scholarly journals Inkjet Printing of Polyacrylic Acid-Coated Silver Nanoparticle Ink onto Paper with Sub-100 Micron Pixel Size

Materials ◽  
2019 ◽  
Vol 12 (14) ◽  
pp. 2277 ◽  
Author(s):  
Mavuri ◽  
Mayes ◽  
Alexander

Printed electronics (PE) technology shows huge promise for the realisation of low-cost and flexible electronics, with the ability to pattern heat- or pressure-sensitive materials. In future developments of the PE market, the ability to produce highly conductive, high-resolution patterns using low-cost and roll-to-roll processes, such as inkjet printing, is a critical technology component for the fabrication of printed electronics and displays. Here, we demonstrate inkjet printing of polyacrylic acid (PAA) capped silver nanoparticle dispersions onto paper for high-conductivity electronic interconnects. We characterise the resulting print quality, feature geometry and electrical performance of inkjet patterned features and demonstrate the high-resolution printing, sub-100 micron feature size, of silver nanoparticle materials onto flexible paper substrate. Printed onto photo-paper, these materials then undergo chemically triggered sintering on exposure to chloride contained in the paper. We investigated the effect of substrate temperature on the properties of printed silver material from room temperature to 50 °C. At room temperature, the resistivity of single layer printed features, of average thickness of 500 nm and width 85 µm, was found to be 2.17 × 10−7 Ω·m or 13 times resistivity of bulk silver (RBS). The resistivity initially decreased with an increase in material thickness, when achieved by overprinting successive layers or by decreasing print pitch, and a resistivity of around 10 times RBS was observed after overprinting two times at pitch 75 µm and with single pass print pitch of between 60 and 80 µm, resulting in line thickness up to 920 nm. On further increases in thickness the resistivity increased and reached 27 times RBS at print pitch of 15 µm. On moderate heating of the substrate to 50 °C, more compact silver nanoparticle films were formed, reducing thickness to 200 nm from a single pass print, and lower material resistivity approaching five times RBS was achieved.

2021 ◽  
Author(s):  
Mingyue Peng ◽  
Dawu Lv ◽  
Wenfeng Shen ◽  
Weijie Song ◽  
Ruiqin Tan

Abstract A series of disposable gas-sensing paper-based film sensors were prepared rapidly by inkjet printing polyacrylic acid-coated silver nanoparticle (PAA/AgNP) ink onto the ordinary copy paper. The surface morphologies and chemical structures of the printed PAA/AgNP based sensing films with various thicknesses and spacing widths of interdigital electrodes were characterized. The electrical properties and the gas sensing performance of the film sensors were investigated and the results showed that the PAA/AgNP film sensors presented excellent selectivity, reproducibility and long-term stability to ammonia (NH3) gas at room temperature. The response of the PAA/AgNP film sensor to NH3 with the concentration of 25 ppm is 42.6% at 20℃ and 50% relative humidity (RH). The influences of thickness, spacing of interdigital electrodes and relative humidity on the sensing properties of the PAA/AgNP film sensors were also discussed and analyzed. Additionally, the PAA/AgNP film sensor presented perfect flexible stability and showed minor change in response value after 100 folding/extending cycles with the angle of 90°. In conclusion, the proposed high-performance paper based PAA/AgNP thin film sensor holds great promise for flexible, low-cost, portable, disposable and recyclable application in detecting NH3 at room temperature.


Author(s):  
Andrew Claypole ◽  
James Claypole ◽  
Tim Claypole ◽  
David Gethin ◽  
Liam Kilduff

Abstract Carbon-based pastes and inks are used extensively in a wide range of printed electronics because of their widespread availability, electrical conductivity and low cost. Overcoming the inherent tendency of the nano-carbon to agglomerate to form a stable dispersion is necessary if these inks are to be taken from the lab scale to industrial production. Plasma functionalization of graphite nanoplatelets (GNP) adds functional groups to their surface to improve their interaction with the polymer resin. This offers an attractive method to overcome these problems when creating next generation inks. Both dynamic and oscillatory rheology were used to evaluate the stability of inks made with different loadings of functionalized and unfunctionalized GNP in a thin resin, typical of a production ink. The rheology and the printability tests showed the same level of dispersion and electrical performance had been achieved with both functionalized and unfunctionalized GNPs. The unfunctionalized GNPs agglomerate to form larger, lower aspect particles, reducing interparticle interactions and particle–medium interactions. Over a 12-week period, the viscosity, shear thinning behavior and viscoelastic properties of the unfunctionalized GNP inks fell, with decreases in viscosity at 1.17 s−1 of 24, 30, 39% for the ϕ = 0.071, 0.098, 0.127 GNP suspensions, respectively. However, the rheological properties of the functionalized GNP suspensions remained stable as the GNPs interacted better with the polymer in the resin to create a steric barrier which prevented the GNPs from approaching close enough for van der Waals forces to be effective.


Nanomaterials ◽  
2020 ◽  
Vol 10 (5) ◽  
pp. 892
Author(s):  
Dieter Reenaers ◽  
Wouter Marchal ◽  
Ianto Biesmans ◽  
Philippe Nivelle ◽  
Jan D’Haen ◽  
...  

The field of printed electronics is rapidly evolving, producing low cost applications with enhanced performances with transparent, stretchable properties and higher reliability. Due to the versatility of printed electronics, industry can consider the implementation of electronics in a way which was never possible before. However, a post-processing step to achieve conductive structures—known as sintering—limits the production ease and speed of printed electronics. This study addresses the issues related to fast sintering without scarifying important properties such as conductivity and surface roughness. A drop-on-demand inkjet printer is employed to deposit silver nanoparticle-based inks. The post-processing time of these inks is reduced by replacing the conventional oven sintering procedure with the state-of-the-art method, named near-infrared sintering. By doing so, the post-processing time shortens from 30–60 min to 6–8 s. Furthermore, the maximum substrate temperature during sintering is reduced from 200 °C to 120 °C. Based on the results of this study, one can conclude that near-infrared sintering is a ready-to-industrialize post-processing method for the production of printed electronics, capable of sintering inks at high speed, low temperature and with low complexity. Furthermore, it becomes clear that ink optimization plays an important role in processing inkjet printable inks, especially after being near-infrared sintered.


2019 ◽  
Vol 33 (3) ◽  
pp. 377-384 ◽  
Author(s):  
Irena Ivanišević ◽  
Petar Kassal ◽  
Andrea Milinković ◽  
Anamarija Rogina ◽  
Stjepan Milardović

Electrical conductivity is a key factor in measuring performance of printed electronics,<br /> but the conductivity of inkjet-printed silver nanoinks greatly depends on post-fabrication<br /> sintering. In this work, two different conductive silver nanoinks, in which the silver nanoparticles were stabilized by two different capping agents – Poly(acrylic acid) (PAA) and Poly(methacrylic acid) (PMA) – were synthesized. The inks were inkjet-printed on flexible PET substrates, coated with an additional polycation layer, which facilitated<br /> chemical sintering. The printed features were then exposed to moderately elevated<br /> temperatures to evaluate the effect of combined chemical and thermal sintering. Both<br /> inks produced conductive features at room temperature, and the conductivity increased<br /> with both temperature and duration of sintering. At temperatures above 100 °C, the choice of capping agent had no pronounced effect on conductivity, which approached very high values of 50 % of bulk silver in all cases. The lowest resistivity (2.24 μΩ cm) was obtained after sintering at 120 °C for 180 min. By combining chemical and conventional thermal sintering, we have produced remarkably conductive silver electrodes on flexible substrates, while using low-cost and simple processes.


2012 ◽  
Vol 2012 (1) ◽  
pp. 000935-000939
Author(s):  
Yiliang Wu ◽  
Ping Liu ◽  
Tony Wigglesworth

Printable conductors with high conductivity would be critical for low-cost printed electronics. In view of printability, conductivity, and electrical stability, metal such as gold or silver derived from solution-deposited precursor compositions would be an ideal candidate. Xerox has been exploring the use of silver nanoparticles as conductor precursor composition for printed electronics. This paper reviews our research in the development of alkylamine-stabilized silver nanoparticles that can be sintered at low temperature (∼ 120 °C) for high conductivity (&gt;10000 S/cm). Silver nanoparticle ink formulations based on these silver nanoparticles exhibit surface-energy independent printability which enables the fabrication of high-performance top-contact transistor devices, and self-assembly characteristic when printed on hydrophilic substrates which allows for large-area, defect-free source drain arrays to be printed with a narrow and uniform channel length.


MRS Advances ◽  
2018 ◽  
Vol 3 (32) ◽  
pp. 1837-1842 ◽  
Author(s):  
Charles Trudeau ◽  
Martin Bolduc ◽  
Patrick Beaupré ◽  
Jaime Benavides-Guerrero ◽  
Bruno Tremblay ◽  
...  

ABSTRACTNew routes in additive devices fabrication techniques and advances in printable materials are required to meet the ever increasing demands for low-cost and large-area flexible electronics. In particular, perovskite-based materials have gained an appeal due to their unique optoelectronics and ferroelectrics properties, which may replace p-n junction in semiconductor devices. Metal-organic methylammonium lead trihalide perovskite formulations have been extensively studied in the last few years as promising materials for use in printed electronics, which do not require high temperatures or vacuum environment, contrary to conventional semiconductor fabrication techniques. In this work, digital inkjet-printing in ambient atmosphere is proposed as a deposition pathway for the fabrication of perovskite active layers in photodetector and thin-film photovoltaic device architectures. The device architecture containing a printed perovskite active layer sandwiched between TiO2 and Spiro-OMeTAD as electron and hole transport layers, respectively, as well as layer-on-layer fabrication and responsivity spectra of the perovskite-based device are presented.


2011 ◽  
Vol 409 ◽  
pp. 508-513
Author(s):  
Yu Feng Liu ◽  
Weng Sing Hwang ◽  
Yen Fang Pai ◽  
Ming Hsu Tsai

All-printed electronics as a mean of fast processing and achieving ultra-low-cost electronic devices has attracted great interest in recent years. Inkjet printing has excelled as the most promising technique by which the circuit components can be directly drawn on the specific area in one step. Furthermore, the low temperature reduction processes can be achieved by exploit the low-melting point characteristic of nanometallic particles. The inkjet printing technique to deposit silver nanoparticles (3.39±1.21 nm) capped by saturated 3-Mercaptopropionic acid onto silicon substrate was studied. The silver patterns were tested for its functionality as circuit components like conductor, resistor and capacitor. All components can be produced simply by thermal annealing of an inkjet printed patterns under an atmosphere of 90% N2-10% H2 at 300°C for 1 hr.


2021 ◽  
Vol 11 (1) ◽  
Author(s):  
Kacper Skarżyński ◽  
Jakub Krzemiński ◽  
Małgorzata Jakubowska ◽  
Marcin Słoma

AbstractRecently, low-cost electronics printed on lightweight, flexible and 3D shaped substrates are gaining importance in the markets of wearables and smart packaging. However, printed electronics do not meet the electrical performance of subtractive techniques because the resistivity of metallic printed patterns is still much higher than that of bulk material. To fulfil this need, low-resistive and easy printable inks for high resolution printed electronics techniques are needed. In this work, parameters of silver nanoparticles ink for micro-scale printed electronics technique, Aerosol Jet Printing, are being enhanced. To increase electrical conductivity and enhance printability, surfactants and dispersing agents were used to increase ultrasonic atomisation efficiency, obtain a uniform structure of printed lines, and narrow the width of printed patterns. Electrical measurements show a decrease in resistivity value in samples enhanced by cationic and non-ionic surfactants, by 95%, compared to initially prepared inks. Surfactant additions to silver nanoparticles Aerosol Jet Printing ink show promising features for application in modern electronics.


Micromachines ◽  
2021 ◽  
Vol 12 (10) ◽  
pp. 1185
Author(s):  
Büşra Karaş ◽  
Vimanyu Beedasy ◽  
Zhaoyuan Leong ◽  
Nicola A. Morley ◽  
Kamran Mumtaz ◽  
...  

Inkjet-printing technology enables the contactless deposition of functional materials such as conductive inks on surfaces, hence reducing contamination and the risk of substrate damage. In printed electronics, inkjet technology offers the significant advantage of controlling the volume of material deposited, and therefore the fine-tuning of the printed geometry, which is crucial for the performance of the final printed electronics. Inkjet printing of functional inks can be used to produce sensors to detect failure of mechanical structures such as carbon fiber reinforced composite (CFRC) components, instead of using attached sensors, which are subject to delamination. Here, silver nanoparticle-based strain sensors were embedded directly in an insulated carbon-fiber laminate by using inkjet printing to achieve an optimized conductive and adhesive geometry, forming a piezoresistive strain sensor. Following the inkjet-printing optimization process, the sensor conductivity and adhesion performance were evaluated. Finally, the sensor was quantified by using a bending rig which applied a pre-determined strain, with the response indicating an accurate sensitivity as the resistance increased with an increased strain. The ability to embed the sensor directly on the CFRC prevents the use of interfacial adhesives which is the main source of failure due to delamination.


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