Wafer-level wet etching of high-aspect-ratio through silicon vias (TSVs) with high uniformity and low cost for silicon interposers with high-density interconnect of 3D packaging

2015 ◽  
Author(s):  
Liyi Li ◽  
Jiali Wu ◽  
C. P. Wong
Keyword(s):  
Aspect Ratio ◽  
High Aspect Ratio ◽  
Low Cost ◽  
High Density ◽  
Wet Etching ◽  
Wafer Level ◽  
Through Silicon Vias ◽  
High Uniformity ◽  
3D Packaging ◽  
Silicon Vias

scholarly journals Copper Electrodeposition in High Aspect Ratio Mesoscale Through-Silicon Vias: Scaling from Die Level to Wafer Level Plating

2020 ◽  
Vol MA2020-02 (25) ◽  
pp. 1787-1787
Author(s):  
Rebecca Pauline Schmitt ◽  
Lyle Alexander Menk ◽  
Matthew Jordan ◽  
Jason Christopher ◽  
Ehren Donel Baca ◽  
...  
Keyword(s):  
Aspect Ratio ◽  
High Aspect Ratio ◽  
Copper Electrodeposition ◽  
Wafer Level ◽  
Through Silicon Vias ◽  
Silicon Vias

Innovative polyimide liner deposition method for high-aspect-ratio and high-density through-silicon-vias (TSVs)

2016 ◽  
Vol 149 ◽  
pp. 78-84 ◽  
Author(s):  
Yingtao Ding ◽  
Miao Xiong ◽  
Yangyang Yan ◽  
Shiwei Wang ◽  
Qianwen Chen ◽  
...  
Keyword(s):  
Aspect Ratio ◽  
High Aspect Ratio ◽  
High Density ◽  
Deposition Method ◽  
Through Silicon Vias ◽  
Silicon Vias

Process Development and Optimization for 3 $\mu \text{m}$ High Aspect Ratio Via-Middle Through-Silicon Vias at Wafer Level

2015 ◽  
Vol 28 (4) ◽  
pp. 454-460 ◽  
Author(s):  
Dingyou Zhang ◽  
Daniel Smith ◽  
Gopal Kumarapuram ◽  
Rudy Giridharan ◽  
Shinichiro Kakita ◽  
...  
Keyword(s):  
Aspect Ratio ◽  
High Aspect Ratio ◽  
Process Development ◽  
Wafer Level ◽  
Through Silicon Vias ◽  
Silicon Vias

Fabrication and electrical characterization of high aspect ratio poly-silicon filled through-silicon vias

2012 ◽  
Vol 22 (5) ◽  
pp. 055021 ◽  
Author(s):  
Pradeep Dixit ◽  
Tapani Vehmas ◽  
Sami Vähänen ◽  
Philippe Monnoyer ◽  
Kimmo Henttinen
Keyword(s):  
Aspect Ratio ◽  
High Aspect Ratio ◽  
Electrical Characterization ◽  
Through Silicon Vias ◽  
Poly Silicon ◽  
Silicon Vias

scholarly journals Tailoring femtosecond 1.5-μm Bessel beams for manufacturing high-aspect-ratio through-silicon vias

2017 ◽  
Vol 7 (1) ◽  
Author(s):  
Fei He ◽  
Junjie Yu ◽  
Yuanxin Tan ◽  
Wei Chu ◽  
Changhe Zhou ◽  
...  
Keyword(s):  
Aspect Ratio ◽  
High Aspect Ratio ◽  
Bessel Beams ◽  
Through Silicon Vias ◽  
Silicon Vias
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