Use of a variable shaped beam electron lithography system for diffractive optics components manufacturing

Author(s):  
Jacques Trotel
1984 ◽  
Vol 2 (4) ◽  
pp. 259-279 ◽  
Author(s):  
B.J.G.M. Roelofs ◽  
J.E. Barth

Author(s):  
H. C. Pfeiffer

A variety of beam shaping techniques are described which we have developed to overcome writing speed limitations inherent to the serial exposure of scanning electron beam lithography systems. We will present experimental results demonstrating the technical feasibility of the various shaping techniques. Figure 1 illustrates E-beam pattern generation by a Gaussian round beam and various shaped beam configurations. The SEM-type, Gaussian round beam exposes one image point at a time. The size of the beam spot is identical with the spatial resolution of the system and is typically 4 to 5 times smaller than the minimum pattern features. For shaped-beam systems, the spatial resolution given by the edge slope of the beam profile is decoupled from the size and shape of the beam spot. Consequently, a plurality of image points can be projected in parallel without loss of resolution. This combination of scanning and projection techniques provides a fast exposure rate without sacrificing the flexibility of computer-controlled pattern generation.


1989 ◽  
Author(s):  
W. B. Thompson ◽  
Y. Nakagawa ◽  
M. Hassel Shearer ◽  
H. Nakazawa ◽  
H. Takemura ◽  
...  

Author(s):  
K. Ishizuka

The technique of convergent-beam electron diffraction (CBED) has been established. However there is a distinct discrepancy concerning the CBED pattern symmetries associated with translation symmetries parallel to the incident beam direction: Buxton et al. assumed no detectable effects of translation components, while Goodman predicted no associated symmetries. In this report a procedure used by Gjønnes & Moodie1 to obtain dynamical extinction rules will be extended in order to derive the CBED pattern symmetries as well as the dynamical extinction rules.


Author(s):  
J. K. Maurin

Conductor, resistor, and dielectric patterns of microelectronic device are usually defined by exposure of a photosensitive material through a mask onto the device with subsequent development of the photoresist and chemical removal of the undesired materials. Standard optical techniques are limited and electron lithography provides several important advantages, including the ability to expose features as small as 1,000 Å, and direct exposure on the wafer with no intermediate mask. This presentation is intended to report how electron lithography was used to define the permalloy patterns which are used to manipulate domains in magnetic bubble memory devices.The electron optical system used in our experiment as shown in Fig. 1 consisted of a high resolution scanning electron microscope, a computer, and a high precision motorized specimen stage. The computer is appropriately interfaced to address the electron beam, control beam exposure, and move the specimen stage.


Author(s):  
John F. Mansfield

One of the most important advancements of the transmission electron microscopy (TEM) in recent years has been the development of the analytical electron microscope (AEM). The microanalytical capabilities of AEMs are based on the three major techniques that have been refined in the last decade or so, namely, Convergent Beam Electron Diffraction (CBED), X-ray Energy Dispersive Spectroscopy (XEDS) and Electron Energy Loss Spectroscopy (EELS). Each of these techniques can yield information on the specimen under study that is not obtainable by any other means. However, it is when they are used in concert that they are most powerful. The application of CBED in materials science is not restricted to microanalysis. However, this is the area where it is most frequently employed. It is used specifically to the identification of the lattice-type, point and space group of phases present within a sample. The addition of chemical/elemental information from XEDS or EELS spectra to the diffraction data usually allows unique identification of a phase.


Author(s):  
J W Steeds

That the techniques of convergent beam electron diffraction (CBED) are now widely practised is evident, both from the way in which they feature in the sale of new transmission electron microscopes (TEMs) and from the frequency with which the results appear in the literature: new phases of high temperature superconductors is a case in point. The arrival of a new generation of TEMs operating with coherent sources at 200-300kV opens up a number of new possibilities.First, there is the possibility of quantitative work of very high accuracy. The small probe will essentially eliminate thickness or orientation averaging and this, together with efficient energy filtering by a doubly-dispersive electron energy loss spectrometer, will yield results of unsurpassed quality. The Bloch wave formulation of electron diffraction has proved itself an effective and efficient method of interpreting the data. The treatment of absorption in these calculations has recently been improved with the result that <100> HOLZ polarity determinations can now be performed on III-V and II-VI semiconductors.


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