Oxygen ion beam etching for pattern transfer

Author(s):  
H. Gokan
1985 ◽  
Vol 3 (4) ◽  
pp. 1844-1848 ◽  
Author(s):  
D. F. Moore ◽  
H. P. Dietrich ◽  
A. W. Kleinsasser ◽  
J. M. E. Harper

2011 ◽  
Vol 1282 ◽  
Author(s):  
Shuji Kiyohara ◽  
Masaya Kumagai ◽  
Yoshio Taguchi ◽  
Yoshinari Sugiyama ◽  
Yukiko Omata ◽  
...  

ABSTRACTWe have investigated the nanopatterning of chemical vapor deposited (CVD) diamond films in room-temperature nanoimprint lithography (RT-NIL), using a diamond nanodot mold. We have proposed the use of polysiloxane as an electron beam (EB) mask and RT-imprint resist materials. The diamond molds of cylinder dot using the RT-NIL process were fabricated with polysiloxane oxide mask in EB lithography technology. The dot in minimum diameter is 500 nm. The pitch between the dots is 2 μm, and dot has a height of about 600 nm. It was found that the optimum imprinting conditions for the RT-NIL : time from spin-coating to imprinting t1 of 1 min , pressure time t2 of 5 min, imprinting pressure P of 0.5 MPa. The imprint depth obtained after the press under their conditions was 500 nm. We carried out the RT-NIL process for the fabrication of diamond nanopit arrays, using the diamond nanodot molds that we developed. The resulting diamond nanopit arrays with 500 nm-diameter and 200 nm-depth after the electron cyclotron resonance (ECR) oxygen ion beam etching were fabricated. The diameter of diamond nanopit arrays was in good agreement with that of the diamond nanodot mold.


2021 ◽  
pp. 111559
Author(s):  
Takao Okabe ◽  
Tomoya Yano ◽  
Katsuyuki Yatagawa ◽  
Jun Taniguchi
Keyword(s):  
Ion Beam ◽  

1997 ◽  
Vol 490 ◽  
Author(s):  
L. Houlet ◽  
A. Rhallabi ◽  
G. Turban

ABSTRACTThe Ion Beam Etching (IBE) model is developed assuming the analogy between the evolution of hydrodynamic surfaces and that of vacuum-solid interfaces. The main physical phenomenon in the IBE is the ion sputtering where the transfer of ion energy to the surface allows to eject the surface atoms. The local etching rate is thus proportional to the energetic flux and to the sputtering yield. Mask erosion and shadowing are taken into account in the model. The angular dependence of the sputtering yield permits to underscore the faceting and trenching phenomena which respectively represent the formation of the facets in mask comers and the overetching in the trench sides. Besides, the effect of mask erosion on pattern transfer of both trench and mesa structures is studied. In comparison with the experimental profile, the simulated etching profile of the mesa, based on the IBE model, shows a good agreement.


1986 ◽  
Vol 75 ◽  
Author(s):  
William E. Vanderlinde ◽  
Arthur L. Ruoff

AbstractSurface fluorination of polyimide thin films during CF4 + O2 reactive ion beam etching (RIBE) was investigated. The removal of the fluorinated layer by a subsequent oxygen ion beam etch was also studied. Electron spectroscopy for chemical analysis (ESCA) and Rutherford backscattering spectrometry (RBS) detected a fluorinated surface layer on the order of 100 A thick. Fluorine atom concentration in the surface of the film (as measured by RBS) and the etch rate of the film were measured as a function of several experimental parameters: ion energy, ion current density, etch time, and gas composition. The results are compared with theoretical predictions of the total number of fluorine atoms retained in the film after etching.


2021 ◽  
Vol 34 (2) ◽  
pp. 133-138
Author(s):  
Takao Okabe ◽  
Katsuyuki Yatagawa ◽  
Kazuki Fujiwara ◽  
Jun Taniguchi

Sign in / Sign up

Export Citation Format

Share Document