Use of 2H-heptafluoropropane, 1-iodoheptafluoropropane, and 2-iodoheptafluoropropane for a high aspect ratio via etch in a high density plasma etch tool

1998 ◽  
Vol 16 (4) ◽  
pp. 2722-2724 ◽  
Author(s):  
Simon Karecki ◽  
Laura Pruette ◽  
Rafael Reif ◽  
Laurie Beu ◽  
Terry Sparks ◽  
...  
Keyword(s):  
Aspect Ratio ◽  
High Aspect Ratio ◽  
High Density ◽  
Plasma Etch ◽  
Density Plasma

Use of Novel Hydrofluorocarbon and Iodofluorocarbon Chemistries for a High Aspect Ratio Via Etch in a High Density Plasma Etch Tool

1998 ◽  
Vol 145 (12) ◽  
pp. 4305-4312 ◽  
Author(s):  
Simon Karecki ◽  
Laura Pruette ◽  
Rafael Reif ◽  
Terry Sparks ◽  
Laurie Beu ◽  
...  
Keyword(s):  
Aspect Ratio ◽  
High Aspect Ratio ◽  
High Density ◽  
Plasma Etch ◽  
Density Plasma

Introduction of a new high-density plasma reactor concept for high-aspect-ratio oxide etching

1993 ◽  
Author(s):  
Jeffrey Marks ◽  
K. Collins ◽  
C. L. Yang ◽  
David Groechel ◽  
Peter R. Keswick ◽  
...  
Keyword(s):  
Aspect Ratio ◽  
High Aspect Ratio ◽  
Plasma Reactor ◽  
High Density ◽  
Oxide Etching ◽  
Density Plasma
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