Thermal stability of chemical vapor deposition grown W and WN[sub x] thin films in low-k integration structure

Author(s):  
Sungho Jeon ◽  
Kijung Yong ◽  
Sung-Gyu Park ◽  
Shi-Woo Rhee
2000 ◽  
Vol 15 (1) ◽  
pp. 228-230 ◽  
Author(s):  
Jongryang Joo ◽  
Yong Chun Quan ◽  
Donggeun Jung

Effects of plasma power on the properties of polymerlike organic thin films deposited by plasma-enhanced chemical vapor deposition using the toluene precursor were studied. As the plasma power was increased from 5 to 60 W, the relative dielectric constant increased from 2.53 to 2.85. The film deposited at higher plasma power showed higher thermal stability. The film deposited at 60 W was stable up to 400 °C. All the films were insulating under applied field ≤1 MV/cm.


1991 ◽  
Vol 70 (3) ◽  
pp. 1416-1420 ◽  
Author(s):  
S. R. Stiffler ◽  
J. H. Comfort ◽  
C. L. Stanis ◽  
D. L. Harame ◽  
E. de Frésart ◽  
...  

ChemInform ◽  
2007 ◽  
Vol 38 (2) ◽  
Author(s):  
J. Yu ◽  
Z. Zheng ◽  
H. C. Ong ◽  
K. Y. Wong ◽  
S. Matsumoto ◽  
...  

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