Analytical Modeling of Active Cooling Schemes Suitable for Thermal Management of Telecoms Servers

2003 ◽  
Author(s):  
Ali Heydari ◽  
Poorya Sabounchi
Keyword(s):  
Thermal Management ◽  
Heat Dissipation ◽  
Electronic Cooling ◽  
Density Level ◽  
Vapor Compression ◽  
Liquid Cooling ◽  
Dissipation Potential ◽  
Active Cooling ◽  
Vapor Compression Refrigeration ◽  
Near Future

There is a strong need to improve our current capabilities in thermal management and electronic cooling, since estimates indicate that IC power density level could reach 50 W/cm2 in near future. This paper presents an innovative approach for thermal modeling of active cooling schemes suitable for tight-spaced telecom servers. It is shown that the principles of energy conversion can be used to overcome the problems of thermal resistance narrowing. Cooling schemes such as mesoscale vapor compression refrigeration, liquid cooling, thermoelectric microcooler and microchannel heat sink are discussed and compared in terms of heat dissipation potential, reliability, and packaging application concerns.

scholarly journals Control Strategy for Helicopter Thermal Management System Based on Liquid Cooling and Vapor Compression Refrigeration

Energies ◽  
2020 ◽  
Vol 13 (9) ◽  
pp. 2177 ◽  
Author(s):  
Miao Zhao ◽  
Liping Pang ◽  
Meng Liu ◽  
Shizhao Yu ◽  
Xiaodong Mao
Keyword(s):  
Thermal Management ◽  
High Power ◽  
Control Strategy ◽  
Management System ◽  
Inlet Temperature ◽  
Cold Plate ◽  
Vapor Compression ◽  
Liquid Cooling ◽  
Thermal Management System ◽  
Vapor Compression Refrigeration

With the continuous application of high-power electronic equipment in aircraft, highly efficient heat transfer technology has been emphasized for airborne applications. In this paper, a thermal management system based on an antifreeze liquid cooling loop and a vapor compression refrigeration loop is presented for high-power airborne equipment in a helicopter. The simulation models of the thermal management system are built in order to study its control strategy for the changing flight conditions. The antifreeze-refrigerant evaporator and air-refrigerant condenser are specially validated with the experimental data. A dual feedforward proportion integration differentiation and expert control algorithm are adopted in the inlet temperature of the cold plate and sub-cooling control of the refrigerant by regulating the compressor speed and the fan speed, respectively. A preheating strategy for antifreeze is set up to decrease its flow resistance in cold day conditions. The control strategy for the thermal management system is finally built based on the above control methods. In this paper, two extreme conditions are discussed, including cold and hot days. Both the simulation results show that the superheated, sub-cooling and antifreeze inlet temperature of the cold plate can be controlled at 3 to8 °C, −10 to −3 °C and 18 to22 °C, respectively. Under the same changing flight envelope, the coefficient of performance of the vapor compression refrigeration loop is relatively stable on the cold day, which is about 6, while it has a range of 2.58–4.9 on the hot day.

scholarly journals Thermal Analysis of Cold Plate with Different Configurations for Thermal Management of a Lithium-Ion Battery

Batteries ◽  
2020 ◽  
Vol 6 (1) ◽  
pp. 17
Author(s):  
Seyed Saeed Madani ◽  
Erik Schaltz ◽  
Søren Knudsen Kær
Keyword(s):  
Thermal Analysis ◽  
Temperature Distribution ◽  
Lithium Ion Battery ◽  
Thermal Management ◽  
Electric Vehicles ◽  
Heat Dissipation ◽  
Lithium Ion ◽  
Cold Plate ◽  
Liquid Cooling ◽  
Cooling Design

Thermal analysis and thermal management of lithium-ion batteries for utilization in electric vehicles is vital. In order to investigate the thermal behavior of a lithium-ion battery, a liquid cooling design is demonstrated in this research. The influence of cooling direction and conduit distribution on the thermal performance of the lithium-ion battery is analyzed. The outcomes exhibit that the appropriate flow rate for heat dissipation is dependent on different configurations for cold plate. The acceptable heat dissipation condition could be acquired by adding more cooling conduits. Moreover, it was distinguished that satisfactory cooling direction could efficiently enhance the homogeneity of temperature distribution of the lithium-ion battery.

Transient Vapor Compression Refrigeration Cycle for Electronics Cooling: Part 2—Multi-Evaporator Dynamics and Control

2011 ◽  
Author(s):  
TieJun Zhang ◽  
John T. Wen ◽  
Michael K. Jensen
Keyword(s):  
Thermal Management ◽  
Energy Efficient ◽  
Transient Analysis ◽  
Electronics Cooling ◽  
Refrigeration Cycle ◽  
Vapor Compression ◽  
Cooling Systems ◽  
Computation Efficiency ◽  
Vapor Compression Refrigeration Cycle ◽  
Vapor Compression Refrigeration

For next-generation sustainable electronic systems, such as high-concentration photovoltaics arrays and high-density super-computers, two-phase cooling technologies are being explored to significantly reduce heat resistance from electronics’ surface to the ambient. Lower electronics operating temperatures lead to higher energy conversion or computation efficiency; therefore, thermal management, especially dynamic thermal management, is able to bring great potential to energy-efficient electronic system operation. These large-scale electronics cooling systems normally include multiple, distributed, and transient heat sources. Multi-evaporator vapor compression refrigeration cycle provides such a promising cooling solution. Due to the complexity of multiple evaporator structure, its transient analysis and active control become very challenging. This paper applies our previous distributed heat exchanger modeling techniques to study the dynamics of multi-evaporator refrigeration cycles. A comprehensive first-principle multi-evaporator vapor compression cycle model is formulated for its transient analysis. Some preliminary expansion valve control results are presented to show the excellent active electronics cooling capability. This general tool is expected to bring instructive guidelines for the optimal design and operation of energy-efficient transient electronics cooling systems with multiple heat loads and hot spots.

Experimental Analysis Model of an Active Cooling Method for 3D-ICs Utilizing Multidimensional Configured Thermoelectric Coolers

2010 ◽  
Vol 132 (2) ◽  
Author(s):  
Huy N. Phan ◽  
Dereje Agonafer
Keyword(s):  
Integrated Circuits ◽  
Thermal Management ◽  
Heat Dissipation ◽  
Three Dimensional ◽  
Analysis Model ◽  
Thermoelectric Coolers ◽  
Active Cooling ◽  
3D Ics ◽  
Cooling Method ◽  
Memory Applications

Presently, stack dice are used widely as low-power memory applications because thermal management of 3D architecture such as high-power processors inherits many thermal challenges. Inadequate thermal management of three-dimensional integrated circuits (3D-ICs) leads to reduction in performance, reliability, and ultimately system catastrophic failure. Heat dissipation of 3D systems is highly nonuniform and nonunidirectional due to many factors such as power architectures, transistors packing density, and real estate available on the chip. In this study, the development of an experimental model of an active cooling method to cool a 25 W stack-dice to approximately 13°C utilizing a multidimensional configured thermoelectric will be presented.

Advanced Cooling of 3D ICs With Nanoparticle Packings

2017 ◽  
Author(s):  
Anil Yuksel ◽  
Paul S. Ho ◽  
Jayathi Murthy
Keyword(s):  
Thermal Resistance ◽  
Thermal Management ◽  
Heat Dissipation ◽  
Management Strategies ◽  
Liquid Cooling ◽  
The Third ◽  
3D Ics ◽  
Solution Methods ◽  
Surface Phonon Polariton ◽  
Third Dimension

Thermal-aware techniques for 3D ICs have shown that high temperatures dramatically reduce the lifetime and the reliability of the 3D ICs with utilizing the third dimension. Hence, thermal management has been very crucial for the further improvement of the 3D IC architecture. There has been some thermal management strategies suggested at the micro/nano scale to alleviate the nonlocal heat dissipation; however, many solution methods such as liquid cooling have challenges and create many problems. In this paper, we propose nanoparticle based interfacial cooling to improve the thermal transport due to surface phonon polariton coupling and to reduce the thermal resistance between the interfaces. We demonstrate the efficiency of the heat dissipation from the proposed structure for 3D ICs.

scholarly journals A Review of Literature on Various Techniques of COP Improvement in Vapor Compression Refrigeration System

2021 ◽  
Vol 9 (11) ◽  
pp. 1753-1759
Author(s):  
Anupam Mishra
Keyword(s):  
Power Consumption ◽  
Heat Dissipation ◽  
Water Mist ◽  
Nano Particles ◽  
Coefficient Of Performance ◽  
Small Scale ◽  
Vapor Compression ◽  
Refrigeration System ◽  
Nano Fluid ◽  
Vapor Compression Refrigeration

Abstract: This review paper is a study on various methods of performance improvement in domestic refrigeration systems, based on the vapor compression refrigeration VCRS cycle. Here air-cooled, water-cooled, fog cooled, evaporatively cooled condensers and nano-fluid lubricant /coolant methods their working and efficiency are reviewed, compared, analyzed and presented. The paper inspects the work done by different researchers for the maximization of heat loss from condenser & compressor and bringing about necessary modifications to reduce the overall power consumption of domestic refrigerators by improving Coefficient of Performance (COP). Numerous works have been done on improving the heat dissipation capacity of condenser but using nano-fluid in lubricant base as refrigerant and in the compressor shell as coolant is a new technology. Nano-fluid increase heat transfer due the high conductivity nano particles. It has been observed that water cooled condensers and compressors with nano-lubricants/coolants give the best performance improvements but they suit better for big or large refrigeration systems like centralized air conditioning systems or cold storage warehousing, whereas air cooled and evaporative condensers are optimal for small scale or low power appliances like domestic refrigerators, water coolers or split air conditioners to reduce overall power consumption by increasing the COP. Keywords: Refrigeration system, COP improvement, Condenser, Water mist, Evaporative cooling, Nano-fluid coolant, VCRS cycle.

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