scholarly journals Enhanced Thermal Management of GaN Power Amplifier Electronics with Micro-Pin Fin Heat Sinks

Electronics ◽  
2020 ◽  
Vol 9 (11) ◽  
pp. 1778
Author(s):  
Ting Kang ◽  
Yuxin Ye ◽  
Yuncong Jia ◽  
Yanmei Kong ◽  
Binbin Jiao
Keyword(s):  
Thermal Resistance ◽  
Thermal Management ◽  
Power Density ◽  
Power Amplifier ◽  
Heat Dissipation ◽  
Printed Circuit Board ◽  
Element Model ◽  
Circuit Board ◽  
Device Performance ◽  
Pin Fin

This study introduces an enhanced thermal management strategy for efficient heat dissipation from GaN power amplifiers with high power densities. The advantages of applying an advanced liquid-looped silicon-based micro-pin fin heat sink (MPFHS) as the mounting plate for GaN devices are illustrated using both experimental and 3D finite element model thermal simulation methods, then compared against traditional mounting materials. An IR thermography system was equipped to obtain the temperature distribution of GaN mounted on three different plates. The influence of mass flow rate on a MPFHS was also investigated in the experiments. Simulation results showed that GaN device performance could be improved by increasing the thermal conductivity of mounting plates’ materials. The dissipated power density of the GaN power amplifier increased 17.5 times when the mounting plate was changed from LTCC (Low Temperature Co-fired Ceramics) (k = 2 Wm−1 K−1) to HTCC (High-Temperature Co-fired Ceramics) (k = 180 Wm−1 K−1). Experiment results indicate that the GaN device performance was significantly improved by applying liquid-looped MPFHS, with the maximum dissipated power density reaching 7250 W/cm2. A thermal resistance model for the whole system, replacing traditional plates (PCB (Printed Circuit Board), silicon wafer and LTCC/HTCC) with an MPFHS plate, could significantly reduce θjs (thermal resistance of junction to sink) to its theoretical limitation value.

Influence of the area of a thermal pad on optical and thermal parameters of LED modules

Circuit World ◽  
2020 ◽  
Vol 46 (2) ◽  
pp. 65-70 ◽  
Author(s):  
Krzysztof Górecki ◽  
Przemysław Piotr Ptak
Keyword(s):  
Thermal Resistance ◽  
Power Density ◽  
Printed Circuit Board ◽  
Thermal Parameters ◽  
Circuit Board ◽  
Optical Parameters ◽  
Metal Core ◽  
Content Type ◽  
Printed Circuit

Purpose The purpose of this paper is to present and discuss the results of measurements illustrating influence of the area of a thermal pad and the kind of the used base on thermal and optical parameters of LED modules. Design/methodology/approach LED modules including six power LEDs are designed. In the layout of these modules, different areas of a thermal pad of each LED are used. These modules are made using the classical FR-4 base and metal core printed circuit board (MCPCB). Thermal and optical parameters of all the tested modules are measured using the method elaborated by the authors. Findings The obtained results of measurements prove that increasing the area of a thermal pad causes a decrease in thermal resistance of the tested LED modules and an increase in power density of the emitted light. The role of the area of a thermal pad is more important for the classical FR-4 base than for MCPCB. Research limitations/implications Investigations were performed for only two values of the area of thermal pads and selected values of LEDs forward current. Originality/value The presented results of investigations show how the used layout and type of the used base of these modules influence optical and thermal parameters of LED modules. Changing the base of a module can cause even a double decrease in thermal resistance and a double increase in power density of the emitted light.

An Assessment of the Impact of Interconnect Strategies on Thermal Performance of GaAs Power Amplifier IC Devices

2001 ◽  
Author(s):  
V. H. Adams ◽  
T.-Y. Tom Lee
Keyword(s):  
Thermal Resistance ◽  
Power Amplifier ◽  
Thermal Performance ◽  
Flip Chip ◽  
Printed Circuit Board ◽  
Circuit Board ◽  
Printed Circuit ◽  
Wire Bond ◽  
Die Attach ◽  
The Impact

Abstract Alternative interconnect strategies are being considered in place of the standard wire bond interconnect for GaAs power amplifier MMIC devices due to cost and electrical performance improvements. The package/die thermal performance consequences are potentially high-risk issue to these interconnect strategies and requires evaluation. Thermal simulations are conducted to compare and evaluate the thermal performances of three interconnect strategies: wire bond, gold post-flip chip, and through via interconnects. The test vehicle simulated is a three-stage, dual band power amplifier integrated circuit dissipating approximately 5 W steady-state power. Parametric studies are conducted to evaluate the impact of the printed circuit board, die thickness, solid gold vias, and design enhancements on package thermal performance. Best thermal performance is provided by a wire bonded, thin GaAs die attached with solder die attach to a printed circuit board that maximizes the number of plated-through-holes directly under the die. This configuration results in a best case junction-to-heat sink thermal resistance of 12 °C/W. Optimum flip chip and through via designs result in degraded thermal performance compared to the above described wire bond design but may have acceptable thermal performance. For these simulations, predicted junction-to-heatsink thermal resistance is in a range of 15–20 °C/W and is better than a comparable wire bonded design that uses a conductive epoxy die attach material.

Air Cooling of Power Electronics Through Vertically Enhanced Manifold Microchannel Systems (VEMMS)

2021 ◽  
Author(s):  
Sevket Umut Yuruker ◽  
Raphael Mandel ◽  
Patrick McCluskey ◽  
Michael Ohadi
Keyword(s):  
Power Electronics ◽  
Thermal Management ◽  
Power Density ◽  
Printed Circuit Board ◽  
Circuit Board ◽  
Cooling Power ◽  
Air Cooling ◽  
Ambient Conditions ◽  
Numerical Predictions ◽  
Manifold Microchannel

Abstract Optimum thermal management of power electronics is necessary for their improved reliability and efficiency. Next generation electronics systems are predicted to dissipate more heat as die size shrinks and power levels increase. Traditional air-cooling approaches usually provide insufficient performance or require heavy and bulky heatsinks to achieve adequate thermal management. To tackle this, a novel air-cooled vertically enhanced manifold microchannel system (VEMMS) was developed. While minimizing the footprint requirement on the printed circuit board, it offers an efficient thermal management in a conformal scheme that accommodates the associated power electronics and their electrical connections. The present work describes manufacturing of the air-cooled VEMMS heatsink, and its experimental characterization and thermo-fluidic performance. Good agreement was obtained between the test results and numerical predictions. Using air at ambient conditions, a thermal resistance of 2.6 K/W was achieved, at 1.5cm2 footprint and 2cm3 total heatsink volume in a single-sided cooling architecture, enabling a full-bridge electrical power density of ~84 kWe/L and overall DC-DC converter's power density of ~20kWe/L, at reasonable flow rates and pressure drops using commercially available miniature electric fans. Index Terms-Air cooling, heatsink, manifold microchannel cooling, power electronics, power density, thermal management

Dynamic – Thermal Analyses of a Structurally Reconfigured Electronics Package Onboard Mini Satellite

2014 ◽  
Vol 592-594 ◽  
pp. 2117-2121 ◽  
Author(s):  
P. Veeramuthuvel ◽  
S. Jayaraman ◽  
Shankar Krishnapillai ◽  
M. Annadurai ◽  
A.K. Sharma
Keyword(s):  
Finite Element ◽  
Printed Circuit Board ◽  
Thermal Environment ◽  
Thermal Analyses ◽  
Simulation Models ◽  
Element Model ◽  
Circuit Board ◽  
Element Analysis ◽  
Transfer Path ◽  
Vibration Responses

The electronics package in a spacecraft is subjected to a variety of dynamic loads during launch phase and suitable thermal environment for the mission life. The dynamic and thermal analyses performed for a structurally reconfigured electronics package. Two different simulation models are developed to carry out the analyses. This paper discusses in two parts, in part-1, the vibration responses are determined at various critical locations, including on the Printed Circuit Board (PCB) for the vibration loads specified by launch vehicle using Finite Element Analysis (FEA). The mechanical properties of PCB are determined from the test specimens, which are then incorporated in the finite element model. In part-2, the steady-state temperature distributions on the components and on the PCB are determined, to check the effectiveness of heat transfer path from the components to the base of the package and to verify the predicted values are within the acceptable temperature limits specified. The predicted temperature values are then compared with on-orbit observations.

Evaluation of new technologies and materials for printed circuit boards with improved heat dissipation properties

Circuit World ◽  
2016 ◽  
Vol 42 (1) ◽  
pp. 32-36 ◽  
Author(s):  
Michal Baszynski ◽  
Edward Ramotowski ◽  
Dariusz Ostaszewski ◽  
Tomasz Klej ◽  
Mariusz Wojcik ◽  
...  
Keyword(s):  
Thermal Properties ◽  
Printed Circuit Boards ◽  
Heat Dissipation ◽  
Printed Circuit Board ◽  
New Technologies ◽  
Electronic Device ◽  
Circuit Board ◽  
New Materials ◽  
Content Type ◽  
Printed Circuit

Purpose – The purpose of this paper is to evaluate thermal properties of printed circuit board (PCB) made with use of new materials and technologies. Design/methodology/approach – Four PCBs with the same layout but made with use of different materials and technologies have been investigated using thermal camera to compare their thermal properties. Findings – The results show how important the thermal properties of PCBs are for providing effective heat dissipation, and how a simple alteration to the design can help to improve the thermal performance of electronic device. Proper layout, new materials and technologies of PCB manufacturing can significantly reduce the temperature of electronic components resulting in higher reliability of electronic and power electronic devices. Originality/value – This paper shows the advantages of new technologies and materials in PCB thermal management.

Thermal Model of Printed Circuit Board Plated-Through Hole under One-Sided Heating Conditions

2021 ◽  
Vol 26 (5) ◽  
pp. 426-431
Author(s):  
V.A. Sergeev ◽  
◽  
A.M. Khodakov ◽  
M.Yu. Salnikov ◽  
◽  
...  
Keyword(s):  
Quality Control ◽  
Thermal Resistance ◽  
Thermal Model ◽  
Printed Circuit Board ◽  
Circuit Board ◽  
Thermal Models ◽  
Printed Circuit ◽  
Plated Through Hole ◽  
Through Hole

Thermal methods of quality control of the plated-through hole (PTH) of printed circuit board (PCB) are based on thermal models. However, known thermal models of PTH take no account of heat transfer to PCB material thus not allowing for PTH heat characteristic tying up with adhesion quality. In this work, an axisymmetric thermal model of a single-layer PCB PTH under one-sided heating conditions is considered. It was shown that the ratio of the temperature increments of the upper (heated) and lower end of the PTH in the considered range of heating power does not depend on the power level. A linear thermal equivalent scheme of the PTH has been proposed, which includes the longitudinal thermal resistance of the PTH metallization, de-termined by the parameters and quality of the metallization layer, the thermal resistance, which determines the convection heat exchange between the ends of the PTH with the adjacent PCB surface and the environment, and the thermal resistance of the area of the PCB material adjacent to the PTH, depending on the quality of the metallization adhesion and the PCB dielectric. Thermal equivalent circuit parameters determined by the ratio of the temperature increment of the upper and lower ends of the PTH and their difference can serve as the basis for the development of a nondestructive inspection procedure for PTH quality control by way of its unilateral heating, for example, by a laser beam.

Superconducting Multilayer High-Density Flexible Printed Circuit Board for Very High Thermal Resistance Interconnections

2018 ◽  
Vol 193 (3-4) ◽  
pp. 578-584 ◽  
Author(s):  
Xavier de la Broïse ◽  
Alain Le Coguie ◽  
Jean-Luc Sauvageot ◽  
Claude Pigot ◽  
Xavier Coppolani ◽  
...  
Keyword(s):  
Thermal Resistance ◽  
Printed Circuit Board ◽  
High Density ◽  
Circuit Board ◽  
Printed Circuit ◽  
Flexible Printed Circuit ◽  
High Thermal Resistance ◽  
Very High

Comparison of Different Methods for Stress and Deflection Analysis in Embedded Die Packages during the Assembly Process

2014 ◽  
Vol 2014 (1) ◽  
pp. 000355-000360
Author(s):  
K. Macurova ◽  
R. Bermejo ◽  
M. Pletz ◽  
R. Schöngrundner ◽  
T. Antretter ◽  
...  
Keyword(s):  
Printed Circuit Board ◽  
Plastic Material ◽  
Three Dimensional ◽  
Diffraction Method ◽  
Element Model ◽  
Analytical Investigation ◽  
Circuit Board ◽  
Curvature Radius ◽  
Assembly Process ◽  
Deflection Analysis

Important topics for electronic packages are thermally induced stresses created during package manufacturing and their role in mechanical failure. In the present paper, an analytical and a numerical analysis of the assembly process (component attached with an adhesive to a copper foil) is investigated. This process is prior to the lamination of the printed circuit board. Stresses develop due to a mismatch of coefficients of thermal expansion and particularly to shrinkage associated with adhesive polymerization. The analytical investigation is based on the classical laminate theory and an interfacial model. The three-dimensional numerical finite element model is capable to use geometric and material properties which are not possible to investigate analytically. In particular, the influence of the adhesive meniscus and plastic material models for copper and adhesive are investigated. The models are validated experimentally by an X-ray diffraction method (Rocking-Curve-Technique) showing a good agreement of the calculated and measured curvature radius values.

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