Advanced Cooling of 3D ICs With Nanoparticle Packings

2017 ◽  
Author(s):  
Anil Yuksel ◽  
Paul S. Ho ◽  
Jayathi Murthy
Keyword(s):  
Thermal Resistance ◽  
Thermal Management ◽  
Heat Dissipation ◽  
Management Strategies ◽  
Liquid Cooling ◽  
The Third ◽  
3D Ics ◽  
Solution Methods ◽  
Surface Phonon Polariton ◽  
Third Dimension

Thermal-aware techniques for 3D ICs have shown that high temperatures dramatically reduce the lifetime and the reliability of the 3D ICs with utilizing the third dimension. Hence, thermal management has been very crucial for the further improvement of the 3D IC architecture. There has been some thermal management strategies suggested at the micro/nano scale to alleviate the nonlocal heat dissipation; however, many solution methods such as liquid cooling have challenges and create many problems. In this paper, we propose nanoparticle based interfacial cooling to improve the thermal transport due to surface phonon polariton coupling and to reduce the thermal resistance between the interfaces. We demonstrate the efficiency of the heat dissipation from the proposed structure for 3D ICs.

scholarly journals Thermal Analysis of Cold Plate with Different Configurations for Thermal Management of a Lithium-Ion Battery

Batteries ◽  
2020 ◽  
Vol 6 (1) ◽  
pp. 17
Author(s):  
Seyed Saeed Madani ◽  
Erik Schaltz ◽  
Søren Knudsen Kær
Keyword(s):  
Thermal Analysis ◽  
Temperature Distribution ◽  
Lithium Ion Battery ◽  
Thermal Management ◽  
Electric Vehicles ◽  
Heat Dissipation ◽  
Lithium Ion ◽  
Cold Plate ◽  
Liquid Cooling ◽  
Cooling Design

Thermal analysis and thermal management of lithium-ion batteries for utilization in electric vehicles is vital. In order to investigate the thermal behavior of a lithium-ion battery, a liquid cooling design is demonstrated in this research. The influence of cooling direction and conduit distribution on the thermal performance of the lithium-ion battery is analyzed. The outcomes exhibit that the appropriate flow rate for heat dissipation is dependent on different configurations for cold plate. The acceptable heat dissipation condition could be acquired by adding more cooling conduits. Moreover, it was distinguished that satisfactory cooling direction could efficiently enhance the homogeneity of temperature distribution of the lithium-ion battery.

Interconnects in the Third Dimension: Design Challenges for 3D ICs

2007 ◽  
Author(s):  
Kerry Bernstein ◽  
Paul Andry ◽  
Jerome Cann ◽  
Phil Emma ◽  
David Greenberg ◽  
...  
Keyword(s):  
The Third ◽  
3D Ics ◽  
Third Dimension ◽  
Design Challenges

Thermal Analysis of High Efficiency High Speed Drives

2019 ◽  
Author(s):  
Yasmin Khakpour ◽  
Weilun Warren Chen ◽  
Parikshith Channegowda ◽  
Matthew R. Pearson ◽  
Yongduk Lee ◽  
...  
Keyword(s):  
Thermal Analysis ◽  
Thermal Resistance ◽  
Power Electronics ◽  
Thermal Management ◽  
High Speed ◽  
High Efficiency ◽  
Management Strategies ◽  
Substantial Reduction ◽  
Operating Conditions ◽  
Heat Conducting

Abstract The thermal management of the PCB based power electronics is a key element to ensure safe operating conditions and to meet lifetime, reliability and safety requirements. This is challenging for applications above 1 kW because the substrate material used in a PCB such as FR-4 has very low heat conducting properties. Hence, there is a limit on how much loss can be dissipated from the board and for that reason this approach has only been adopted in the industry for very low power applications. With the proposed multilevel topology, WBG devices, and innovative thermal management strategies it is possible to expand the PCB based power electronics approach to power ratings between 1kW and 10 kW. For instance, an improvement in the thermal resistance of the PCB can be obtained by soldering a discrete WBG device with a TO-263 package directly on a PCB with about one inch square copper area around the device which will act as a heat spreader. Then, a further substantial reduction in the thermal resistance of a PCB is possible by the application of electrical vias. In principle each via is a copper sleeve through the board or through a part of the board. Where, instead of using its electrical function, a via can also be used as a thermal conductor. In this work, the thermal analysis of the PCB and the effect of number of vias as well as the effect of filling the vias with a thermally conductive material has been studied. The design has been optimized for the number of vias and the modeling results have been verified with experimental tests.

Experimental Analysis Model of an Active Cooling Method for 3D-ICs Utilizing Multidimensional Configured Thermoelectric Coolers

2010 ◽  
Vol 132 (2) ◽  
Author(s):  
Huy N. Phan ◽  
Dereje Agonafer
Keyword(s):  
Integrated Circuits ◽  
Thermal Management ◽  
Heat Dissipation ◽  
Three Dimensional ◽  
Analysis Model ◽  
Thermoelectric Coolers ◽  
Active Cooling ◽  
3D Ics ◽  
Cooling Method ◽  
Memory Applications

Presently, stack dice are used widely as low-power memory applications because thermal management of 3D architecture such as high-power processors inherits many thermal challenges. Inadequate thermal management of three-dimensional integrated circuits (3D-ICs) leads to reduction in performance, reliability, and ultimately system catastrophic failure. Heat dissipation of 3D systems is highly nonuniform and nonunidirectional due to many factors such as power architectures, transistors packing density, and real estate available on the chip. In this study, the development of an experimental model of an active cooling method to cool a 25 W stack-dice to approximately 13°C utilizing a multidimensional configured thermoelectric will be presented.

Analytical Modeling of Active Cooling Schemes Suitable for Thermal Management of Telecoms Servers

2003 ◽  
Author(s):  
Ali Heydari ◽  
Poorya Sabounchi
Keyword(s):  
Thermal Management ◽  
Heat Dissipation ◽  
Electronic Cooling ◽  
Density Level ◽  
Vapor Compression ◽  
Liquid Cooling ◽  
Dissipation Potential ◽  
Active Cooling ◽  
Vapor Compression Refrigeration ◽  
Near Future

There is a strong need to improve our current capabilities in thermal management and electronic cooling, since estimates indicate that IC power density level could reach 50 W/cm2 in near future. This paper presents an innovative approach for thermal modeling of active cooling schemes suitable for tight-spaced telecom servers. It is shown that the principles of energy conversion can be used to overcome the problems of thermal resistance narrowing. Cooling schemes such as mesoscale vapor compression refrigeration, liquid cooling, thermoelectric microcooler and microchannel heat sink are discussed and compared in terms of heat dissipation potential, reliability, and packaging application concerns.

scholarly journals Enhanced Thermal Management of GaN Power Amplifier Electronics with Micro-Pin Fin Heat Sinks

Electronics ◽  
2020 ◽  
Vol 9 (11) ◽  
pp. 1778
Author(s):  
Ting Kang ◽  
Yuxin Ye ◽  
Yuncong Jia ◽  
Yanmei Kong ◽  
Binbin Jiao
Keyword(s):  
Thermal Resistance ◽  
Thermal Management ◽  
Power Density ◽  
Power Amplifier ◽  
Heat Dissipation ◽  
Printed Circuit Board ◽  
Element Model ◽  
Circuit Board ◽  
Device Performance ◽  
Pin Fin

This study introduces an enhanced thermal management strategy for efficient heat dissipation from GaN power amplifiers with high power densities. The advantages of applying an advanced liquid-looped silicon-based micro-pin fin heat sink (MPFHS) as the mounting plate for GaN devices are illustrated using both experimental and 3D finite element model thermal simulation methods, then compared against traditional mounting materials. An IR thermography system was equipped to obtain the temperature distribution of GaN mounted on three different plates. The influence of mass flow rate on a MPFHS was also investigated in the experiments. Simulation results showed that GaN device performance could be improved by increasing the thermal conductivity of mounting plates’ materials. The dissipated power density of the GaN power amplifier increased 17.5 times when the mounting plate was changed from LTCC (Low Temperature Co-fired Ceramics) (k = 2 Wm−1 K−1) to HTCC (High-Temperature Co-fired Ceramics) (k = 180 Wm−1 K−1). Experiment results indicate that the GaN device performance was significantly improved by applying liquid-looped MPFHS, with the maximum dissipated power density reaching 7250 W/cm2. A thermal resistance model for the whole system, replacing traditional plates (PCB (Printed Circuit Board), silicon wafer and LTCC/HTCC) with an MPFHS plate, could significantly reduce θjs (thermal resistance of junction to sink) to its theoretical limitation value.

Experimental Characterization of a Unique Carbon Fiber Brush Heat Sink in Two-Phase Heat Transfer

2005 ◽  
Author(s):  
Harish Chengalvala ◽  
Amy S. Fleischer ◽  
G. F. Jones
Keyword(s):  
Heat Transfer ◽  
Carbon Fiber ◽  
Thermal Management ◽  
Thermal Performance ◽  
Heat Sink ◽  
Management Strategies ◽  
Liquid Cooling ◽  
Two Phase ◽  
Two Phase Heat Transfer ◽  
Power Densities

The performance enhancements and footprint decreases of advanced electronic devices result in soaring power densities which may in turn lead to elevated operating temperatures. As elevated device temperatures lead to decreased device reliability and increased thermal stresses, it is necessary to employ aggressive thermal management techniques to maintain an acceptable junction temperature at high power densities. For this reason, interest is growing in a variety of liquid cooling techniques This study analyzes an advanced engineered-material heat sink which provides significant improvements in thermal management strategies for advanced electronics. The heat sink consists of a very large number of small cross-section fins fabricated from carbon pitch fibers. For these carbon pitch fibers, the high thermal conductivity reduces the temperature drop along the length of the fin creating a longer effective fin length than for copper fins. The longer length results in more heat transfer surface area and a more effective heat sink. In liquid cooling, the rough surface of the fin will provide multiple bubble nucleation sites, strongly promoting active two-phase heat transfer over the entire fin surface. This surface enhancement is expected to lead to significant increases in performance over conventional heat sinks. This experimental analysis characterizes the thermal performance of the carbon-fiber heat sink in two-phase closed loop thermosyphon operation using FC72 as the operating fluid. The influence of power load, thermosyphon fill volume and condenser operating temperature on the overall thermal performance is examined. The results of this experiment provide significant insight into the possible implementation and benefits of carbon fiber heat sink technology in two-phase flow leading to significant improvements in thermal management strategies for advanced electronics.

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