Dose rate and thermal budget optimization for ultrashallow junctions formed by low-energy (2–5 keV) ion implantation

Author(s):  
M. Craig
2001 ◽  
Vol 40 (Part 1, No. 4A) ◽  
pp. 2506-2507
Author(s):  
Jeonghee Cho ◽  
Seunghee Han ◽  
Yeonhee Lee ◽  
Ok Kyung Kim ◽  
Gon-Ho Kim ◽  
...  

2006 ◽  
Author(s):  
Ryuta Yamada ◽  
Singo Seto ◽  
Sosi Sato ◽  
Yuki Tanaka ◽  
Satoru Matumoto ◽  
...  

2010 ◽  
Vol 1250 ◽  
Author(s):  
Florence Gloux ◽  
Pierre-Eugène Coulon ◽  
Jesse Groenen ◽  
Sylvie Schamm ◽  
Gerard Benassayag ◽  
...  

AbstractThe fabrication of Si nanocrystals (NCs) in multilayer structures based on HfO2 and alloys for memory applications is carried out using an innovative method, the ultra-low energy (1 keV) ion implantation followed by a post-implantation annealing. Si+ ions are implanted into SiO2 thin layers deposited on top of thin HfO2-based layers. After annealing at high temperature (1050°C), the implantation leads to the formation of a two dimensional array of Si NCs at a distance from the surface larger than expected, due to an anomalous oxidation of the implanted Si. Nevertheless, the best memory windows are obtained at lower thermal budget, when no nanocrystals are present in the layer. This suggests that electrical measurements should always be correlated to structural characterization in order to understand where charge storage occurs.


1989 ◽  
Vol 147 ◽  
Author(s):  
E. Myers ◽  
J. J. Hren

AbstractRecent results indicate that thermal budgets associated with ion implantation induced end of range damage removal is affected by the presence of a free surface. Low energy BF2 implants (6 keV) were done into both single crystal and Ge preamorphized silicon substrates. Rapid thermal processing was used to study the residual end of range defect structure in the temperature range from 700 to 1000°C. 6 keV, 5E14 cm-2 BF2 implantation resulted in formation of continuous amorphous layers approximately 10 nm deep with a mean B penetration of approximately 7 nm. Conventional TEM analysis found the structures to be completely free of any spanning “hairpin” dislocations or stacking faults associated with the BF2 implant for all the annealing temperatures. For anneals between 700 °C and 900°C end of range damage formation resulted, but the size of the dislocation loops remained small. Annealing at 1000°C, 10 seconds showed no evidence of residual end of range damage. Location of the end of range damage region close to the free surface was found to decrease the thermal budget required for the removal of ion implantation induced radiation damage.


Author(s):  
A. I. Ryabchikov ◽  
A. I. Ivanova ◽  
O. S. Korneva ◽  
D. O. Sivin

2021 ◽  
Vol 640 (3) ◽  
pp. 032006
Author(s):  
U A Bliznyuk ◽  
P Yu Borchegovskaya ◽  
A P Chernyaev ◽  
V S Ipatova ◽  
V A Leontiev ◽  
...  

1986 ◽  
Vol 97 (2) ◽  
pp. K135-K139 ◽  
Author(s):  
J. Bollmann ◽  
H. Klose ◽  
A. Mertens
Keyword(s):  

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