Infinite etch selectivity and line edge roughness variation during etching of silicon oxynitride with an extreme ultraviolet resist pattern in dual-frequency CH2F2∕H2∕Ar capacitively coupled plasmas
2010 ◽
Vol 28
(1)
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pp. 120-127
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Keyword(s):
2010 ◽
Vol 157
(1)
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pp. D21
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2015 ◽
Vol 33
(2)
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pp. 021310
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Keyword(s):
2011 ◽
Vol 50
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pp. 036504
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2011 ◽
Vol 50
(3R)
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pp. 036001
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Keyword(s):
2012 ◽
Vol 51
(8R)
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pp. 086504
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2015 ◽
Vol 33
(3)
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pp. 031302
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2012 ◽
Vol 51
◽
pp. 086504
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2015 ◽
Vol 14
(4)
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pp. 043506
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