Integration of Point Field Detectors Within Power Electronic Packages to Achieve Multifunctional Sensing

2013 ◽  
Author(s):  
J. D. Hoffman ◽  
B. A. Dow ◽  
R. D. Lorenz
Keyword(s):  
Junction Temperature ◽  
Electronic Packages ◽  
Strain Sensing ◽  
Element Analysis ◽  
Current Sensing ◽  
Point Field ◽  
High Bandwidth ◽  
Interconnect Design ◽  
Spatially Varying ◽  
Semiconductor Interconnects

The spatially varying magnetic field within a power electronics package contains information of the semiconductor junction temperature and the interconnect currents, temperature, displacement, and strain. The design of semiconductor interconnects for point field detector based high bandwidth current and strain sensing is investigated using finite element analysis (FEA) and verified by experimental results. High bandwidth (10MHz) current sensing was achieved by interconnect design based field shaping and concentration. A displacement sensing resolution of 0.6 μm was achieved by eddy current based high frequency field shaping. Design methodologies to achieve this multifunctional integration of sensing are the primary new contribution of this work.

Thermal Design of a Satellite Borne FPGA

2011 ◽  
Vol 52-54 ◽  
pp. 1411-1414 ◽  
Author(s):  
Bo Chen
Keyword(s):  
Finite Element Analysis ◽  
Finite Element ◽  
Heat Sink ◽  
Thermal Design ◽  
Junction Temperature ◽  
Element Analysis

Thermal design and analysis of a satellite borne FPGA is described in this paper. Thermal-conductive glue, vias and an aluminum bar were used to the FPGA and the PCB under the FPGA in order to help conduct the heat of the FPGA to heat sink. The results of finite element analysis showed that the case temperature of the FPGA decreased from 132.5°C to 55.4°C and the junction temperature decreased from 136.1°C to59.0 °C after the thermal design, which matches the requirements of thermal design.

Design and analysis of a dual-mode driven parallel XY micromanipulator for micro/nanomanipulations

2012 ◽  
Vol 226 (12) ◽  
pp. 3043-3057 ◽  
Author(s):  
Hui Tang ◽  
Yangmin Li ◽  
Jiming Huang
Keyword(s):  
Finite Element Analysis ◽  
Finite Element ◽  
Dynamic Properties ◽  
Dynamics Modeling ◽  
Lagrange Equations ◽  
Element Analysis ◽  
Modeling And Analysis ◽  
The Matrix ◽  
High Bandwidth ◽  
Novel Design

This article presents a novel design of a flexure-based, piezoelectric actuated, completely decoupled, high-bandwidth, highresolution, and large stroke parallel XY micromanipulator with two amplification levers. The monolithic mechanism is featured with dual working modes, which meets different kinds of requirements in terms of high resolution and large workspace in micro/nano fields. In order to reduce the displacement loss, the modeling and analysis of bending motion of the levers are conducted; thereafter, compliance and stiffness modeling by employing the matrix method are established. Furthermore, the dynamics modeling and analysis via Lagrange equations are performed to improve the dynamic properties of the mechanism. The simulation results of finite element analysis indicate that the cross-coupling between the two axes is kept to 1.2%; meanwhile, the natural frequency of the mechanism is about 700 Hz, and the amplifier ratio is approximately 2.32. Both theoretical analysis and finite element analysis results well validate the performance of the proposed mechanism.

Experiment and Numerical Analysis of the Residual Stresses in Underfill Resins for Flip Chip Package Applications

2005 ◽  
Vol 127 (1) ◽  
pp. 47-51 ◽  
Author(s):  
Man-Lung Sham ◽  
Jang-Kyo Kim
Keyword(s):  
Numerical Analysis ◽  
Residual Stresses ◽  
Integrated Circuit ◽  
Flip Chip ◽  
Coefficient Of Thermal Expansion ◽  
Flexural Modulus ◽  
Curing Temperature ◽  
Electronic Packages ◽  
Element Analysis ◽  
Plastic Package

Polymeric encapsulant is widely used to protect the integrated circuit chips and thus to enhance the reliability of electronic packages. Residual stresses are introduced in the plastic package when the polymer is cooled from the curing temperature to ambient, from which many reliability issues arise, including warpage of the package, premature interfacial failure, and degraded interconnections. Bimaterial strip bending experiment has been employed successfully to monitor the evolution of the residual stresses in underfrill resins for flip chip applications. A numerical analysis is developed to predict the residual stresses, which agree well with the experimental measurements. The changes of material properties, such as flexural modulus and coefficient of thermal expansion, of the resins with temperature are taken into account in the finite element analysis.

Design of a High-Bandwidth XY Nanopositioning Stage for High-Throughput Micro/Nano Manufacturing

2010 ◽  
Author(s):  
Sebastian Polit ◽  
Jingyan Dong
Keyword(s):  
Mechanism Design ◽  
High Throughput ◽  
Closed Loop ◽  
Open Loop ◽  
Dynamic Responses ◽  
Element Analysis ◽  
Loop Bandwidth ◽  
Decoupled Motion ◽  
High Bandwidth ◽  
Critical Requirement

A high natural frequency (open-loop bandwidth) is a critical requirement for nanopositioners in high-throughput nanomanufacturing and nano-metrology applications. This paper presents the design and analysis of a high-bandwidth nanopositioning XY stage. The monolithic stage design has two axes and each axis is comprised of a doubly-clamped beam and a parallelogram hybrid flexure with complaint beams and circular flexure hinges. The doubly-clamped beam that is actuated by a piezoelectric actuator acts as a linear prismatic axis. The parallelogram hybrid flexures are used to decouple the actuation effect from the other axis. The mechanism design decouples the motion in the X and Y directions and restricts parasitic rotations in the XY plane while allowing for an increased bandwidth with linear kinematics in the operating region (or workspace). Kinematic and dynamic analysis shows that the mechanical structure of the stage has decoupled motion in XY direction, while achieving high bandwidth and good linearity. Finite element analysis is adapted to verify the dynamic responses from theoretical analysis. The stage is actuated by piezoelectric stack actuators, and two capacitive gauges were added to the system to build a closed-loop positioning system. The results from frequency test show that the resonation frequencies of the two vibrational modes are over 8K Hz. The stage is capable of about 15 microns of motion along each axis with a resolution of about 1 nanometer. Due to parallel kinematic mechanism design, a uniform performance is achieved across the workspace. A PI controller is implemented for the stage and a high closed-loop bandwidth is obtained.

Submodeling Analysis for Path-Dependent Thermomechanical Problems

2004 ◽  
Vol 127 (2) ◽  
pp. 135-140 ◽  
Author(s):  
Tong Hong Wang ◽  
Yi-Shao Lai
Keyword(s):  
General Procedure ◽  
A Priori ◽  
Computational Cost ◽  
Structural Response ◽  
Accurate Solution ◽  
Electronic Packages ◽  
Element Analysis ◽  
Numerical Assessment ◽  
Chip Carrier ◽  
Path Dependent

In a finite element analysis, when localized behavior of a large model is of particular concern, generally one would refine the mesh until it captures the local solution adequately. Submodeling is an alternative way for solving this kind of problem. It provides a relatively accurate solution at a modest computational cost. For a valid submodeling analysis, the boundaries of the submodel should be sufficiently far away from local features so that St. Venant’s principle holds. Moreover, special treatments are required for solving problems that involve path-dependent characteristics. This paper presents a general procedure to perform submodeling analyses for path-dependent thermomechanical problems without a priori assumptions on the structural response. The procedure was benchmarked using a bimaterial strip and demonstrated through analyses on a bump chip carrier package assembly. The procedure is conducive to the numerical assessment of fatigue lives of electronic packages.

Development of Boundary Condition Independent Compact Thermal Models for Opto-Electronic Packages

2009 ◽  
Author(s):  
Arun Prakash Raghupathy ◽  
Attila Aranyosi ◽  
Urmila Ghia ◽  
Karman Ghia ◽  
William Maltz
Keyword(s):  
Boundary Condition ◽  
Design Methodology ◽  
Integrated Design ◽  
Physical Models ◽  
Junction Temperature ◽  
Electronic Packages ◽  
Active Components ◽  
Detailed Model ◽  
Heat Flows ◽  
Small Form Factor

In the current study, a network-based resistor model has been developed for thermal analysis of a complex optoelectronic package called SFP (Small Form-factor Pluggable Device). This is done using the DELPHI (DEvelopment of Libraries of PHysical models for an Integrated design) Methodology. The SFP is an optical transceiver widely used in telecommunication equipments such as switches and routers. The package has a detailed construction, and typically has four heat generating sources. The detailed model for the SFP is constructed and validated using a natural convection experiment. The validated detailed model is used for generating the Boundary-Condition-Independent (BCI) Compact Thermal Model (CTM). Codes for solving the network topology and interfacing with the optimization subroutine were written using Matlab 7. The resulting CTM is extensively validated with multiple boundary condition sets. The CTM for the SFP shows maximum relative of errors less than 10% for the junction temperature on all of its active components and less than 20% for the heat flows through its sides for extreme set of boundary conditions.

Sign in / Sign up

Export Citation Format

Share Document