Gallium arsenide and aluminum gallium arsenide reactive ion etching in boron trichloride/argon mixtures

Author(s):  
A. Scherer
1987 ◽  
Vol 62 (10) ◽  
pp. 4109-4113 ◽  
Author(s):  
Tohru Hara ◽  
Hidenori Suzuki ◽  
Akio Suga ◽  
Toshiyuki Terada ◽  
Nobuyuki Toyoda

1990 ◽  
Vol 190 ◽  
Author(s):  
M. S. Puttock ◽  
H. Thomas ◽  
D. V. Morgan ◽  
U. Rossow ◽  
D. R. T. Zahn ◽  
...  

2018 ◽  
Vol 1124 ◽  
pp. 041015 ◽  
Author(s):  
N Papež ◽  
D Sobola ◽  
A Gajdoš ◽  
Ľ Škvarenina ◽  
R Macků ◽  
...  

1989 ◽  
Vol 158 ◽  
Author(s):  
M. Meyyappan ◽  
R. C. Buggeln

ABSTRACTMagnetron reactive ion etching has been receiving much attention since it offers low pressure, and low bias etching conditions with little damage. We have developed a process model for this process and present simulation results for boron trichloride etching of GaAs. The computed etch rates are uniform in the center with higher rates at the edges of the wafer. Flow rates and pressure can be optimized to improve uniformity. The etch rates with the aid of the magnetron are shown to be higher than the rates tor conventional reactive ion etching.


1996 ◽  
Author(s):  
George F. McLane ◽  
Paul Cooke ◽  
Robert P. Moerkirk

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