Inkjet-Printing of Methylammonium Lead Trihalide Perovskite as Active Layers for Optoelectronic Devices

MRS Advances ◽  
2018 ◽  
Vol 3 (32) ◽  
pp. 1837-1842 ◽  
Author(s):  
Charles Trudeau ◽  
Martin Bolduc ◽  
Patrick Beaupré ◽  
Jaime Benavides-Guerrero ◽  
Bruno Tremblay ◽  
...  
Keyword(s):  
Flexible Electronics ◽  
Inkjet Printing ◽  
Printed Electronics ◽  
Low Cost ◽  
Hole Transport ◽  
Ambient Atmosphere ◽  
Large Area ◽  
Device Architecture ◽  
Active Layers ◽  
Metal Organic

ABSTRACTNew routes in additive devices fabrication techniques and advances in printable materials are required to meet the ever increasing demands for low-cost and large-area flexible electronics. In particular, perovskite-based materials have gained an appeal due to their unique optoelectronics and ferroelectrics properties, which may replace p-n junction in semiconductor devices. Metal-organic methylammonium lead trihalide perovskite formulations have been extensively studied in the last few years as promising materials for use in printed electronics, which do not require high temperatures or vacuum environment, contrary to conventional semiconductor fabrication techniques. In this work, digital inkjet-printing in ambient atmosphere is proposed as a deposition pathway for the fabrication of perovskite active layers in photodetector and thin-film photovoltaic device architectures. The device architecture containing a printed perovskite active layer sandwiched between TiO2 and Spiro-OMeTAD as electron and hole transport layers, respectively, as well as layer-on-layer fabrication and responsivity spectra of the perovskite-based device are presented.

Print-Consistency and Process-Interaction for Inkjet-Printed Copper on Flexible Substrate

2021 ◽  
Author(s):  
Pradeep Lall ◽  
Kartik Goyal ◽  
Kyle Schulze ◽  
Curtis Hill
Keyword(s):  
Mechanical Properties ◽  
Inkjet Printing ◽  
Printed Electronics ◽  
Low Cost ◽  
Flexible Substrate ◽  
Large Area ◽  
Commercial Off The Shelf ◽  
Traditional Manufacturing ◽  
Print Process ◽  
Photonic Sintering

Abstract Printed electronics is a fastest growing and emerging technology that have shown much potential in several industries including automotive, wearables, healthcare, and aerospace. Its applications can be found not only in flexible but also in large area electronics. The technology provides an effective and convenient method to additively deposit conductive and insulating materials on any type of substrate. Comparing with traditional manufacturing processes, which involves chemical etching, this technology also comes to be relatively environmental friendly. Despite its status, it is not without its challenges. Starting from the material being compatible in the printer equipment to the point of achieving fine resolutions, and with excellent properties are some of the challenges that printed electronics face. Among the myriad of printing technologies such as Aerosol Jet, micro-dispensing, gravure printing, screen printing, Inkjet printing, Inkjet has gained much attention due to its low-cost, low material consumption, and roll-to-roll capability for mass manufacturing. The technology has been widely used in home and office, but recently gained interest in printed electronics in a research and development setting. Conductive materials used in Inkjet printing generally comprises of metal Nanoparticles that need to be thermally sintered for it to be conductive. The preferred metal of choice has been mostly silver due to its excellent electrical properties and ease in sintering. However, silver comes to be expensive than its counterpart copper. Since copper is prone to oxidation, much focus has been given towards photonic sintering that involves sudden burst of pulsed light at certain energy to sinter the copper Nanoparticles. With this technique, only the printed material gets sintered in a matter of seconds without having a great impact on its substrate, due to which it is also preferred in low temperature applications. With all the knowledge, there is still a large gap in the process side with copper where it is important to look how the print process affects the resolution of the print along with the effect of post-print processes on electrical and mechanical properties. In this paper, a copper Inkjet ink is utilized for understanding the effect of Inkjet print parameters on the ejected droplet and its resolution. Post-print process is also quantified using a photonic sintering equipment for excellent electrical and mechanical properties. To demonstrate the complete process, commercial-off-the-shelf components will also be mounted on the additively printed pads via Inkjet. Statistically, control charting technique will be utilized to understand the capability of the Inkjet process.

Fabrication of 3D Temperature Sensor Using Magnetostrictive Inkjet Printhead

2020 ◽  
Vol 64 (5) ◽  
pp. 50405-1-50405-5
Author(s):  
Young-Woo Park ◽  
Myounggyu Noh
Keyword(s):  
Flexible Electronics ◽  
Inkjet Printing ◽  
Temperature Sensor ◽  
Computer Aided Design ◽  
Low Cost ◽  
Three Dimensional ◽  
Drop On Demand ◽  
Aided Design ◽  
Nanoparticle Ink ◽  
Inkjet Printhead

Abstract Recently, the three-dimensional (3D) printing technique has attracted much attention for creating objects of arbitrary shape and manufacturing. For the first time, in this work, we present the fabrication of an inkjet printed low-cost 3D temperature sensor on a 3D-shaped thermoplastic substrate suitable for packaging, flexible electronics, and other printed applications. The design, fabrication, and testing of a 3D printed temperature sensor are presented. The sensor pattern is designed using a computer-aided design program and fabricated by drop-on-demand inkjet printing using a magnetostrictive inkjet printhead at room temperature. The sensor pattern is printed using commercially available conductive silver nanoparticle ink. A moving speed of 90 mm/min is chosen to print the sensor pattern. The inkjet printed temperature sensor is demonstrated, and it is characterized by good electrical properties, exhibiting good sensitivity and linearity. The results indicate that 3D inkjet printing technology may have great potential for applications in sensor fabrication.

Toward Manufacturing Low-Cost, Large-Area Electronics

MRS Bulletin ◽  
2006 ◽  
Vol 31 (6) ◽  
pp. 471-475 ◽  
Author(s):  
Marc Chason ◽  
Daniel R. Gamota ◽  
Paul W. Brazis ◽  
Krishna Kalyanasundaram ◽  
Jie Zhang ◽  
...  
Keyword(s):  
Printed Electronics ◽  
Low Cost ◽  
Consumer Products ◽  
Electronic Systems ◽  
Printed Wiring Board ◽  
Large Area ◽  
Active Devices ◽  
Materials Research ◽  
Wiring Board ◽  
Large Area Electronics

AbstractDevelopments originally targeted toward economical manufacturing of telecommunications products have planted the seeds for new opportunities such as low-cost, large-area electronics based on printing technologies. Organic-based materials systems for printed wiring board (PWB) construction have opened up unique opportunities for materials research in the fabrication of modular electronic systems.The realization of successful consumer products has been driven by materials developments that expand PWB functionality through embedded passive components, novel MEMS structures (e.g., meso-MEMS, in which the PWB-based structures are at the milliscale instead of the microscale), and microfluidics within the PWB. Furthermore, materials research is opening up a new world of printed electronics technology, where active devices are being realized through the convergence of printing technologies and microelectronics.

An Investigation onto Polydimethylsiloxane (PDMS) Printing Plate of Multiple Functional Solid Line by Flexographic

2013 ◽  
Vol 844 ◽  
pp. 158-161 ◽  
Author(s):  
M.I. Maksud ◽  
Mohd Sallehuddin Yusof ◽  
M. Mahadi Abdul Jamil
Keyword(s):  
Laser Ablation ◽  
Line Width ◽  
High Speed ◽  
Printed Electronics ◽  
Low Cost ◽  
Flexible Substrates ◽  
Large Area ◽  
Printing Plate ◽  
Roll To Roll ◽  
Printing Processes

Recently low cost production is vital to produce printed electronics by roll to roll manufacturing printing process like a flexographic. Flexographic has a high speed technique which commonly used for printing onto large area flexible substrates. However, the minimum feature sizes achieved with roll to roll printing processes, such as flexographic is in the range of fifty microns. The main contribution of this limitation is photopolymer flexographic plate unable to be produced finer micron range due to film that made by Laser Ablation Mask (LAMs) technology not sufficiently robust and consequently at micron ranges line will not be formed on the printing plate. Hence, polydimethylsiloxane (PDMS) is used instead of photopolymer. Printing trial had been conducted and multiple solid lines successfully printed for below fifty microns line width with no interference between two adjacent lines of the printed images.

Integration of OLEDs in Textiles

2012 ◽  
Vol 80 ◽  
pp. 14-21 ◽  
Author(s):  
Silvia Janietz ◽  
Björn Gruber ◽  
Sylvia Schattauer ◽  
Kerstin Schulze
Keyword(s):  
Low Cost ◽  
Glass Fibers ◽  
Hole Transport ◽  
Light Sources ◽  
Electronic Textiles ◽  
Large Area ◽  
Solution Processed ◽  
Hole Transport Layers ◽  
First Results ◽  
Planar Substrates

In place of silicon, which is normally used in microelectronics, organic materials offer the opportunity to produce devices on large area, low-cost and plastic planar substrates. These materials are attracting increased attention also in the field of electronic-textiles (e-textiles) because they show an interesting combination of electronic and mechanical properties that can be favourably exploited in smart textiles. A key step for the integration of mass production of e-textiles is to combine electronic production with textile manufactures. In the last years, progress has been achieved in the development of fibers and their processing for application in e-textiles. The application ranged from fabric integrated light sources to low cost solid state lighting for protection and security. Here research results are presented regarding the integration of encapsulated glass OLEDs and additionally OLEDs fabricated on flexible high barrier substrates which were integrated into textiles. On the other hand, the first results concerning the realization of an OLED on cylindrical surfaces based on solution processed technologies which is a first step in the direction of low cost processing will be discussed. A simple, inverted planar construction prepared from solution was realized. This preliminary work was the precondition for the development of a fiber based OLED. In addition, OLEDs that were prepared using glass fibers as substrates and solution processed active and hole-transport layers will be shown.

Liquid Metal Printing for Manufacturing Large-Scale Flexible Electronic Circuits

2014 ◽  
Author(s):  
Yi Zheng ◽  
Zhi-Zhu He ◽  
Jun Yang ◽  
Jing Liu
Keyword(s):  
Liquid Metal ◽  
Large Scale ◽  
High Efficiency ◽  
Printed Electronics ◽  
Low Cost ◽  
Treatment Temperature ◽  
Consumer Electronics ◽  
Plastic Substrate ◽  
Electronic Circuits ◽  
Large Area

The advancement of printed electronics technology has significantly facilitated the development of electronic engineering. However, so far there still remain big barriers to impede the currently available printing technologies from being extensively used. Many of the difficulties came from the factors like: complicated ink-configurations, high post-treatment temperature, poor conductivity in room temperature and extremely high cost and time consuming fabrication process. From an alternative strategy, our recently invented desktop liquid metal printer offered a flexible way to better address the above deficiencies. Through modifying the system developed in the authors’ lab, here we demonstrated the feasibility of the method in quickly and reliably printing out various large area electronic circuits. Particularly, the liquid metal ink made of GaIn24.5 alloy, with a high electrical resistivity of 2.98×10−7 Ω·m, can be rapidly printed on polyvinyl chloride (PVC) substrate with maximum sizes spanning from centimeter size to meter large. Most important of all, all these manufactures were achieved at an extremely low cost level which clearly shows the ubiquitous value of the liquid metal printer. To evaluate the working performance of the present electronics fabrication method, the electrical resistance and wire width of the printed circuits were investigated under multiple overprinting cycles. For practical illustration purpose, LED lighting conductive patterns which can serve as a functional electronic decoration art were fabricated on the flexible plastic substrate. The present work sets up an example for directly making large-scale ending consumer electronics via a high-efficiency and low-cost way.

scholarly journals A Molecular Dynamics Simulation Study: The Inkjet Printing of Graphene Inks on Polyimide Substrates

2021 ◽  
Vol 8 ◽  
Author(s):  
Lingjun Wu ◽  
Wei Wang ◽  
Haitao Zhao ◽  
Libo Gao ◽  
Jibao Lu ◽  
...  
Keyword(s):  
Molecular Dynamics ◽  
Molecular Dynamics Simulation ◽  
Adhesion Strength ◽  
Simulation Study ◽  
Flexible Electronics ◽  
Inkjet Printing ◽  
Low Cost ◽  
Interfacial Instability ◽  
Atomic Scale ◽  
Dynamics Simulation

Inkjet printing-based 2D materials for flexible electronics have aroused much interest due to their highly low-cost customization and manufacturing resolution. However, there is a lack of investigation and essential understanding of the surface adhesion affected by the printing parameters at the atomic scale. Herein, we conducted a systematic molecular dynamics simulation investigating the inkjet printing of graphitic inks on polyimide substrates under various conditions. Simulations under different temperatures, inkjet velocities, and mechanical loadings such as pressure and deformation are performed. The results show that the best adhesion is achieved in the plasma-modified polyimide/graphene-oxide (mPI/GO) interfacial system (the interaction energy (Ein) between mPI and GO is ca. 1.2 times than with graphene). The adhesion strength decreases with increasing temperature, and higher inkjet velocities lead to both larger impact force as well as interfacial fluctuation, while the latter may result in greater interfacial instability. When loaded with pressure, the adhesion strength reaches a threshold without further improvement as continuing compacting of polymer slabs can hardly be achieved. The detachment of the interfaces was also explored and mPI/GO shows better resistance against delamination. Hopefully, our simulation study paves the way for future inkjet printing-based manufacturing of graphene-based flexible electronics.

scholarly journals PEDOT: PSS Thermoelectric Generators Printed on Paper Substrates

2019 ◽  
Vol 9 (2) ◽  
pp. 14 ◽  
Author(s):  
Henrik Andersson ◽  
Pavol Šuly ◽  
Göran Thungström ◽  
Magnus Engholm ◽  
Renyun Zhang ◽  
...  
Keyword(s):  
Flexible Electronics ◽  
Printed Electronics ◽  
Low Cost ◽  
Conductive Polymer ◽  
Dissimilar Materials ◽  
Electrical Energy ◽  
Thermoelectric Generators ◽  
Power Sources ◽  
Power Electronic Circuits ◽  
Paper Substrates

Flexible electronics is a field gathering a growing interest among researchers and companies with widely varying applications, such as organic light emitting diodes, transistors as well as many different sensors. If the circuit should be portable or off-grid, the power sources available are batteries, supercapacitors or some type of power generator. Thermoelectric generators produce electrical energy by the diffusion of charge carriers in response to heat flux caused by a temperature gradient between junctions of dissimilar materials. As wearables, flexible electronics and intelligent packaging applications increase, there is a need for low-cost, recyclable and printable power sources. For such applications, printed thermoelectric generators (TEGs) are an interesting power source, which can also be combined with printable energy storage, such as supercapacitors. Poly(3,4-ethylenedioxythiophene)-poly(styrenesulfonate), or PEDOT:PSS, is a conductive polymer that has gathered interest as a thermoelectric material. Plastic substrates are commonly used for printed electronics, but an interesting and emerging alternative is to use paper. In this article, a printed thermoelectric generator consisting of PEDOT:PSS and silver inks was printed on two common types of paper substrates, which could be used to power electronic circuits on paper.

scholarly journals High-performance printed electronics based on inorganic semiconducting nano to chip scale structures

2020 ◽  
Vol 7 (1) ◽  
Author(s):  
Abhishek Singh Dahiya ◽  
Dhayalan Shakthivel ◽  
Yogeenth Kumaresan ◽  
Ayoub Zumeit ◽  
Adamos Christou ◽  
...  
Keyword(s):  
Flexible Electronics ◽  
High Performance ◽  
Printed Electronics ◽  
Functional Materials ◽  
Transfer Printing ◽  
Semiconducting Materials ◽  
Large Area ◽  
Contact Printing ◽  
Scale Structures ◽  
Silicon Based

Abstract The Printed Electronics (PE) is expected to revolutionise the way electronics will be manufactured in the future. Building on the achievements of the traditional printing industry, and the recent advances in flexible electronics and digital technologies, PE may even substitute the conventional silicon-based electronics if the performance of printed devices and circuits can be at par with silicon-based devices. In this regard, the inorganic semiconducting materials-based approaches have opened new avenues as printed nano (e.g. nanowires (NWs), nanoribbons (NRs) etc.), micro (e.g. microwires (MWs)) and chip (e.g. ultra-thin chips (UTCs)) scale structures from these materials have been shown to have performances at par with silicon-based electronics. This paper reviews the developments related to inorganic semiconducting materials based high-performance large area PE, particularly using the two routes i.e. Contact Printing (CP) and Transfer Printing (TP). The detailed survey of these technologies for large area PE onto various unconventional substrates (e.g. plastic, paper etc.) is presented along with some examples of electronic devices and circuit developed with printed NWs, NRs and UTCs. Finally, we discuss the opportunities offered by PE, and the technical challenges and viable solutions for the integration of inorganic functional materials into large areas, 3D layouts for high throughput, and industrial-scale manufacturing using printing technologies.

scholarly journals Direct roll transfer printed silicon nanoribbon arrays based high-performance flexible electronics

2021 ◽  
Vol 5 (1) ◽  
Author(s):  
Ayoub Zumeit ◽  
Abhishek Singh Dahiya ◽  
Adamos Christou ◽  
Dhayalan Shakthivel ◽  
Ravinder Dahiya
Keyword(s):  
Flexible Electronics ◽  
High Performance ◽  
Printed Electronics ◽  
Field Effect Transistors ◽  
High Mobility ◽  
Single Step ◽  
High Yield ◽  
Transfer Printing ◽  
Large Area ◽  
Direct Printing

AbstractTransfer printing of high mobility inorganic nanostructures, using an elastomeric transfer stamp, is a potential route for high-performance printed electronics. Using this method to transfer nanostructures with high yield, uniformity and excellent registration over large area remain a challenge. Herein, we present the ‘direct roll transfer’ as a single-step process, i.e., without using any elastomeric stamp, to print nanoribbons (NRs) on different substrates with excellent registration (retaining spacing, orientation, etc.) and transfer yield (∼95%). The silicon NR based field-effect transistors printed using direct roll transfer consistently show high performance i.e., high on-state current (Ion) >1 mA, high mobility (μeff) >600 cm2/Vs, high on/off ratio (Ion/off) of around 106, and low hysteresis (<0.4 V). The developed versatile and transformative method can also print nanostructures based on other materials such as GaAs and thus could pave the way for direct printing of high-performance electronics on large-area flexible substrates.

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