  

A comparison between self-aligned process (using lift-off) and Ni-SALICIDE used in fabrication of ohmic contacts for SiC Power MOSFET is done. Both processes are demonstrated for 3.3 kV SiC VDMOS transistors fabricated on 100 mm substrates. It is shown that the Ni-SALICIDE process with first silicidation at 500 °C does not degrade the electrical properties of silicon dioxide; particularly, a degradation of the interlayer dielectric between source and gate is not evident. Additionally, this first silicidation is found to have a positive impact on the specific resistance of contacts formed on p-type SiC using NiAl2.6% as an ohmic metal.


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