An optical-heterodyne alignment technique for quarter-micron x-ray lithography

1989 ◽  
Vol 7 (6) ◽  
pp. 1971 ◽  
Author(s):  
Masanori Suzuki
Keyword(s):  
Optical Heterodyne ◽  
X Ray ◽  
Alignment Technique

A New Mask-To-Wafer Alignment Technique For Synchrotron Radiation X-Ray Lithography

1987 ◽  
Author(s):  
Junji Itoh ◽  
Toshihiko Kanayama ◽  
Nobufumi Atoda ◽  
Koichiro Hoh
Keyword(s):  
Synchrotron Radiation ◽  
X Ray ◽  
Alignment Technique

X-ray mask for optical heterodyne alignment

1994 ◽  
Author(s):  
Masanori Suzuki ◽  
Mitsuo Fukuda ◽  
F. Omata ◽  
H. Tsuyuzaki ◽  
Takashi Ohkubo ◽  
...  
Keyword(s):  
Optical Heterodyne ◽  
X Ray

Thermal Expansion of Low Dielectric Constant Thin Films by High-Resolution X-Ray Reflectivity

2005 ◽  
Vol 875 ◽  
Author(s):  
Kazuhiko Omote ◽  
Yoshiyasu Ito
Keyword(s):  
Thin Films ◽  
Thermal Expansion ◽  
Incident Angle ◽  
Sample Surface ◽  
X Ray ◽  
Low Dielectric ◽  
Alignment Technique ◽  
Small Change ◽  
Sample Alignment ◽  
Low K

AbstractBy introducing high precision sample alignment technique, repeatability of incident angle to the sample surface for x-ray reflectivity (XRR) measurement is achieved to be within 0.3 arcsec. As a result, film thickness and density are possible to be measured repeatability within 0.03% and density within 0.26%. This accuracy realized to detect very small change of thermal expansion of thin films. The coefficient of thermal expansions (CTE) for porous low-k films deposited by CVD method were measured up to 400°C. The obtained values are in the range from 40 to 80 x10-6 K-1 and they are very large compare to that of copper (16-20 x10-6 K-1).

A Vertical X-ray Stepper for SOR Lithography

1991 ◽  
Vol 3 (4) ◽  
pp. 346-353
Author(s):  
Sunao Ishihara ◽  
◽  
Atsunobu Une ◽  
Munenori Kanai ◽  
Masanori Suzuki ◽  
...  
Keyword(s):  
Optical Heterodyne ◽  
Air Bearing ◽  
X Ray ◽  
Thrust Bearings ◽  
Alignment System ◽  
Radial Thrust ◽  
Better Than

A vertical x-ray stepper for SOR lithography has been developed. The stepper exposes wafers in a normal atmosphere to vertically-scanned SOR with continuous alignment control during exposure. The key devices of the stepper are a vertical X-Y stage and an opticalheterodyne alignment system. The X-Y stage uses airlubricated components, including air bearing lead screws, linear sliders and radial/thrust bearings. The optical-heterodyne alignment system detects the displacement between the mask and wafer gratings with precision of 8.3nm. Several exposure experiments proved that the alignment capability is better than ±0.1μm for a 3σ-value.

Automatic Alignment Technique For X-Ray Lithography Using Moire Signals In Reflection

1986 ◽  
Author(s):  
Yoshiyuki Uchida ◽  
Masato Furukawa ◽  
Kazuhiro Hane ◽  
Shuzo Hattori
Keyword(s):  
X Ray ◽  
Automatic Alignment ◽  
Alignment Technique
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