Print-Consistency and Process-Interaction for Inkjet-Printed Copper on Flexible Substrate

2021 ◽  
Author(s):  
Pradeep Lall ◽  
Kartik Goyal ◽  
Kyle Schulze ◽  
Curtis Hill
Keyword(s):  
Mechanical Properties ◽  
Inkjet Printing ◽  
Printed Electronics ◽  
Low Cost ◽  
Flexible Substrate ◽  
Large Area ◽  
Commercial Off The Shelf ◽  
Traditional Manufacturing ◽  
Print Process ◽  
Photonic Sintering

Abstract Printed electronics is a fastest growing and emerging technology that have shown much potential in several industries including automotive, wearables, healthcare, and aerospace. Its applications can be found not only in flexible but also in large area electronics. The technology provides an effective and convenient method to additively deposit conductive and insulating materials on any type of substrate. Comparing with traditional manufacturing processes, which involves chemical etching, this technology also comes to be relatively environmental friendly. Despite its status, it is not without its challenges. Starting from the material being compatible in the printer equipment to the point of achieving fine resolutions, and with excellent properties are some of the challenges that printed electronics face. Among the myriad of printing technologies such as Aerosol Jet, micro-dispensing, gravure printing, screen printing, Inkjet printing, Inkjet has gained much attention due to its low-cost, low material consumption, and roll-to-roll capability for mass manufacturing. The technology has been widely used in home and office, but recently gained interest in printed electronics in a research and development setting. Conductive materials used in Inkjet printing generally comprises of metal Nanoparticles that need to be thermally sintered for it to be conductive. The preferred metal of choice has been mostly silver due to its excellent electrical properties and ease in sintering. However, silver comes to be expensive than its counterpart copper. Since copper is prone to oxidation, much focus has been given towards photonic sintering that involves sudden burst of pulsed light at certain energy to sinter the copper Nanoparticles. With this technique, only the printed material gets sintered in a matter of seconds without having a great impact on its substrate, due to which it is also preferred in low temperature applications. With all the knowledge, there is still a large gap in the process side with copper where it is important to look how the print process affects the resolution of the print along with the effect of post-print processes on electrical and mechanical properties. In this paper, a copper Inkjet ink is utilized for understanding the effect of Inkjet print parameters on the ejected droplet and its resolution. Post-print process is also quantified using a photonic sintering equipment for excellent electrical and mechanical properties. To demonstrate the complete process, commercial-off-the-shelf components will also be mounted on the additively printed pads via Inkjet. Statistically, control charting technique will be utilized to understand the capability of the Inkjet process.

Inkjet-Printing of Methylammonium Lead Trihalide Perovskite as Active Layers for Optoelectronic Devices

MRS Advances ◽  
2018 ◽  
Vol 3 (32) ◽  
pp. 1837-1842 ◽  
Author(s):  
Charles Trudeau ◽  
Martin Bolduc ◽  
Patrick Beaupré ◽  
Jaime Benavides-Guerrero ◽  
Bruno Tremblay ◽  
...  
Keyword(s):  
Flexible Electronics ◽  
Inkjet Printing ◽  
Printed Electronics ◽  
Low Cost ◽  
Hole Transport ◽  
Ambient Atmosphere ◽  
Large Area ◽  
Device Architecture ◽  
Active Layers ◽  
Metal Organic

ABSTRACTNew routes in additive devices fabrication techniques and advances in printable materials are required to meet the ever increasing demands for low-cost and large-area flexible electronics. In particular, perovskite-based materials have gained an appeal due to their unique optoelectronics and ferroelectrics properties, which may replace p-n junction in semiconductor devices. Metal-organic methylammonium lead trihalide perovskite formulations have been extensively studied in the last few years as promising materials for use in printed electronics, which do not require high temperatures or vacuum environment, contrary to conventional semiconductor fabrication techniques. In this work, digital inkjet-printing in ambient atmosphere is proposed as a deposition pathway for the fabrication of perovskite active layers in photodetector and thin-film photovoltaic device architectures. The device architecture containing a printed perovskite active layer sandwiched between TiO2 and Spiro-OMeTAD as electron and hole transport layers, respectively, as well as layer-on-layer fabrication and responsivity spectra of the perovskite-based device are presented.

Toward Manufacturing Low-Cost, Large-Area Electronics

MRS Bulletin ◽  
2006 ◽  
Vol 31 (6) ◽  
pp. 471-475 ◽  
Author(s):  
Marc Chason ◽  
Daniel R. Gamota ◽  
Paul W. Brazis ◽  
Krishna Kalyanasundaram ◽  
Jie Zhang ◽  
...  
Keyword(s):  
Printed Electronics ◽  
Low Cost ◽  
Consumer Products ◽  
Electronic Systems ◽  
Printed Wiring Board ◽  
Large Area ◽  
Active Devices ◽  
Materials Research ◽  
Wiring Board ◽  
Large Area Electronics

AbstractDevelopments originally targeted toward economical manufacturing of telecommunications products have planted the seeds for new opportunities such as low-cost, large-area electronics based on printing technologies. Organic-based materials systems for printed wiring board (PWB) construction have opened up unique opportunities for materials research in the fabrication of modular electronic systems.The realization of successful consumer products has been driven by materials developments that expand PWB functionality through embedded passive components, novel MEMS structures (e.g., meso-MEMS, in which the PWB-based structures are at the milliscale instead of the microscale), and microfluidics within the PWB. Furthermore, materials research is opening up a new world of printed electronics technology, where active devices are being realized through the convergence of printing technologies and microelectronics.

An Investigation onto Polydimethylsiloxane (PDMS) Printing Plate of Multiple Functional Solid Line by Flexographic

2013 ◽  
Vol 844 ◽  
pp. 158-161 ◽  
Author(s):  
M.I. Maksud ◽  
Mohd Sallehuddin Yusof ◽  
M. Mahadi Abdul Jamil
Keyword(s):  
Laser Ablation ◽  
Line Width ◽  
High Speed ◽  
Printed Electronics ◽  
Low Cost ◽  
Flexible Substrates ◽  
Large Area ◽  
Printing Plate ◽  
Roll To Roll ◽  
Printing Processes

Recently low cost production is vital to produce printed electronics by roll to roll manufacturing printing process like a flexographic. Flexographic has a high speed technique which commonly used for printing onto large area flexible substrates. However, the minimum feature sizes achieved with roll to roll printing processes, such as flexographic is in the range of fifty microns. The main contribution of this limitation is photopolymer flexographic plate unable to be produced finer micron range due to film that made by Laser Ablation Mask (LAMs) technology not sufficiently robust and consequently at micron ranges line will not be formed on the printing plate. Hence, polydimethylsiloxane (PDMS) is used instead of photopolymer. Printing trial had been conducted and multiple solid lines successfully printed for below fifty microns line width with no interference between two adjacent lines of the printed images.

Liquid Metal Printing for Manufacturing Large-Scale Flexible Electronic Circuits

2014 ◽  
Author(s):  
Yi Zheng ◽  
Zhi-Zhu He ◽  
Jun Yang ◽  
Jing Liu
Keyword(s):  
Liquid Metal ◽  
Large Scale ◽  
High Efficiency ◽  
Printed Electronics ◽  
Low Cost ◽  
Treatment Temperature ◽  
Consumer Electronics ◽  
Plastic Substrate ◽  
Electronic Circuits ◽  
Large Area

The advancement of printed electronics technology has significantly facilitated the development of electronic engineering. However, so far there still remain big barriers to impede the currently available printing technologies from being extensively used. Many of the difficulties came from the factors like: complicated ink-configurations, high post-treatment temperature, poor conductivity in room temperature and extremely high cost and time consuming fabrication process. From an alternative strategy, our recently invented desktop liquid metal printer offered a flexible way to better address the above deficiencies. Through modifying the system developed in the authors’ lab, here we demonstrated the feasibility of the method in quickly and reliably printing out various large area electronic circuits. Particularly, the liquid metal ink made of GaIn24.5 alloy, with a high electrical resistivity of 2.98×10−7 Ω·m, can be rapidly printed on polyvinyl chloride (PVC) substrate with maximum sizes spanning from centimeter size to meter large. Most important of all, all these manufactures were achieved at an extremely low cost level which clearly shows the ubiquitous value of the liquid metal printer. To evaluate the working performance of the present electronics fabrication method, the electrical resistance and wire width of the printed circuits were investigated under multiple overprinting cycles. For practical illustration purpose, LED lighting conductive patterns which can serve as a functional electronic decoration art were fabricated on the flexible plastic substrate. The present work sets up an example for directly making large-scale ending consumer electronics via a high-efficiency and low-cost way.

scholarly journals Printable anisotropic magnetoresistance sensors for highly compliant electronics

2021 ◽  
Vol 127 (4) ◽  
Author(s):  
Eduardo Sergio Oliveros Mata ◽  
Gilbert Santiago Cañón Bermúdez ◽  
Minjeong Ha ◽  
Tobias Kosub ◽  
Yevhen Zabila ◽  
...  
Keyword(s):  
Printed Electronics ◽  
Low Cost ◽  
Anisotropic Magnetoresistance ◽  
Large Area ◽  
Mylar Foil ◽  
Magnetoresistive Sensors ◽  
Bending Radius ◽  
Mechanical Bending

AbstractPrinted electronics are attractive due to their low-cost and large-area processing features, which have been successfully extended to magnetoresistive sensors and devices. Here, we introduce and characterize a new kind of magnetoresistive paste based on the anisotropic magnetoresistive (AMR) effect. The paste is a composite of 100-nm-thick permalloy/tantalum flakes embedded in an elastomer matrix, which promotes the formation of appropriately conductive percolation networks. Sensors printed with this paste showed stable magnetoresistive properties upon mechanical bending. The AMR value of this sensor is $$0.34\%$$ 0.34 % in the field of 400 mT. Still, the response is stable and allows to resolve sub-mT field steps. When printed on ultra-thin 2.5-$$\upmu \hbox {m}$$ μ m -thick Mylar foil, the sensor can be completely folded without losing magnetoresistive performance and mechanically withstand $$20\, \upmu {\hbox {m}}$$ 20 μ m bending radius. The developed compliant printed AMR sensor would be attractive to implement on curved and/or dynamic bendable surfaces for on-skin applications and interactive printed electronics.

Development of Silver Nanoparticle Ink for Printed Electronics

2012 ◽  
Vol 2012 (1) ◽  
pp. 000935-000939
Author(s):  
Yiliang Wu ◽  
Ping Liu ◽  
Tony Wigglesworth
Keyword(s):  
Silver Nanoparticles ◽  
Silver Nanoparticle ◽  
Self Assembly ◽  
High Performance ◽  
Printed Electronics ◽  
Low Cost ◽  
High Conductivity ◽  
Large Area ◽  
Electrical Stability ◽  
Nanoparticle Ink

Printable conductors with high conductivity would be critical for low-cost printed electronics. In view of printability, conductivity, and electrical stability, metal such as gold or silver derived from solution-deposited precursor compositions would be an ideal candidate. Xerox has been exploring the use of silver nanoparticles as conductor precursor composition for printed electronics. This paper reviews our research in the development of alkylamine-stabilized silver nanoparticles that can be sintered at low temperature (∼ 120 °C) for high conductivity (>10000 S/cm). Silver nanoparticle ink formulations based on these silver nanoparticles exhibit surface-energy independent printability which enables the fabrication of high-performance top-contact transistor devices, and self-assembly characteristic when printed on hydrophilic substrates which allows for large-area, defect-free source drain arrays to be printed with a narrow and uniform channel length.

Inkjet printing and photonic sintering of silver and copper oxide nanoparticles for ultra-low-cost conductive patterns

2016 ◽  
Vol 4 (16) ◽  
pp. 3546-3554 ◽  
Author(s):  
Andreas Albrecht ◽  
Almudena Rivadeneyra ◽  
Alaa Abdellah ◽  
Paolo Lugli ◽  
José F. Salmerón
Keyword(s):  
Copper Oxide ◽  
Inkjet Printing ◽  
Low Cost ◽  
Electronic Devices ◽  
Copper Oxide Nanoparticles ◽  
Oxide Nanoparticles ◽  
Post Processing ◽  
Processing Methods ◽  
Conductive Films ◽  
Photonic Sintering

Printing technologies to produce conductive films and electronic devices are well established and employ only inexpensive materials and devices as well as rapid post-processing methods.

scholarly journals Inkjet Printing of Polyacrylic Acid-Coated Silver Nanoparticle Ink onto Paper with Sub-100 Micron Pixel Size

Materials ◽  
2019 ◽  
Vol 12 (14) ◽  
pp. 2277 ◽  
Author(s):  
Mavuri ◽  
Mayes ◽  
Alexander
Keyword(s):  
High Resolution ◽  
Silver Nanoparticle ◽  
Inkjet Printing ◽  
Polyacrylic Acid ◽  
Room Temperature ◽  
Printed Electronics ◽  
Low Cost ◽  
Electrical Performance ◽  
Print Quality ◽  
Single Pass

Printed electronics (PE) technology shows huge promise for the realisation of low-cost and flexible electronics, with the ability to pattern heat- or pressure-sensitive materials. In future developments of the PE market, the ability to produce highly conductive, high-resolution patterns using low-cost and roll-to-roll processes, such as inkjet printing, is a critical technology component for the fabrication of printed electronics and displays. Here, we demonstrate inkjet printing of polyacrylic acid (PAA) capped silver nanoparticle dispersions onto paper for high-conductivity electronic interconnects. We characterise the resulting print quality, feature geometry and electrical performance of inkjet patterned features and demonstrate the high-resolution printing, sub-100 micron feature size, of silver nanoparticle materials onto flexible paper substrate. Printed onto photo-paper, these materials then undergo chemically triggered sintering on exposure to chloride contained in the paper. We investigated the effect of substrate temperature on the properties of printed silver material from room temperature to 50 °C. At room temperature, the resistivity of single layer printed features, of average thickness of 500 nm and width 85 µm, was found to be 2.17 × 10−7 Ω·m or 13 times resistivity of bulk silver (RBS). The resistivity initially decreased with an increase in material thickness, when achieved by overprinting successive layers or by decreasing print pitch, and a resistivity of around 10 times RBS was observed after overprinting two times at pitch 75 µm and with single pass print pitch of between 60 and 80 µm, resulting in line thickness up to 920 nm. On further increases in thickness the resistivity increased and reached 27 times RBS at print pitch of 15 µm. On moderate heating of the substrate to 50 °C, more compact silver nanoparticle films were formed, reducing thickness to 200 nm from a single pass print, and lower material resistivity approaching five times RBS was achieved.

Direct Patterning by Inkjet Printing 3-Mercaptopropionic Capped Nano Silver Suspension

2011 ◽  
Vol 409 ◽  
pp. 508-513
Author(s):  
Yu Feng Liu ◽  
Weng Sing Hwang ◽  
Yen Fang Pai ◽  
Ming Hsu Tsai
Keyword(s):  
Inkjet Printing ◽  
Printed Electronics ◽  
Low Cost ◽  
Specific Area ◽  
Direct Patterning ◽  
Printing Technique ◽  
Fast Processing ◽  
One Step ◽  
Circuit Components ◽  
Printed Patterns

All-printed electronics as a mean of fast processing and achieving ultra-low-cost electronic devices has attracted great interest in recent years. Inkjet printing has excelled as the most promising technique by which the circuit components can be directly drawn on the specific area in one step. Furthermore, the low temperature reduction processes can be achieved by exploit the low-melting point characteristic of nanometallic particles. The inkjet printing technique to deposit silver nanoparticles (3.39±1.21 nm) capped by saturated 3-Mercaptopropionic acid onto silicon substrate was studied. The silver patterns were tested for its functionality as circuit components like conductor, resistor and capacitor. All components can be produced simply by thermal annealing of an inkjet printed patterns under an atmosphere of 90% N2-10% H2 at 300°C for 1 hr.

scholarly journals Inkjet-Printed Highly Conductive Poly(3,4-ethylenedioxythiophene): Poly(styrenesulfonate) Electrode for Organic Light-Emitting Diodes

Micromachines ◽  
2021 ◽  
Vol 12 (8) ◽  
pp. 889
Author(s):  
Yadong Liu ◽  
Juxuan Xie ◽  
Lihui Liu ◽  
Kai Fan ◽  
Zixuan Zhang ◽  
...  
Keyword(s):  
Inkjet Printing ◽  
Indium Tin Oxide ◽  
Light Emitting Diode ◽  
Low Cost ◽  
Large Area ◽  
Printing Technology ◽  
Light Emitting ◽  
Drop On Demand ◽  
Organic Light ◽  
Inkjet Printing Technology

Recently, inkjet printing technology has attracted much attention due to the advantages of drop-on-demand deposition, low-cost and large-area production for organic light-emitting diode (OLED) displays. However, there are still some problems in industrial production and practical application, such as the complexity of ink modulation, high-quality films with homogeneous morphology, and the re-dissolution phenomenon at interfaces. In this work, a printable poly(3,4-ethylenedioxythiophene): poly(styrenesulfonate) (PEDOT:PSS) ink is developed and obtains an adjustable viscosity. Finally, a patterned PEDOT:PSS electrode is fabricated by inkjet printing, and achieves a high conductivity of 1213 S/cm, a transparency of 86.8% and a uniform morphology without coffee-ring effect. Furthermore, the vacuum-evaporated and solution-processed OLEDs are fabricated based on this electrode and demonstrate a current efficiency of 61 cd/A, which is comparable to that of the indium tin oxide counterpart. This work confirms the feasibility of inkjet printing technology to prepare patterned electrodes and expects that it can be used to fabricate highly efficient optoelectronic devices.

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