Critical tasks in high aspect ratio silicon dry etching for microelectromechanical systems

2003 ◽  
Vol 21 (4) ◽  
pp. 1550-1562 ◽  
Author(s):  
Ivo W. Rangelow
2017 ◽  
Vol 180 ◽  
pp. 20-24 ◽  
Author(s):  
Y. Lisunova ◽  
M. Spieser ◽  
R.D.D. Juttin ◽  
F. Holzner ◽  
J. Brugger

MRS Bulletin ◽  
2001 ◽  
Vol 26 (4) ◽  
pp. 307-308 ◽  
Author(s):  
Stella W. Pang

Many microelectromechanical systems (MEMS) use the changing capacitance of movable parallel plates to drive and sense motion. An increase in this capacitance improves the performance of these micromechanical structures by means of increased electromechanical coupling for lower driving voltages and increased sensitivity of the micromechanical motion.


2017 ◽  
Vol 6 (4) ◽  
pp. P207-P210 ◽  
Author(s):  
Lunet E. Luna ◽  
Marko J. Tadjer ◽  
Travis J. Anderson ◽  
Eugene A. Imhoff ◽  
Karl D. Hobart ◽  
...  

1997 ◽  
Vol 36 (Part 1, No. 12B) ◽  
pp. 7642-7645 ◽  
Author(s):  
Tomohiro Shibata ◽  
Tetsuyoshi Ishii ◽  
Hiroshi Nozawa ◽  
Toshiaki Tamamura

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